CEO Interview with Jonathan Reeves of CSignumFor more than 30 years, Jonathan has successfully…Read More
CEO Interview with Shelly Henry of MooresLabAIShelly Henry is the CEO and Co-Founder of MooresLabAI,…Read More
New Cooling Strategies for Future ComputingPower densities on chips increased from 50-100 W/cm2…Read More
DAC News – proteanTecs Unlocks AI Hardware Growth with Runtime MonitoringAs AI models grow exponentially, the infrastructure supporting…Read More
A friend of SemiWiki published an article on Moore’s Law in IEEE that I think is worth reading:
The topic of Moore’s Law is of paramount importance, reaching almost the entire field of electronics (and the semiconductor industry). In the course of six decades, for the first… Read More
AI (artificial intelligence) is widely cited as a growth driver for the technology industry, including semiconductors. While AI is in its early stages, opinions vary on whether it will become common in the next few years. A McKinsey study from May 2024 showed 72% of organizations have adopted AI in at least one business function.… Read More
Most of the RISC-V action at the end of June was at the RISC-V Summit Europe, but not all. In fact, a group of well-informed and opinionated experts took over the Pavilion stage at the Design Automation Conference to discuss functional verification challenges for RISC-V and open-source IP.
Technology Journalist Ron Wilson and … Read More
2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More
As electric vehicles (EVs) gain widespread adoption, safety, reliability, and efficiency are becoming increasingly important. A crucial component in ensuring these aspects is the power module (PM), which manages the energy flow between the EV battery and the motor. The design of these power modules must not only meet the high-performance… Read More
Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.
AI – Lots of artificial… Read More
Signal Integrity (SI) and Power Integrity (PI) issues are critical to analyze, ensuring the proper operation of PCB systems and IC packages, yet the computational demands from EDA tools can cause engineers to only analyze what they deem are critical signals, instead of the entire system. Cadence has managed to overcome this SI/PI… Read More
You might think that in the sensing world all the action is in imaging and audio is a backwater. While imaging features continue to evolve, audio innovations may be accelerating even faster to serve multiple emerging demands: active noise cancellation, projecting a sound stage from multiple speakers, 3D audio and ambisonics,… Read More
As chip design complexity increases, integration scales expand and time-to-market pressures grow, as a result, design verification has become increasingly challenging. In multi-FPGA environments, the complexity of design debugging and verification further escalates, making it difficult for traditional debugging methods… Read More
The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
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Why I Think Intel 3.0 Will Succeed