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The Future Of Embedded Monitoring – February 2020

The Future Of Embedded Monitoring – February 2020
by Stephen Crosher on 02-14-2020 at 10:00 am

Stephen Crosher SemiWiki

Shall I compare thee to a…Rolls Royce jet engine?

‘There is a new era dawning whereby deeply embedded sensing within all technology will bring about great benefit for the reliability and performance of semiconductor-based products.’  These were my words during a presentation to an industry audience in China back in SeptemberRead More


Design Technology CoOptimization at SPIE 2020

Design Technology CoOptimization at SPIE 2020
by Daniel Nenni on 02-14-2020 at 6:00 am

DTCO Fig1 SPIE2020 Semiwiki

SLiC Library tool dramatically accelerates DTCO for 3nm and beyond

In advanced technology nodes below 10nm, Design and Process Technology development have become increasingly intertwined. In older nodes the traditional technology roll-out was done mostly in a sequential manner with clear geometry scaling targets set by … Read More


Savings Tip the Balance to EVs

Savings Tip the Balance to EVs
by Roger C. Lanctot on 02-13-2020 at 10:00 am

Savings Tip the Balance to EVs

In a rare and perhaps unfortunate moment of candor, Cruise Automation CEO Dan Ammann wrote, in his blog post describing the emergence of Cruise (a subsidiary of General Motors) that conventional internal combustion engine vehicles “break down relatively easily. And if they make it 150,000 miles, well, lucky you.”

Ammann goes… Read More


Thermal Reliability Challenges in Automotive and Data Center Applications – A Xilinx Perspective

Thermal Reliability Challenges in Automotive and Data Center Applications – A Xilinx Perspective
by Bernard Murphy on 02-13-2020 at 6:00 am

thermometer

I wrote recently on ANSYS and TSMC’s joint work on thermal reliability workflows, as these become much more important in advanced processes and packaging. Xilinx provided their own perspective on thermal reliability analysis for their unquestionably large systems – SoC, memory, SERDES and high-speed I/O – stacked within a … Read More


TinyML Makes Big Impact in Edge AI Applications

TinyML Makes Big Impact in Edge AI Applications
by Tom Simon on 02-12-2020 at 10:00 am

TimyML ECM3532 Architecture

Machine Learning (ML) has become extremely important for many computing applications, especially ones that involve interacting with the physical world. Along with this trend has come the development of many specialized ML processors for cloud and mobile applications. These chips work fine in the cloud or even in cars or phones,… Read More


De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue

De-Risking High-Speed RF Designs from Electromagnetic Crosstalk Issue
by Mike Gianfagna on 02-12-2020 at 6:00 am

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At DesignCon 2020, ANSYS sponsored a series of very high-quality presentations.  Some focused on advanced methods and new technology exploration and some provided head-on, practical and actionable capabilities to improve advanced designs. The presentation I will discuss here falls into the latter category. The topic was… Read More


Innovation in Verification – February 2020

Innovation in Verification – February 2020
by Bernard Murphy on 02-11-2020 at 6:00 am

Innovation in Verification

This blog is the next in a series in which Paul Cunningham (GM of the Verification Group at Cadence), Jim Hogan and I pick a paper on a novel idea in verification and debate its strengths and opportunities for improvement.

Our goal is to support and appreciate further innovation in this area. Please let us know what you think and please… Read More


Emerging Requirements for Electromagnetic Crosstalk Analysis

Emerging Requirements for Electromagnetic Crosstalk Analysis
by Tom Dillinger on 02-10-2020 at 10:00 am

EM coupling wire segments

This article will describe the motivations for pursuing a new flow in the SoC design methodology.  This flow involves the extraction, evaluation, and analysis of a full electromagnetic coupling model for a complex SoC and its package environment.  The results of this analysis highlight the impact of electromagnetic coupling… Read More


It’s The Small Stuff That Gets You …

It’s The Small Stuff That Gets You …
by Mike Gianfagna on 02-10-2020 at 6:00 am

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The last session I attended at DesignCon 2020 wasn’t a session at all. Rather it was an interactive discussion with Todd Westerhoff, product manager for electronic board systems at Mentor Graphics. Todd made some observations about the way high-performance PCBs are designed today and perhaps the way they should be designed. … Read More


The Tech Week that was February 3-7 2020

The Tech Week that was February 3-7 2020
by Mark Dyson on 02-09-2020 at 10:00 am

Semiconductor Weekly Summary 1

In a week where the new coronavirus and it’s impact has dominated the news, here is my weekly summary of the key semiconductor and technology news from around the world that you should know but may have missed.

The new coronavirus in China and worldwide is already causing an impact for the electronics supply chain, potentially affecting… Read More