At the 2025 RISC-V Summit, amid debates over cloud scaling and AI cost, DeepComputing CEO Yuning Liang offered a radical view: the future of intelligence isn’t in the cloud at all — it’s already in your pocket. His lunchtime conversation began with iPhones and ended with the death of the operating system. In between, he sketched … Read More
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI ConnectivityPCI Express (PCIe), PCIe switches, Time Division Multiplexing…Read More
DAC 2026 See Analog Bits TSMC N2P IP portfolio and meet with its engineering experts!Analog Bits, Inc. is an established provider of…Read More
Perforce Enabling Innovation Without Introducing Risk at DAC 2026Perforce delivers a DevOps Tech Stack for teams…Read More
Arteris at DAC 2026 Connecting Innovation for Silicon SuccessThe semiconductor industry has entered a new era…Read More
DAC 2026 Mach42: A new generation of physics-driven AI models for analog circuit verificationMach42 spun out of the Department of Physics…Read MoreSiemens to Deliver Industry-Leading PCB Test Engineering Solutions
Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More
Agentic EDA Panel Review Suggests Promise and Near-Term Guidance
NetApp recently hosted a webinar on Agentic AI as the future for EDA and implications for infrastructure. Good list of panelists including Mahesh Turaga (VP Cadence Cloud) with an intro preso on infrastructure and agentic AI at Cadence, then our own Dan Nenni (Mr. SemiWiki) moderating, Khaled Heloue (Fellow AMD, CAD CAD/Methodology/AI),… Read More
Hardware is the Center of the Universe (Again)
The 40-Year Evolution of Hardware-Assisted Verification — From In-Circuit Emulation to AI-Era Full-Stack Validation
For more than a decade, Hardware-Assisted Verification platforms have been the centerpiece of the verification toolbox. Today, no serious semiconductor program reaches tapeout without emulation or FPGA-prototyping… Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
The Name Changes but the Vision Remains the Same – ESD Alliance Through the Years
The Electronic System Design Alliance (ESDA) has been at the center of the EDA industry through its many changes over the years. It occurred to me that an update on this organization would be useful. ESDA is a technology community within SEMI and is managed primarily by a team of three who coordinate all its activities along with a … Read More
TSMC Process Simplification for Advanced Nodes
In the modern world, the semiconductor industry stands at the heart of technological innovation. From smartphones and laptops to advanced medical devices and artificial intelligence systems, nearly every piece of contemporary electronics depends on increasingly sophisticated microchips. Among the leading companies … Read More
CEO Interview with Juniyali Nauriyal of Photonect
Juniyali Nauriyal is the CEO and Co-Founder of Photonect, a photonics startup focused on commercializing advanced fiber-to-chip attachment technologies. Juniyali is the co-inventor of Photonect’s core technology, which forms the foundation of the company. As CEO, she leads Photonect in translating cutting-edge photonic… Read More
Podcast EP332: How AI Really Works – the Perspectives of Linley Gwennap
Daniel is joined by Linley Gwennap, technology analyst and author of the new book “How AI Really Works: The Models, Chips, and Companies Powering a Revolution.” Linley was the long-time editor of Microprocessor Report and chaired the popular Linley Processor Conferences.
Dan explores what impact AI is having on the market and… Read More
What is the 3nm Pessimism Wall and Why is it An Economic Crisis?
Chip design is getting more difficult as technology advances. Everyone knows that. A lot of the discussion around these issues tends to focus on the demands posed by massive AI workloads and the challenges of shifting to heterogeneous multi-die design. While these create real problems, there is an underlying effect that is making… Read More


TSMC CoWoS versus Intel EMIB Semiconductor Packaging