AJ Cooper is the Co-Founder and CEO of Itera, which developed the first-of-its-kind ‘fluid’ circuit board to make electronics physically programmable. Chips and software have been programmable for decades, but the interconnect between them has stayed fixed. By rewiring itself in real time, Itera’s board challenges
ChipAgents Expands AI Across Chip Design. The Test Is Faster, Verified ResultsChipAgents is expanding its agentic AI platform across…Read More
Why Synopsys’ Role in AMD’s Instinct MI455X Matters for AI InfrastructureSynopsys’ collaboration with AMD on the Instinct MI455X…Read More
S2C Targets Faster RISC-V Bring-Up With Prototyping and AIS2C showcased FPGA prototyping and AI-assisted debugging at…Read More
Accellera’s FSL 1.0 Gives Functional Safety Data a Common LanguageAccellera Systems Initiative has approved Functional Safety Language…Read More
Inside the Package Powering Modern AITSMC’s CoWoS-S is critical to the artificial intelligence…Read MoreInside the Silicon: Analog Bits N2P2 Test Chip
The future of intelligent computing depends on silicon that delivers more performance within tighter power and thermal limits. Combining TSMC’s advanced process technology with Analog Bits’ analog and mixed-signal expertise, we help designers address those demands through local power regulation, supply monitoring, precision… Read More
WEBINAR: Cut down EDA License cost by 25% with Stratos AI Nitro
Expensive EDA licenses should keep chip design moving. Yet when license activity and job queues live in separate systems, teams can struggle to understand why work is waiting, which tools are underused, and whether additional spending will solve the problem. Idle seats, checkout failures, and stalled jobs can consume budgets… Read More
Executive Interview with Victor Lopez of RaiderChip
Victor Lopez is Co-Founder and CTO at RaiderChip, with over 20 years of experience in FPGA and ASIC design. Throughout his career, he has led the development of semiconductor IP and custom hardware solutions licensed by international companies in sectors such as defense, aerospace, automotive and professional video, specializing… Read More
CEO Interview with Vincent Cobée of ITEN
Vincent Cobée is a global industrial executive with more than 30 years of leadership experience, most of it spent in the highly demanding automotive industry, where he built a successful track record leading large-scale international organizations, driving business transformation, and bringing innovative technologies… Read More
CEO Interview with Lisa Spelman of Cornelis
Lisa Spelman is CEO of Cornelis, where she leads the company’s efforts to advance high-performance networking for AI and HPC infrastructure. She brings more than 20 years of experience across AI, cloud, enterprise infrastructure, data center operations, product strategy, and go-to-market leadership.
Before joining Cornelis,… Read More
From Sequential R&D to Trusted Co-Innovation: The EPIC Model for Semiconductor Innovation
The semiconductor industry has long depended on collaboration between technology developers, equipment suppliers and manufacturers. But as artificial intelligence reshapes computing, established ways of working together may no longer be sufficient. The next wave of innovation will depend not just on what companies develop,… Read More
Strong Electronics Growth 2026
Growth in electronics production has been accelerating in 2026. Three-month-average change versus a year ago for electronics production in the U.S. was 8.1% in August 2026, continuing an accelerating growth trend since October 2025. Japan and the 27 countries of the European Union (EU 27) showed much stronger growth acceleration.… Read More
SEMICON West’s Autonomous Fab Vision Needs a Decision-Escalation Design
By Gleb Tsipursky
SEMICON West 2026’s smart-manufacturing agenda connected digital twins, agentic AI, physical AI, and increasingly autonomous factory operations. The final day included a session on automation and equipment for autonomous facilities. At its October CONNECT conference, PDF Solutions planned demonstrations… Read More
Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series
Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production testing. Its target… Read More


TSMC’s Patent and the Harsh Realities of 3D DRAM Competition