With the launch of its new P570 Gen 3 processor family, SiFive is making a broader statement about the future of edge computing and the growing role of RISC-V in mainstream application processors. Rather than simply unveiling another CPU core, the company is positioning the P570 as a balanced-performance processor built specifically… Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume FabsA deposition chamber drops out of production at…Read More
AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
Webinar: Faster Design Spec to Implementation using IP-XACTAs SoC design flows grow increasingly complex, IP-XACT…Read MoreConfigurable xSPI memory controller IP core is FuSa-ready
SPI, invented some four decades ago, is so successful as a low-pin-count interface for microcontrollers and processor cores that it spurred memory makers to incorporate both the physical signaling interface and advanced memory command protocols into serial flash and serial pseudo-SRAM (PSRAM) devices. Those protocols, … Read More
CEO Interview with Dr. Jekaterina Viktorova of Syenta
Dr. Jekaterina (Jeka) Viktorova is the CEO and Co-Founder of Syenta, an Australian deep-tech company developing breakthrough additive manufacturing technology for the semiconductor industry. With a background in chemistry, electrochemistry, and advanced manufacturing, she is the inventor of the core Syenta technology… Read More
Sensing. A Quantum Tech Ready for Market?
While the quantum world revolves around quantum computing, (QC) there are a couple of other quantum technologies of note. I covered one of these, quantum communication, in a recent blog. Here I’ll introduce the other, quantum sensing. The goal is to use the high sensitivity of an individual quantum state to external factors such… Read More
Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design
The semiconductor industry has spent decades optimizing tools. Today, however, the central challenge is no longer whether individual tools are powerful enough. The real question is whether increasingly specialized tools, domains, models, and organizations can still converge coherently into a manufacturable, reliable,… Read More
Thermal Reliability and Robustness of CMOS-Compatible GaN-on-Si MIS-HEMTs Under High-Temperature Stress
The continued evolution of semiconductor technologies has created a growing demand for devices capable of operating reliably under extreme conditions, particularly high temperatures. Among the most promising candidates for such applications are gallium nitride (GaN)-based high electron mobility transistors (HEMTs).… Read More
#DAC2026 Marks Another Pivotal Moment for the Semiconductor Industry
The 2026 Design Automation Conference (DAC 2026) marks another pivotal moment for the semiconductor and electronic systems industry as artificial intelligence, chiplets, heterogeneous integration, and system-level optimization redefine the future of design automation. Held July 26–29, 2026, at the Long Beach Convention… Read More
IPLM: Future Forward Webinar May 19th
Step into the future of semiconductor design management with IPLM: Future Forward, a product-led webinar showcasing the latest developments in Perforce IPLM. This focused session is designed to show how modern teams can tackle growing design complexity while still accelerating innovation.
Hosted by IPLM… Read More
From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past
Agentic AI is often presented as a revolutionary shift in semiconductor manufacturing, driven by large language models and generative AI. However, this framing overlooks an important reality: today’s advances are built on decades of prior work. As Jonathan Holt of PDF Solutions emphasizes in his recent keynote at the APCM 2026… Read More
Panel Discission: Beyond Moore’s Law and the Future of Semiconductor Manufacturing
The semiconductor industry is entering a post-Moore’s Law era in which scaling transistor density alone is no longer sufficient to sustain historical performance growth. As discussed in the panel Beyond Moore’s Law: The Future of Semiconductor Manufacturing, the industry is increasingly dependent on advanced manufacturing… Read More


Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?