The rapid evolution of artificial intelligence (AI) is transforming industries, from autonomous vehicles to data centers, demanding unprecedented computational power and efficiency. As highlighted in Synopsys’ guide, the global AI chip market is projected to reach $383 billion by 2032, growing at a 38% CAGR. This … Read More





Orchestrating IC verification: Harmonize complexity for faster time-to-market
By Marko Suominen and Slava Zhuchenya of Siemens Digital Industries Software.
It’s often said that an orchestra without a conductor is just a collection of talented individuals making noise. The conductor’s role is to transform that potential cacophony into a unified, beautiful symphony. The same concept holds… Read More
Basilisk at Hot Chips 2025 Presented Ominous Challenge to IP/EDA Status Quo
At Hot Chips 2025, Philippe Sauter of ETH Zürich presented Basilisk, a project that may redefine what’s possible with open-source hardware. Basilisk is a 34 mm² RISC-V SoC fabricated at IHP Microelectronics on its open-source 130nm BiCMOS process in Germany. Basilisk, named after the Greco-Roman mythical creature known… Read More
How AI Workloads Shape Hardware Architecture
The evolution of AI workloads has profoundly influenced hardware design, shifting from single-GPU systems to massive rack-based clusters optimized for parallelism and efficiency. As outlined in this Hot Chips 2025 tutorial, this transformation began with foundational models like AlexNet in 2012 and continues with today’s… Read More
Advancements in High-Density Front- and Backside Wafer Connectivity: Paving the Way for CMOS 2.0
In the rapidly evolving semiconductor landscape, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside technologies are reshaping the future of compute systems. As detailed in their article, these innovations transition CMOS 2.0 from a conceptual framework to practical reality, enabling denser,… Read More
Podcast EP305: On Overview of imec’s XTCO Program with Dr. Julien Ryckaert
Dan is joined by Dr. Julien Ryckaert who joined imec as a mixed-signal designer in 2000, specializing in RF transceivers, ultra-low power circuit techniques, and analog-to-digital converters. In 2010, he joined imec’s process technology division in charge of design enablement for 3DIC technology. Since 2013, he oversees… Read More
CEO Interview with Nir Minerbi of Classiq
Nir Minerbi is a co-founder and the CEO of Classiq. Nir is highly experienced in leading groundbreaking, multi-national technological projects, from idea to deployment. Nir is a Talpiot alumnus and a master’s graduate in physics as well as electrical and electronics engineering (M.Sc.).
Tell us about Classiq.
Classiq… Read More
GlobalFoundries 2025 Update GTS25
“GTS25 brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable GF to design the essential chips the world relies on to live, work and connect.”
GlobalFoundries (GF), a leading contract semiconductor manufacturer, plays an important… Read More
Perforce and Siemens at #62DAC
Wednesday was the last day at #62DAC for me and I attended an Exhibitor Session entitled, Engineering the Semiconductor Digital Thread, which featured Vishal Moondhra, VP Solutions Engineering of Perforce IPLM and Michael Munsey, VP Semiconductor Industry at Siemens Digital Industries. Instead of just talking from slides,… Read More
Synopsys Enables AI Advances with UALink
The evolution of hyperscale data center infrastructure to support the processing of trillions of parameters for large language models has created some rather substantial design challenges. These massive processing facilities must scale to hundreds of thousands of accelerators with highly efficient and fast connections.… Read More
Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools