Mechanical Engineer Intern

Responsibilities

• Develop thermal and mechanical models to solve challenging electronics packaging issues.
• Work within a multi-discipline project team to investigate and evaluate new electronics packaging technologies
• Document new designs and assemblies

Qualifications

• Working towards a degree in Mechanical Engineering or related field at an accredited university
• A strong interest in the mechanical design of electronics packaging
• Experience with 3D CAD (preferably Siemens NX)
• An understanding of various mechanical fabrication processes (machining, die casting, plastic molding, sheet metal) and engineering materials.
• Experience/interest with mechanical thermal and stress FEA analysis tools
• A self-starter with the ability to generate new ideas, navigate a dynamic environment and deliver results
  Strong foundation of engineering fundamentals
• Excellent written and verbal skills and ability to work across multiple disciplines

Candidates who wish to be considered must be enrolled in a accredited college/university as of September 2027. Applicants who have graduated before September 2027 will not be considered unless they are starting a MS or PHD program after graduating.

Visa Sponsorship is not available for this position. Candidates who now or at any point in the future require sponsorship for employment visa status (e.g., H-1B Visa status) may not be considered.

CO Pay Range: 

(Bachelors) $32.03-34.49

(Masters) $38.77-$41.75

(PhD) $47.76-$51.43

Note: For other locations, pay ranges will vary by region.

Based on experience, education and skills, most offers will be between the minimum and the midpoint of the Salary Range listed above.