1. 3DIC (CoWoS, InFO) backend technology reliability characterization and qualification.
2. Develop test method to characterize material and microstructure mechanical property.
3. Develop test method to characterize package reliability lifetime.
4. 3DIC package process problem identification & solving.
1. MS/Ph.D., Materials, Chemical, Mechanical Engineering or other related Engineering fields
2. Preferable with 5+ years of working experience in semiconductor BEOL integration, 3DIC backend integration, or Polymer material (Underfill, Molding compound, TIM, PI)
3. Good communication skill, team work spirit, and learning attitude.
4. English communication skill is necessary.
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To view the job application please visit tsmc.taleo.net.