Cell PI Engineer

Job Description

Intel Dalian Memory Technology and Manufacturing (DMTM) is high-volume manufacturing memory fab in Intel China working on leading edge 3D NAND product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel’s NAND memory and storage business. and Intel will continue to manufacture NAND wafers at the Dalian memory manufacturing until the final closing expected to occur in March 2025. Intel DMTM will continue to build on the success of our NAND technology at a greater scale, play a larger role in supporting our customers.

Defines roadmaps to meet requirements, goals and milestones for process improvement and yield improvement. Defines and establishes flow, procedures, and equipment configuration for the module. Extracts insights from structured and unstructured data by quickly synthesizing large volumes of data, and applying statistics and machine learning, and may using coding techniques (e.g. SQL, python, etc.) primarily, but could also include programming languages (i.e. .net). Owns sustaining and continuous improvement of quality and integrated defect and parametric measurements in startup and high volume manufacturing environment. Drives low yield analysis and yield improvement activities with both internal and external stakeholders. Ensures continuous improvement programs are in place to prevent quality, line yield, and sort yield excursions. Performs quality and reliability risk assessments for potentially discrepant manufacturing material as well as for process changes.

This position is associated with the sale of Intel’s NAND memory and storage business to SK. This transaction will enhance the resources and potential of the business’ storage, and you will be joining a world-class team that will transition to lead the SSD business at SK group. We will keep you informed updates and steps related to this transaction.

Qualifications

Must possess a MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry or Chemical Engineering. Additional qualifications include:Direct experiences in integration, device, yield analysis or process engineering organizations is required.Direct experience in 3D NAND technology development, transfer, ramping and sustaining is required.A proven history of technical problem solving through the creation of solutions that demonstrated creativity and out-of-box thinking.Excellent data extraction and analysis skills, and well versed in DOE principles.Understanding of device physics in deciphering parametric data, and understanding of fundamental integration and yield issues for key modules and critical device parameters are required.Ability to multi-task and be effective in providing timely solutions.Strong organizational and communication skills to manage tasks across Process Engineering areas to effectively execute and commit to deliverables.