Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
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DVCon is the premier conference on the application of languages, tools, and methodologies for the design and verification of electronic systems and integrated circuits. The focus of the conference is the usage of specialized design and verification languages such as SystemVerilog, Verilog, VHDL, PSS, SystemC and e, as well as general purpose languages such as …
Product reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of …
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Global platform for the embedded community The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, …
Electrical Overstress (EOS) and Electrostatic Discharge (ESD) account for most of the field failures observed in the electronics industry. Although EOS and ESD damage can at times look quite similar to each other, the source each and the solution can be quite different. Therefore, it is important to be able to distinguish between the two …
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About IRPS For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and …
SENSORIZATION: ENABLING A NEW INTELLIGENCE The MEMS and Sensors Executive Conference 2024 is designed for senior executives across the MEMS and sensors supply chain and adjacent industries. Industry economic, business updates will be covered from different aspects of the ecosystem, together with forward-looking strategic and technology trends. The opportunities and challenges brought about by key …
Make plans to share your work with other experts in April 2026 Present your research at the only cross-disciplinary event highlighting compelling optics and photonics technologies—from digital optics to quantum technologies to optical imaging, sensing, and metrology. Additional topics include THz photonics, 3D printed optics, photonic glasses, photosensitive materials, and biophotonics. Call for papers is …
Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test Call for Papers The DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in hardware and software design, test, and manufacturing of electronic circuits and systems. …
ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies. View the 2025 Agenda Advancing Semiconductor Manufacturing Excellence ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is …
VOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best …
Main Themes COMPUTEX is a leading global exhibition focused on AIoT and startups. The expo will continue with the position of “AI Next”, featuring the latest tech trends: AI & Robotics, Next-Gen Tech, and Future Mobility. Recognized for its adaptability to industry changes. It has established itself as a premier platform for showcasing technological innovations. …
New concepts and breakthroughs in VLSI processes and devices including Memory, Logic, I/O, and I/F (RF/Analog/MS, Imager, MEMS, etc.) - Advanced gate stack and interconnect in VLSI processes and devices - Advanced lithography and fine patternig technologies for high density VLSI - New functional devices beyond CMOS with a path for VLSI implantation - Packing …
We are excited to announce the 30th Automobil-Elektronik Kongress, set to take place on June 16 and 17, 2026 at the Forum am Schlosspark in Ludwigsburg, Germany. This prestigious technical conference will bring together industry experts, researchers, and innovators to discuss the latest advancements in automotive electronics. Join us to stay at the forefront of innovation …
