Webinar: Multiphysics Modeling of HBM for 3D Heterogeneous Integration

Memory access speeds are a performance bottleneck in today’s high- speed AI and HPC semiconductor designs. High Bandwidth Memory (HBM) in a 3D heterogeneous integrated (3DHI) system is the optimal solution to break through this “memory wall.” It can achieve data rates exceeding 1 TB/s, critical for AI and data center applications. However, integrating HBM with other chiplets on a single interposer brings significant multiphysics challenges. High power and local hotspots generate excessive heat causing mechanical stress, performance degradation, and reliability issues for HBM in a 3DHI environment. This webinar will explore these challenges and introduce innovative multiphysics modeling and simulation solutions.