Instance

Array
(
    [title] => Recent Forum Threads
    [title_url] => 
    [ignore_sticky] => 0
    [exclude_current] => 0
    [limit] => 10
    [sluglist] => ["jobs-dashboard"]
    [rw_opt] => Array
        (
            [widget_select] => 1
            [pageid_281769] => 1
            [pageid_281772] => 1
        )

    [display_widget_mobile] => 
    [rw_opt_exclude] => Array
        (
            [pageid_274493] => 1
            [cpt_podcast] => 1
            [cpta_podcast] => 1
            [category_16613] => 1
            [category_16631] => 1
            [taxonomy_series] => 1
            [pageid_354254] => 1
        )

    [node_id] => Array
        (
            [0] => 2
        )

)

Threads

Recent Forum Threads

Is this memory/compute structure a game changer?

latest reply by Xebec on October 19, 2026

started by Arthur Hanson on September 9, 2025
ASML says it cannot meet chip tool demand in 2027 or 2028

latest reply by Daniel Nenni on October 19, 2026

started by Daniel Nenni on October 18, 2026
Intel 14A pitches Rumour

latest reply by Fred Chen on October 19, 2026

started by siliconbruh999 on June 17, 2026
Intel Nova Lake die shots show TSMC N2P being used for compute die, 18A-P for SoC Hub and Peripheral dies

latest reply by siliconbruh999 on October 18, 2026

started by Fred Chen on October 18, 2026
Samsung to use TSMC technology for Nvidia's next-generation memory chips, Seoul newspaper reports

latest reply by blueone on October 18, 2026

started by Daniel Nenni on October 18, 2026
Pat Gelsinger: "HBM is a hideous memory"

latest reply by Daniel Nenni on October 18, 2026

started by Xebec on October 15, 2026
CXMT Announces new G5 platform enters mass production

latest reply by Fred Chen on October 18, 2026

started by tonyget on September 20, 2026
TeraFab: Rethinking Chip Manufacturing

latest reply by clarkchang on October 18, 2026

started by Daniel Nenni on October 12, 2026
Visiting Taiwan w/ Jensen Huang | Lex Fridman

latest reply by hist78 on October 17, 2026

started by hist78 on October 15, 2026
The $1,999 Question: Can Apple Bend the Market to Its Will?

latest reply by blueone on October 17, 2026

started by Daniel Nenni on September 11, 2026

Recent Article Comments

CEO Interview with Charlie Cheng of CEO of TeRAM
Is this their technology: https://patents.google.com/patent/US20180102161A1/en ?

— Fred Chen on October 18, 2026
Maskless EUV Lithography: An Alternative to E-Beam
Maybe ASML would be able to give it traction. They did have (but dropped) a maskless tool program. The EUV…

— Fred Chen on October 18, 2026
TSMC’s AI Expansion Signals a Broader Shift in Computing
Taking a step back, the global economy may be on the verge of the largest transition since the industrial revolution.…

— Mark M Stark on October 18, 2026
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
Terafab is not planned to be what you have put down here before the year 2031. The plan is only…

— Mark Webb on October 16, 2026
The silent killer of analog reliability: Why SPICE misses floating net
Great article describing an interesting and tricky problem. Rob - Siemens 3DIC ATM

— Rob McCance on October 11, 2026
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
I do not see TSMC buying 150 $750B systems for Hyper NA EUV unless it provides a big PPA delta.…

— Daniel Nenni on October 10, 2026
The Pivotal Moments That Gave Rise to Silicon Valley
Thanks, Subu! I am currently traveling in Switzerland (partly to visit Einstein's old haunts!) and just saw your message. Yes,…

— Sunil Mehta on October 10, 2026
The silent killer of analog reliability: Why SPICE misses floating net
Don't use SPICE, use smart modeling with AI - https://github.com/kev-cam/sv2ghdl/blob/main/bfit/benchmarks/perf.md MC simulation of blocks will give you behavioral models that…

— simguru on October 10, 2026
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
NA is not the determining factor for EUV lithography resolution anymore. That's why TSMC started EUV with double patterning. https://frederickchen.substack.com/p/resist-blur-the-real-resolution-limiter

— Fred Chen on October 10, 2026
The silent killer of analog reliability: Why SPICE misses floating net
Thanks for the paper/publication. The floating gate defect can also affect digital circuits in a similar way. (i.e., causing delay/margin…

— ChrisGar on October 8, 2026

« All Events

Tech Connect 2026

Name: Tech Connect 2026
Start: 2026-12-15T00:00:00-08:00
End: 2026-12-15T23:59:59-08:00
Location: Nikko Hotel

December 15

Co-organized by CEA-Leti and Soitec, the event invites you to step inside their lab-to-fab pipeline and discover the next advances in semiconductors, embedded AI, sequential 3D, FeRAM memory.

In an executive-level format, you will have the opportunity to:

• Connect and network with your peers
• Exchange directly with leading experts
• Explore the latest technology and market roadmaps

All in a refined and collaborative atmosphere designed to spark ideas and foster high-value connections.

REGISTER HERE

Share this post via:

Details

Date: December 15
Event Tags:cea-leti, embedded ai, feram, memory, san francisco, semiconductor, sequential 3d, soitec, tech connect
Website: https://www.leti-cea.com/cea-tech/leti/english/Pages/What's-On/Events/Tech-Connect-2026.aspx

Organizers

CEA-Leti
Soitec

Venue

Nikko Hotel
Nikko Hotel, 222 Mason St.
San Francisco, CA 94102 United States + Google Map

CEO Interview with Charlie Cheng of CEO of TeRAM
Is this their technology: https://patents.google.com/patent/US20180102161A1/en ?

— Fred Chen on October 18, 2026
Maskless EUV Lithography: An Alternative to E-Beam
Maybe ASML would be able to give it traction. They did have (but dropped) a maskless tool program. The EUV…

— Fred Chen on October 18, 2026
TSMC’s AI Expansion Signals a Broader Shift in Computing
Taking a step back, the global economy may be on the verge of the largest transition since the industrial revolution.…

— Mark M Stark on October 18, 2026
Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume
Terafab is not planned to be what you have put down here before the year 2031. The plan is only…

— Mark Webb on October 16, 2026
The silent killer of analog reliability: Why SPICE misses floating net
Great article describing an interesting and tricky problem. Rob - Siemens 3DIC ATM

— Rob McCance on October 11, 2026
Hyper-NA EUV: The Next Frontier in Chipmaking Could Arrive in 2036
I do not see TSMC buying 150 $750B systems for Hyper NA EUV unless it provides a big PPA delta.…

— Daniel Nenni on October 10, 2026
The Pivotal Moments That Gave Rise to Silicon Valley
Thanks, Subu! I am currently traveling in Switzerland (partly to visit Einstein's old haunts!) and just saw your message. Yes,…

— Sunil Mehta on October 10, 2026
The silent killer of analog reliability: Why SPICE misses floating net
Don't use SPICE, use smart modeling with AI - https://github.com/kev-cam/sv2ghdl/blob/main/bfit/benchmarks/perf.md MC simulation of blocks will give you behavioral models that…

— simguru on October 10, 2026

Search Semiwiki

Recent Forum Threads

Recent Article Comments

Recent Podcast Episodes

Tech Connect 2026

Details

Organizers

Venue

Trending Now

Google Translate

Recent Forum Threads

Recent Article Comments