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One of the career Intel employees (33+ years) that Pat Gelsinger brought back is Stuart Pann. Stuart is now the Senior Vice President of the Intel Corporate Planning Group. He does not have direct foundry experience but he certainly knows Intel and Pat so it will be interesting to see where this goes.
Stuart recently penned an article… Read More
It’s all about bandwidth these days – fueling hyperscale data centers that support high-performance and cloud computing applications. It’s what enables you to stream a movie on your smart TV while your roommate plays an online game with friends located in different parts of the country. It’s what makes big data analytics run swiftly… Read More
If I ask the question, “What has grown 4,000x over the last twenty-five years?”, most people will start throwing names of some stocks. Although various stock markets have had crazy run ups and yes, there is a stock that has grown 2,500x over that period of time, the answer to the 4,000x question is not a stock. What if I modify the question… Read More
There’s no question that chip designs are getting more complex, driven by the power, performance, and area (PPA) demands of applications like artificial intelligence (AI), automotive, and cloud computing. This complexity, of course, trickles down to the design and testbench code. When engineers can find and fix bugs before… Read More
Over the last decade or so, the automotive industry has been rapidly adopting and deploying innovative and revolutionary technologies in automobiles. One such revolution is the autonomous vehicle technology. While this technology is not fully mature yet, some components of this technology are. Many late model automobiles… Read More
In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More
The move to true 3D IC, monolithic 3D SOC and 3D heterogeneous integration may require one of the most major design tool architecture overhauls since IC design tools were first developed. While we have been taking steps toward 3DIC with 2.5D designs with interposers, HBM, etc., the fundamental tools and flows remain intact in many… Read More
Automotive segment is a market that has historically been supported by a few select suppliers within the semiconductor ecosystem. Over the last decade, this market has transitioned from just being about reliability, performance, fuel efficiency, etc., to placing equal importance to user experience. This user experience … Read More
If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More
The continued innovation and widespread adoption of connected devices — the internet of things (IoT) — has resulted in a vast range of conveniences that improve our lives every day. At the same time, the ubiquity of IoT devices, which market watchers estimate to be in the tens of billions, also makes it more attractive to bad actors… Read More
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