WP_Term Object
(
    [term_id] => 24
    [name] => TSMC
    [slug] => tsmc
    [term_group] => 0
    [term_taxonomy_id] => 24
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 612
    [filter] => raw
    [cat_ID] => 24
    [category_count] => 612
    [category_description] => 
    [cat_name] => TSMC
    [category_nicename] => tsmc
    [category_parent] => 158
    [is_post] => 
)
            
TSMC Banner 2023
WP_Term Object
(
    [term_id] => 24
    [name] => TSMC
    [slug] => tsmc
    [term_group] => 0
    [term_taxonomy_id] => 24
    [taxonomy] => category
    [description] => 
    [parent] => 158
    [count] => 612
    [filter] => raw
    [cat_ID] => 24
    [category_count] => 612
    [category_description] => 
    [cat_name] => TSMC
    [category_nicename] => tsmc
    [category_parent] => 158
    [is_post] => 
)

TSMC’s 2026 AZ Exclusive Experience Day: Bridging Careers and Semiconductor Innovation

TSMC’s 2026 AZ Exclusive Experience Day: Bridging Careers and Semiconductor Innovation
by Daniel Nenni on 02-02-2026 at 8:00 am

TSMC AZ Day FAB 21

In February of 2026, Taiwan Semiconductor Manufacturing Company (TSMC) will host the TSMC AZ Exclusive Experience Day in Phoenix, Arizona, offering selected participants a rare opportunity to engage directly with one of the most advanced semiconductor manufacturing organizations in the world. The event will serve as an immersive… Read More


The Foundry Model Is Morphing — Again

The Foundry Model Is Morphing — Again
by Jonah McLeod on 01-29-2026 at 10:00 am

SIP Market

When Morris Chang left Texas Instruments in 1983 to found TSMC, he was not merely starting a new company—he was proposing a new industrial logic. Chang recognized that semiconductor manufacturing had become so capital-intensive that it could no longer survive as just one function inside a vertically integrated company.… Read More


The Chronicle of TSMC CoWoS

The Chronicle of TSMC CoWoS
by Daniel Nenni on 01-28-2026 at 10:00 am

Chronical of CoWoS

As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More


TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth

TSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth
by Daniel Nenni on 01-25-2026 at 12:00 pm

TSMC's CoWoS® Sustainability

In a significant example of how high-tech manufacturing can embrace environmental stewardship without compromising operational excellence, Taiwan Semiconductor Manufacturing Company has launched a sustainability initiative within its advanced packaging operations that both reduces waste and generates meaningful… Read More


Addressing Silent Data Corruption (SDC) with In-System Embedded Deterministic Testing

Addressing Silent Data Corruption (SDC) with In-System Embedded Deterministic Testing
by Daniel Nenni on 01-01-2026 at 10:00 am

Siemens Broadcom TSMC OIP2025 SemiWiki

Silent Data Corruption (SDC) represents a critical challenge in modern semiconductor design, particularly in high-performance computing environments like AI data centers. As highlighted in a collaborative presentation by Broadcom Inc. and Siemens EDA at the 2025 TSMC OIP event, SDC occurs when hardware defects cause erroneous… Read More


TSMC’s 6th ESG AWARD Receives over 5,800 Proposals, Igniting Sustainability Passion

TSMC’s 6th ESG AWARD Receives over 5,800 Proposals, Igniting Sustainability Passion
by Daniel Nenni on 01-01-2026 at 6:00 am

TSMC ESG Award Ceremony 2025

Taiwan Semiconductor Manufacturing Company has once again demonstrated its leadership in corporate sustainability with the successful conclusion of its 6th ESG AWARD, which attracted more than 5,800 proposals from employees across the organization. The overwhelming response reflects not only TSMC’s strong internal engagement… Read More


TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!

TSMC based 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months!
by Daniel Nenni on 12-31-2025 at 6:00 am

Synopsys Socionext 3d IC

Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More


Why TSMC is Known as the Trusted Foundry

Why TSMC is Known as the Trusted Foundry
by Daniel Nenni on 12-26-2025 at 6:00 am

TSMC Ivey Fab

Taiwan Semiconductor Manufacturing Company (TSMC) is widely regarded as the world’s most trusted semiconductor foundry, a reputation built over decades through technological leadership, business model discipline, operational excellence, and reliability. In an industry where trust is as critical as transistor density,… Read More


TSMC’s Customized Technical Documentation Platform Enhances Customer Experience

TSMC’s Customized Technical Documentation Platform Enhances Customer Experience
by Daniel Nenni on 12-24-2025 at 10:00 am

TSMC Online 2025

Taiwan Semiconductor Manufacturing Company, the world’s leading dedicated semiconductor foundry, has long prioritized customer-centric innovation to maintain its competitive edge in a rapidly evolving industry. TSMC is known as “The Trusted Foundry” for this reason.

Amid increasing complexity in… Read More


A Brief History of TSMC Through 2025

A Brief History of TSMC Through 2025
by Daniel Nenni on 12-22-2025 at 10:00 am

About TSMC 2025

Taiwan Semiconductor Manufacturing Company, the world’s largest dedicated semiconductor foundry, has transformed from a modest startup into a global technology powerhouse. Founded on February 21, 1987, by Morris Chang, a veteran of Texas Instruments, TSMC pioneered the “pure-play” foundry model. … Read More