Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More
The ASIC Business Model is Critical for the DIY and Maker Movements!
If you look back at the beginning of the ASIC business you will see that it was really a critical time in the semiconductor industry. It all began in the 1980s which coincidentally is when I started my career in Silicon Valley. General purpose integrated circuits ruled the market, forcing system designers to cobble together off-the-shelf… Read More
Semiconductor capital spending slow in 2016
The outlook for semiconductor capital expenditures (capex) in 2016 is weak. Gartner’s January 2016 forecast called for a decline of 4.7%. IC Insights in February projected a 0.8% decline. The table below shows the Gartner forecast along with the capex forecasts from the top three spenders (Intel, Samsung and TSMC) which… Read More
2.5D supply chain takes HBM over the wall
SoC designers have hit the memory wall head on. Although most SoCs address a relatively small memory capacity compared with PC and server chips, memory power consumption and bandwidth are struggling to keep up with processing and content expectations. A recent webinar looks at HBM as a possible solution.… Read More
Fit-for-purpose IoT ASICs are about more than cost
We’ve been saying for a while that it looks like there is a resurgence in design starts for ASICs targeting the IoT. A recent webinar featuring speakers from ARM and Open Silicon (and moderated by Daniel Nenni) affirms this trend, and provides some insight on how these designs may differ from typical microcontrollers.
One of my first… Read More
Shifting Asia Electronics Production
Japan emerged as the largest supplier of consumer electronics in the 1980s. The Japan surge was driven by lower cost labor than in the U.S. and Europe as well as innovative products from companies such as Sony, Toshiba and Panasonic (formerly Matsushita). By the 1990s much consumer electronics production shifted to South Korea… Read More
How HBM Will Change SOC Design
High Bandwidth Memory (HBM) promises to do for electronic product design what high-rise buildings did for cities. Up until now, electronic circuits have suffered from the equivalent of suburban sprawl. HBM is a radical transformation of memory architecture that will have huge ripple effects on how SOC based electronics are … Read More
Upcoming ARM & Open-Silicon Webinar on Custom SOC’s for IoT
IoT products call for a higher level of system integration than ever before. Companies seeking to go to market now have a much higher bar in terms of size, power, reliability and manufacturability. The first IoT devices evolved from embedded development boards, like the groundbreaking Arduino. These were fine for prototypes … Read More
Accellera and Portable Stimulus
I’ll start with a quick note on DVCon. This seems to be gaining momentum each year. In addition to the events in the US, Europe and India, a DVCon event is now planned for China, kicking off in Shanghai in 2017. At a time when we’re all bemoaning the future of EDA and EDA conferences, DVCon is booming internationally, no doubt reflecting… Read More
Start Your HBM 2.5D Design Today!
Next week there is a live seminar at the famed Computer Museum in Silicon Valley that you won’t want to miss. If you haven’t been to the Computer Museum here is what you are missing:… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot