Veriest held a recent meetup on a topic that has always made me curious – use of Python in verification. The event, moderated by Dusica Glisic (technical marketing manager at Veriest), started with an intro from Moshe Zalcberg (CEO of Veriest) and talks by Avidan Efody (Apple verification) and Tamás Kállay (Team leader, Veriest).… Read More
Can Intel Catch TSMC in 2025?
At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.
ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More
DUV, EUV now PUV Next gen Litho and Materials Shortages worsen supply chain
-New PUV light source will push litho into Angstrom Era
-Rare earth elements shortages add to supply chain woes
-Could strategic wafer reserve releases lower memory pricing
-Can we cut off/turn off Russian access to chip equipment?
DUV, EUV and now “PUV” to become next generation lithography
Lithography is the locomotive… Read More
CEO Interview: Kelly Peng of Kura Technologies
This interview is with Kelly Peng, Co-founder, and CEO of Kura Technologies. Kura Gallium, Kura’s first product, was named Best of CES 2022 and received a 2022 CES Innovation Award as well. Kelly is an inventor, engineer and entrepreneur that leads a team of dedicated innovators that are redefining the term “Augmented Reality”.… Read More
Electronics, COVID-19, and Ukraine
The outlook for electronics and semiconductors in 2022 is uncertain. Just as the world was returning to more normal conditions after (hopefully) the worst of the COVID-19 pandemic is over, Russia invaded Ukraine in February.
The International Monetary Fund (IMF) in a March 15 blog post asserted the Russian invasion of Ukraine… Read More
The EUV Divide and Intel Foundry Services
The EUV Divide
I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.
If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More
Alphawave IP and the Evolution of the ASIC Business
Alphawave IP has agreed to acquire OpenFive, a SiFive business unit (formerly Open-Silicon) for $210m in cash. Having spent many years in the ASIC business which included working with Open-Silicon, Alphawave, and OpenFive here is my perspective on the acquisition:
This acquisition accomplishes two things: First it trims down… Read More
CEO Interview: Aki Fujimura of D2S
Curvilinear Design Primer for Design, Packaging Communities
This interview was done by Bob Smith, Executive Director, ESD Alliance, a SEMI Technology Community.
Previously, Fujimura served as CTO at Cadence Design Systems and returned to Cadence for the second time through the acquisition of Simplex Solutions where he was… Read More
Semiconductor Packaging History and Primer
From DIP to Advanced, semiconductor packaging has become strategic
For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek
Semiconductor Capital Equipment Series: Introduction
Semicap is in some ways the unsung hero of American global dominance in semiconductors. The US punches above its weight in terms of market share compared to demand, but specifically in three categories. EDA, IP, and Equipment.
I hope to write about everything there can be said about semiconductors, and EDA is a place I understand… Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency