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Python in Verification. Veriest MeetUp

Python in Verification. Veriest MeetUp
by Bernard Murphy on 04-13-2022 at 6:00 am

Python

Veriest held a recent meetup on a topic that has always made me curious – use of Python in verification. The event, moderated by Dusica Glisic (technical marketing manager at Veriest), started with an intro from Moshe Zalcberg (CEO of Veriest) and talks by Avidan Efody (Apple verification) and Tamás Kállay (Team leader, Veriest).… Read More


Can Intel Catch TSMC in 2025?

Can Intel Catch TSMC in 2025?
by Scotten Jones on 04-11-2022 at 6:00 am

Slide6

At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.

ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More


DUV, EUV now PUV Next gen Litho and Materials Shortages worsen supply chain

DUV, EUV now PUV Next gen Litho and Materials Shortages worsen supply chain
by Robert Maire on 04-01-2022 at 8:00 am

EUV DUV Lithography

-New PUV light source will push litho into Angstrom Era
-Rare earth elements shortages add to supply chain woes
-Could strategic wafer reserve releases lower memory pricing
-Can we cut off/turn off Russian access to chip equipment?

DUV, EUV and now “PUV” to become next generation lithography

Lithography is the locomotive… Read More


CEO Interview: Kelly Peng of Kura Technologies

CEO Interview: Kelly Peng of Kura Technologies
by Daniel Nenni on 04-01-2022 at 6:00 am

Kelly Peng, Co-founder, and CEO of Kura Technologies

This interview is with Kelly Peng, Co-founder, and CEO of Kura Technologies. Kura Gallium, Kura’s first product, was named Best of CES 2022 and received a 2022 CES Innovation Award as well. Kelly is an inventor, engineer and entrepreneur that leads a team of dedicated innovators that are redefining the term “Augmented Reality”.… Read More


Electronics, COVID-19, and Ukraine

Electronics, COVID-19, and Ukraine
by Bill Jewell on 03-25-2022 at 6:00 am

Electronics Production 2022

The outlook for electronics and semiconductors in 2022 is uncertain. Just as the world was returning to more normal conditions after (hopefully) the worst of the COVID-19 pandemic is over, Russia invaded Ukraine in February.

The International Monetary Fund (IMF) in a March 15 blog post asserted the Russian invasion of Ukraine… Read More


The EUV Divide and Intel Foundry Services

The EUV Divide and Intel Foundry Services
by Scotten Jones on 03-23-2022 at 10:00 am

Intel IDM 2.0 Process Roadmap
The EUV Divide

I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.

If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More


Alphawave IP and the Evolution of the ASIC Business

Alphawave IP and the Evolution of the ASIC Business
by Daniel Nenni on 03-21-2022 at 6:00 am

Alphawave IP OpenFive

Alphawave IP has agreed to acquire OpenFive, a SiFive business unit (formerly Open-Silicon) for $210m in cash. Having spent many years in the ASIC business which included working with Open-Silicon, Alphawave, and OpenFive here is my perspective on the acquisition:

This acquisition accomplishes two things: First it trims down… Read More


CEO Interview: Aki Fujimura of D2S

CEO Interview: Aki Fujimura of D2S
by Daniel Nenni on 03-18-2022 at 6:00 am

ESD Alliance D2S Blog Post Image 1 1

Curvilinear Design Primer for Design, Packaging Communities

This interview was done by Bob Smith, Executive Director, ESD Alliance, a SEMI Technology Community.

Previously, Fujimura served as CTO at Cadence Design Systems and returned to Cadence for the second time through the acquisition of Simplex Solutions where he was… Read More


Semiconductor Packaging History and Primer

Semiconductor Packaging History and Primer
by Doug O'Laughlin on 03-09-2022 at 10:00 am

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From DIP to Advanced, semiconductor packaging has become strategic

For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek

Read More

Semiconductor Capital Equipment Series: Introduction

Semiconductor Capital Equipment Series: Introduction
by Doug O'Laughlin on 03-06-2022 at 10:00 am

Semiconductor Capital Equipment Series 1

Semicap is in some ways the unsung hero of American global dominance in semiconductors. The US punches above its weight in terms of market share compared to demand, but specifically in three categories. EDA, IP, and Equipment.

I hope to write about everything there can be said about semiconductors, and EDA is a place I understand… Read More