You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please,
join our community today!
WP_Term Object
(
[term_id] => 386
[name] => Semiconductor Services
[slug] => semiconductor-services
[term_group] => 0
[term_taxonomy_id] => 386
[taxonomy] => category
[description] =>
[parent] => 0
[count] => 1115
[filter] => raw
[cat_ID] => 386
[category_count] => 1115
[category_description] =>
[cat_name] => Semiconductor Services
[category_nicename] => semiconductor-services
[category_parent] => 0
[is_post] =>
)
At the GSA Silicon Summit this afternoon there was a discussion of 3D IC and 2.5D IC. The session was moderated by Javier DeLaCruz of eSilicon and the panelists were:
- Calvin Cheung of ASE (an OSAT)
- Gil Lvey of OptimalTest (a test house)
- Bob Patti of Tezzaron (semiconductor company specializing in TSV-based designs)
- Riko Radojcic
…
Read More
I’m at the GSA Silicon Summit today, at the computer history museum. The first panel session this morning was about future process technology. It was moderated by Joe Sawicki of Mentor with a panel consisting of Rob Aitken from ARM, Paul Farrar of G450C, Peter Huang of TSMC, John Kibarian of PDF Solutions and someone from Applied… Read More
On April 18, 2014 in Monterey California there will be a series of discussions on the challenges of IP reuse. These discussions are part of the 2014 Electronic Design Process Symposium (EDPS). Representatives from IP, ASIC, foundry and EDA will weigh in the challenges and issues. Here is a preview of one of the presentations from… Read More
On the television show “Home Improvement”, Tim Allen’s character always sought “more power” for whatever project he was working on. The theme of the Applied Power Electronics Conference and Exposition (APEC) 2014 could have been “less power”. APEC 2014 featured five days of seminars and sessions including professional education,… Read More
Coming up on April 10th is the SEMI Silicon Valley Breakfast Forum Internet of Things—Driving the Microelectronics Revolution. It runs from 7am to 10.45am and will be held at SEMI Headquarters which is at 3081 Zanker Road in San Jose.
Widespread adoption of the Internet of Things will take time, but the movement is advancing thanks… Read More
The annual GSA Silicon Summit is coming up in a few weeks. It is on April 10th at the Computer History Museum. Registration is at 9am and the meeting itself gets started at 9.45am. The summit finishes at 2.15pm. There are three sections during the day, and lunch is provided.
The first section is on Advancements in Nanoscale Manufacturing… Read More
As I blogged about recently, eSilicon have completely automated the quote process for their MPW shuttle service. You can use an online interface that runs in the browser but there is also an app that you can download from the App Store.
So I decided I had a few million dollars to burn and I’d get myself my very own TSMC 20nm parts.… Read More
SEMICON is not just the event in San Francisco every July, there are other SEMICONs around the world. Coming up next, Shanghai China. In fact there are four colocated events:
- SEMICON China 2014, March 18th-20th
- The 8th PV fab managers’ forum, March 17th-18th (all things PhotoVoltaic)
- FPD China 2014, March 18th-20th (all
…
Read More
The fourth quarter 2013 semiconductor market declined 0.8% from the third quarter, according to World Semiconductor Trade Statistics (WSTS). Full year 2013 growth was 4.8%. Our most recent 2013 forecast at Semiconductor Intelligence was 6% in November 2013, based on expectations of positive growth in 4Q 2013. Who had the most… Read More
Every ASIC company has a major challenge: they have to work out what it is going to cost to build the customer’s product and commit to deliver it at that price. Too high and you lose the business. Too low and you will wish you’d lost the business. Historically this has been done largely manually. This is an expensive process.… Read More
Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys