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Should Intel be Split in Half?

Should Intel be Split in Half?
by Daniel Nenni on 08-11-2025 at 6:00 am

Intel Should Not Be Split!

A recent commentary from four former Intel board members argue that Intel should be split into two separate companies with separate CEOs and separate board of directors. Charlene BarshefskyReed HundtJames Plummer, and David Yoffie wrote that Intel shareholders should insist on a split which would create a new, independent,… Read More


Making Intel Great Again!

Making Intel Great Again!
by Daniel Nenni on 08-08-2025 at 6:00 am

Intel 3.0 Logo SemiWiki

Lip-Bu Tan made it very clear on his most recent call that Intel will not continue to invest in leading edge semiconductor manufacturing solo. Lip-Bu is intimately familiar with TSMC and that is the collaborative business model he envisions for Intel Foundry. I support this 100%. Intel and Samsung have tried to compete head-to-head… Read More


Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani

Podcast EP300: Next Generation Metalization Innovations with Lam’s Kaihan Ashtiani
by Daniel Nenni on 07-30-2025 at 10:00 am

Dan is joined by Kaihan Ashtiani, Corporate Vice President and General Manager of atomic layer deposition and chemical vapor deposition metals in Lam’s Deposition Business Unit. Kaihan has more than 30 years of experience in technical and management roles, working on a variety of semiconductor tools and processes.

Dan explores… Read More


Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside

Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside
by Robert Maire on 07-29-2025 at 6:00 am

Elon Musk Samsung Tesla

– Musk chip lifeline to Samsung comes with interesting strings attached
– Musk chose Samsung over Intel-What does that say about Intel?
– Musk will hold sway over Samsung much as Apple/NVDA over TSMC
– Will Musk do a “DOGE” on chip tool makers? How much influence?

Tesla/Samsung $16.5B deal
Read More

Why I Think Intel 3.0 Will Succeed

Why I Think Intel 3.0 Will Succeed
by Daniel Nenni on 07-28-2025 at 6:00 am

Intel 3.0 Logo SemiWiki

Probably one of the most anticipated semiconductor investor calls was held last week and it did not disappoint. It was Lip-Bu Tan’s first full quarter since he took over as CEO. In the resulting discussions on the SemiWiki Forum I am viewed as overly optimistic of Intel’s recent pivot. That is true, I am optimistic, but my observations… Read More


Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap

Alchip Launches 2nm Design Platform for HPC and AI ASICs, Eyes TSMC N2 and A16 Roadmap
by Daniel Nenni on 07-22-2025 at 6:10 am

Alchip TSMC N2 announcement SemiWiki

Alchip Technologies, a global leader in high-performance computing (HPC) and AI infrastructure ASICs, has officially launched its 2nm Design Platform, marking a major advancement in custom silicon design. The company has already received its first 2nm wafers and is collaborating with customers on the development of high-performance… Read More


Certus Semiconductor at the 2025 Design Automation Conference #62DAC

Certus Semiconductor at the 2025 Design Automation Conference #62DAC
by Daniel Nenni on 06-15-2025 at 10:00 am

62nd DAC SemiWiki

Certus Semiconductor Brings High-Performance Custom I/O and ESD IP to DAC 2025

Certus Semiconductor, a trusted leader in custom I/O and ESD solutions, will exhibit at booth #1731 during DAC 2025, June 23–27 in San Francisco. Known for its robust, customer-proven IP tailored for challenging applications, Certus will highlight… Read More


Anirudh Fireside Chats with Jensen and Lip-Bu at CadenceLIVE 2025

Anirudh Fireside Chats with Jensen and Lip-Bu at CadenceLIVE 2025
by Bernard Murphy on 06-04-2025 at 6:00 am

Anirudh with Jensen and Lip Bu

Anirudh (Cadence President and CEO) had two fireside chats during CadenceLIVE 2025, the first with Jensen Huang (Founder and CEO of NVIDIA) to kick off the show, and later in the day with Lip-Bu Tan (CEO of Intel). Of course Jensen and Lip-Bu also turn up for other big vendor shows but I was reminded that there is something special about… Read More


Podcast EP289: An Overview of How Highwire Helps to Deliver Advanced Fabs with Less Cost, Time and Risk with David Tibbetts

Podcast EP289: An Overview of How Highwire Helps to Deliver Advanced Fabs with Less Cost, Time and Risk with David Tibbetts
by Daniel Nenni on 05-30-2025 at 6:00 am

Dan is joined by David Tibbetts, Chief Safety Officer at Highwire. David is a Certified Safety Professional with 20+ years of occupational safety experience in both general industry and construction settings. He is currently supporting Highwire’s hiring partners utilizing the Highwire suite of software solutions … Read More


Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies

Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
by Kalar Rajendiran on 05-28-2025 at 10:00 am

Sassine Holding an 18A Test chip

Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More