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In December 2023, we published the Intel Revenue forecast for external wafer sales, gave a breakdown on how customers plan to ramp the foundry. The forecast is still valid (it assumes Intel executes on all plans) but since then we have a better understanding of Intel’s strategy and scenarios that could unfold.
The scenarios… Read More
On Wednesday, February 21st Intel held their first Foundry Direct Connect event. The event had both public and NDA sessions, and I was in both. In this article I will summarize what I learned (that is not covered by NDA) about Intel’s business, process, and wafer fab plans (my focus is process technology and wafer fabs).
Business
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Read More
For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.
To understand logic, I believe it is useful to understand what makes… Read More
There are trillions of dollars at stake with AI and huge geopolitical consequences. However, the weak foundation to American technological power is their dependence on Taiwan and TSMC, which is where most advanced silicon is manufactured. America has also been taking China to the ropes lately in their economic/technology proxy… Read More
The ambitious United Nations Sustainable Development Goals (SDGs), from reducing food waste to enhancing global healthcare access, hinge on a connected world where every object whispers valuable data. As technology strives to address environmental challenges, healthcare needs, and promote responsible consumption, traditional… Read More
You might not immediately see a connection between semiconductor substrate choices and inference at the edge. These technology layers seem worlds apart and yet SOITEC have a point. Edge AI has rapidly evolved from simple CNNs to now complex reinforcement learning systems and transformer based LLMs. Even when shrunk to edge footprints,… Read More
Chiplets (die stacking) is not new. The origins are deeply rooted in the semiconductor industry and represent a modular approach to designing and manufacturing integrated circuits. The concept of chiplets has been energized as a response to the recent challenges posed by the increasing complexity of semiconductor design. … Read More
The annual International Electron Devices Meeting (IEDM) took place last month. One of the presentations on the short course was by Matthew Metz of Intel titled New Materials Systems for Moore’s Law Continuation. In essence this was a look at some of the possibilities for what comes after silicon runs out of steam.
Matthew started… Read More
There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.
From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More
I attended the recent International Electron Devices Meeting (IEDM) last week. Many of the sessions are too technical and too far away from high volume manufacture to make good topics for a blog post. As a Fellow from IBM said about 5nm at and earlier IEDM, “none of these ideas will impact 5nm. It takes ten years for a solution to from… Read More
AI Semiconductor Market