TSMC, the world’s most trusted semiconductor foundry, released its 2024 Sustainability Report, underscoring its commitment to embedding environmental, social, and governance principles into its operations. Founded in 1987 and headquartered in Hsinchu Science Park, TSMC employs 84,512 people globally and operates… Read More
Intel’s Commitment to Corporate Responsibility: Driving Innovation and Sustainability
Introduction by Lip-BU Tan:
I’m an engineer at heart. Nothing motivates me more than solving hard problems. Our teams across Intel are driven by this same mindset—inspired by the power of technology to enable new solutions to our customers’ toughest challenges.
I fundamentally believe this will be a catalyst for innovation throughout… Read More
TSMC 2025 Update: Riding the AI Wave Amid Global Expansion
Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.
Intel Unveils Clearwater Forest: Power-Efficient Xeon for the Next Generation of Data Centers
At the recent Hot Chips conference, Intel® unveiled Clearwater Forest, its next-generation Xeon® 6 processor with efficiency cores (E-cores). The unveiling was made by Don Soltis, Xeon Processor Architect and Intel Fellow with over four decades of processor design experience and a long-standing contributor to the Xeon roadmap.… Read More
Intel’s IPU E2200: Redefining Data Center Infrastructure
We are in the midst of one of the most transformative periods for data center infrastructure. The explosion of AI, cloud-scale workloads, and hyperscale networking is forcing rapid innovation not only in compute and storage, but in the very fabric that connects them. At the recent Hot Chips conference, Pat Fleming gave a talk on… Read More
Advancements in High-Density Front- and Backside Wafer Connectivity: Paving the Way for CMOS 2.0
In the rapidly evolving semiconductor landscape, imec’s recent breakthroughs in wafer-to-wafer hybrid bonding and backside technologies are reshaping the future of compute systems. As detailed in their article, these innovations transition CMOS 2.0 from a conceptual framework to practical reality, enabling denser,… Read More
GlobalFoundries 2025 Update GTS25
“GTS25 brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable GF to design the essential chips the world relies on to live, work and connect.”
GlobalFoundries (GF), a leading contract semiconductor manufacturer, plays an important… Read More
Revolutionizing Chip Packaging: The Impact of Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)
In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More
Intel’s Pearl Harbor Moment
There is a lot of talk about where Intel went wrong, the latest is missing AI, but people seem to forget one of the more defining blunders in the history of Intel. In April of 2012 Kirk Skaugen, the new general manager of Intel’s client PC group, moderated a Q&A with Mark Bohr, a 33+ year Intel fellow, and Brad Heaney, the Ivy Bridge… Read More
Should the US Government Invest in Intel?
“Most companies don’t die because they are wrong; most die because they don’t commit themselves. They fritter away their valuable resources while attempting to make a decision. The greatest danger is standing still.” Andy Grove’s Only the Paranoid Survive, first published in 1996.
Looking back 20 years, we all know this… Read More
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