We’re confirming seats in São Paulo, Porto Alegre, Montevideo, Buenos Aires and Bucaramanga for the South American leg of our worldwide 2019 SiFive Tech Symposiums and Workshops. These five events will be focused heavily on academia, which is a key focus for SiFive. In fact, we are co-hosting these events with many of the most prestigious… Read More
Semiconductor Intellectual Property
Evolving Landscape of Self-Driving Safety Standards
I sat in a couple of panels at Arm TechCon this year, the first on how safety is evolving for platform-based architectures with a mix of safety-aware IP and the second on lessons learned in safety and particularly how the industry and standards are adapting to the larger challenges in self-driving, which obviously extend beyond … Read More
A No-Fudge ML Architecture for Arm
At TechCon I had a 1×1 with Steve Roddy, VP of product marketing in the Machine Learning (ML) Group at Arm. I wanted to learn more about their ML direction since I previously felt that, amid a sea of special ML architectures from everyone else, they were somewhat fudging their position in this space. What I heard earlier was that… Read More
ReRAM Revisited
I met with Sylvain Dubois (VP BizDev and Marketing of Crossbar) at TechCon to get an update on his views on ReRAM technology. I’m really not a semiconductor process guy so I’m sure I’m slower than the experts to revelations in this area. But I do care about applications so I hope I can add an app spin on the topic, also Sylvain’s views on… Read More
Cadence Dives Deeper at Linley Fall Processor Conference
I wrote about Cadence AI IP not long ago when I covered the Cadence Automotive Summit at the end of July (Tensilica DNA 100 Brings the AI Inference Solution for Level 2 ADAS ECUs and Level 4 Autonomous Driving, Tensilica HiFi DSPs for What I Want to Hear, and What I Don’t Want to Hear). One of those two blogs remains one of my most widely … Read More
Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor
Last week I attended the Linley Fall Processor Conference held in Santa Clara, CA. This blog is the first of three blogs I will be writing based on things I saw and heard at the event.
In April, Flex Logix announced its InferX X1 edge inference co-processor. At that time, Flex Logix announced that the IP would be available and that a chip,… Read More
Arm Reveals Custom Instructions, Mbed Partner Governance
At TechCon Arm announced two more advances against competitive threats, one arguably tactical and the other strategic, at least in this writer’s view. The tactical move was to add support for custom instructions, the ability to collapse multiple instructions into a single instruction through customer-added logic which hooks… Read More
Synopsys’ New Die-to-Die PHY IP – What It Means
This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More
New ARC VPX DSP IP provides parallel processing punch
The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More
Safety and Platform-Based Design
I was at Arm TechCon as usual this year and one of the first panels I covered was close to the kickoff, hosted by Andrew Hopkins (Dir System Technology at Arm), Kurt Shuler (VP marketing at Arteris IP) and Jens Benndorf (Managing Dir and COO at Dream Chip Technologies). The topic was implementing ISO 26262-compliant AI SoCs with Arm… Read More
Should Intel be Split in Half?