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Spot-On Dead Reckoning for Indoor Autonomous Robots

Spot-On Dead Reckoning for Indoor Autonomous Robots
by Kalar Rajendiran on 05-05-2021 at 10:00 am

Sensors Characteristics

One meaning of the word “reckoning” says it is the action or process of calculating or estimating something. But dead reckoning? What does that mean? Believe it or not, we have all deployed dead reckoning to varying degrees of success on different occasions. As an example, when driving on a multi-lane winding highway and direct … Read More


Why Near-Threshold Voltage is an Excellent Choice for Hearables

Why Near-Threshold Voltage is an Excellent Choice for Hearables
by Lauri Koskinen on 05-05-2021 at 6:00 am

blog part 3 energy frugality graphic FINAL 1

In the previous blogs on this topic, we’ve seen that utilizing near-threshold voltage (NTV) saves incredible amounts of energy, theoretically up to 10x and in practice from 2x to 4x. But there is a price which makes some applications more suited for NTV than others. This is due to the inevitable performance (speed) loss of NTV as … Read More


Arteris IP Contributes to Major MPSoC Text

Arteris IP Contributes to Major MPSoC Text
by Bernard Murphy on 04-28-2021 at 6:00 am

Wileybook min

You might have heard of the Multicore and Multiprocessor SoC (MPSoC) Forum sponsored by IEEE and other industry associations and companies. This group of top-notch academic and industry technical leaders gets together once a year to talk about hardware and software architecture and applications for multicore and multiprocessor… Read More


PCIe 6.0 Doubles Speed with New Modulation Technique

PCIe 6.0 Doubles Speed with New Modulation Technique
by Tom Simon on 04-26-2021 at 6:00 am

PCIe 6.0 Eye

PCI-SIG has held to doubling PCIe’s data rate with each revision of the specification. The consortium of 800 companies, with its board consisting of Agilent, AMD, Dell, HP, Intel, Synopsys, NVIDIA, and Qualcomm, is continuing this trend with the PCIe 6.0 specification which calls for a transfer rate of 64 GT/s. PCI-SIG released… Read More


CEO Interview: Dr. Rick Shen of eMemory

CEO Interview: Dr. Rick Shen of eMemory
by Daniel Nenni on 04-23-2021 at 6:00 am

eMemory Business Model

Dr. Shen has been President of eMemory Technology since 2009, succeeding Dr. Charles Hsu. Prior to the appointment, Dr. Shen held various management positions within the company, overseeing Technology Development, founding the Customer Service team, supervising Technology & IP services, and the company’s technology… Read More


Adaptive Power/Performance Management for FD-SOI

Adaptive Power/Performance Management for FD-SOI
by Tom Dillinger on 04-21-2021 at 10:00 am

Dolphin FD SOI FBB

A vexing chip design issue is how to achieve (or improve) performance and power dissipation targets, allowing for a wide range of manufacturing process variation (P) and dynamic operation voltage and temperature fluctuations (VT).  One design method is to analyze the operation across a set of PVT corners, and ensure sufficient… Read More


Arm Announces v9 Generation – Custom, DSP, Security, More

Arm Announces v9 Generation – Custom, DSP, Security, More
by Bernard Murphy on 04-21-2021 at 6:00 am

Balance of Standardization min

This wasn’t as much of a big bang announcement as others I have seen. More a polishing of earlier-announced reveals, positioning updates, together with some new concepts. First, you probably remember the Cortex-X announcement from about a year ago, allowing users to customize their own instructions into the standard instruction… Read More


5G Calls for New Transceiver Architectures

5G Calls for New Transceiver Architectures
by Tom Simon on 04-20-2021 at 6:00 am

5G Architecture

5G phones are now the top tier devices from many manufactures, and 5G deployment is accelerating in many regions. While 4G/LTE has served us well, 5G is necessary to support next-generation telecommunication needs. It will be used heavily by consumers and industry because it supports many new use cases. There is an excellent white… Read More


Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets

Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
by Kalar Rajendiran on 04-19-2021 at 10:00 am

Comparison of D2D PHY and XSR SerDes OpenFive

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More