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Semiconductor Intellectual Property
The automotive industry is on the brink of a revolutionary transformation, where predictive maintenance and monitoring are taking center stage. In a recent webinar panel session, industry experts delved into the challenges, current approaches, and future innovations surrounding the guarantee and extension of mission profiles.… Read More
Quantum computing is the next big thing for the computing world. The semiconductor industry has been talking about it for years. It’s shiny, mysterious, and capable of some incredible things. Instead of using classical bits to represent information (which can be either a 0 or a 1), quantum computers use quantum bits or qubits… Read More
Weebit Nano, a leading developer of advanced memory technologies, recently announced a significant collaboration with DB HiTek, one of the top ten foundries of the world. The collaboration is designed to enable integration of Weebit’s Resistive Random-Access Memory (ReRAM) into DB HiTek’s 130nm Bipolar-CMOS-DMOS… Read More
One of the goals of the recent RISC-V Summit was to demonstrate that the RISC-V movement is real – major programs by large organizations committing to development around the RISC-V ISA. I would say this goal was achieved. Many high-profile announcements and aggressive, new architectures based on RISC-V were presented. On day … Read More
In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More
Ceva Inc. is an interesting company. Founded in November 2002, through the combination of the DSP IP licensing… Read More
At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were:
First, a quick definition. By “structured assembly,” I mean the collection of tools to support IP packaging with standardized interfaces, SoC integration based on those IPs together with bus fabric and other connectivity hookups, register definition and management in support of hardware/software interface definition, … Read More
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
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