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cHBM for AI: Capabilities, Challenges, and Opportunities

cHBM for AI: Capabilities, Challenges, and Opportunities
by Kalar Rajendiran on 07-31-2025 at 6:00 am

cHBM Panelists at Synopsys Executive Forum

AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More


Security Coverage: Assuring Comprehensive Security in Hardware Design

Security Coverage: Assuring Comprehensive Security in Hardware Design
by Daniel Nenni on 07-24-2025 at 10:00 am

Assuring Comprehensive Security in Hardware Design

As hardware systems become increasingly complex and security threats grow more sophisticated, ensuring robust hardware security during the pre-silicon phase of development is more critical than ever. Cycuity’s white paper outlines how its Radix platform enables engineers to verify, visualize, and measure the effectiveness… Read More


Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing

Memory Innovation at the Edge: Power Efficiency Meets Green Manufacturing
by Admin on 07-22-2025 at 10:00 am

Figure 1

By Tetsu Ho

With the ever-increasing global demand for smarter, faster electronic systems, the semiconductor industry faces a dual challenge: delivering high-performance memory while reducing environmental impact. Winbond is meeting this challenge head-on by embedding sustainability into every layer of its operations—from… Read More


Agile Analog Update at #62DAC

Agile Analog Update at #62DAC
by Daniel Payne on 07-21-2025 at 10:00 am

agile analog min

On the last day of DAC 2025 I met with Chris Morrison, VP of Product Marketing at Agile Analog, to get an update. Their company provides Analog IP, the way you want it, and I knew that they had internal tools and a novel methodology to speed up the development process. This year they have started talking more about their internal IP automation… Read More


Sophisticated soundscapes usher in cache-coherent multicore DSP

Sophisticated soundscapes usher in cache-coherent multicore DSP
by Don Dingee on 07-16-2025 at 10:00 am

A Tensilica 2 to 8 core SMP DSP adds cache-coherence for high-end audio processing and other applications

Digital audio processing is evolving into an art form, particularly in high-end applications such as automotive, cinema, and home theater. Innovation is moving beyond spatial audio technologies to concepts such as environmental correction and spatial confinement. These sophisticated soundscapes are driving a sudden increase… Read More


Alphawave Semi and the AI Era: A Technology Leadership Overview

Alphawave Semi and the AI Era: A Technology Leadership Overview
by Daniel Nenni on 07-14-2025 at 8:00 am

AI Market Silicon Forecast 2025

The explosion of artificial intelligence (AI) is transforming the data center landscape, pushing the boundaries of compute, connectivity, and memory technologies. The exponential growth in AI workloads—training large language models (LLMs), deploying real-time inference, and scaling distributed applications—has … Read More


Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells

Podcast EP297: An Overview of sureCore’s New Silicon Services with Paul Wells
by Daniel Nenni on 07-11-2025 at 10:00 am

Dan is joined by sureCore CEO Paul Wells. Paul has worked in the semiconductor industry for over 25 years including two years as director of engineering for Pace Networks, where he led a multidisciplinary, 70 strong product development team creating a broadcast quality video & data mini-headend. Before that, he worked for… Read More


AI Booming is Fueling Interface IP 23.5% YoY Growth

AI Booming is Fueling Interface IP 23.5% YoY Growth
by Eric Esteve on 07-10-2025 at 6:00 am

image001 (2)

AI explosion is clearly driving semi-industry since 2020. AI processing, based on GPU, need to be as powerful as possible, but a system will reach optimum only if it can rely on top interconnects. The various sub-system need to be interconnected with ever more bandwidth and lower latency, creating the need for ever advanced protocol… Read More


Arteris Simplifies Design Reuse with Magillem Packaging

Arteris Simplifies Design Reuse with Magillem Packaging
by Mike Gianfagna on 07-08-2025 at 6:00 am

Arteris Simplifies Design Reuse with Magillem Packaging

Many know Arteris as the “network-on-chip”, or NoC, company. Through acquisitions and forward-looking development, the footprint for Arteris has grown beyond smart interconnect IP. At DAC this year, Arteris highlighted its latest expansion with a new SoC integration automation product called Magillem Packaging. The announcement… Read More


MEMS Technology – From Fringe to Mainstream

MEMS Technology – From Fringe to Mainstream
by Daniel Nenni on 07-07-2025 at 10:00 am

MEMs 2025 SemiWiki

Last month, Lj Ristic delivered an invited talk on MEMS technology as a driving force at the Laser Display and Lighting Conference 2025, held at Trinity College Dublin.  His talk included a review of some major successes of MEMS industry. We used that occasion to talk to him and discuss some major achievements and the status of MEMS… Read More