Once upon a time, ASIC designers involved in Processor design, like I was, for the first time in 1987 for Thomson CSF and again in 1994 for Texas Instruments, at that time supporting height (8) ASIC designed by another French company, the Advanced Computer Research Institute (ACRI), had to re-invent the wheel almost every day. When… Read More
Semiconductor Intellectual Property
Physical IP Update at DAC
Last year at DAC I visited this little-known physical IP company called DXCorr, so I decided to visit them again this year and get an update.… Read More
Should You Buy All Aspects of Your IP From a Single Supplier?
Interface IP typically consists of multiple layers, most importantly a PHY (level 1) analog (or mixed signal) block that handles the interface to the outside world and a number of levels of digital controllers. The interfaces between all these levels, especially between the PHY and the controller, is often defined by the interface… Read More
Swap and Play Extended To Chip Fabric and Memory Controllers
Virtual platforms enable software development to take place on a model of an electronic system. What everyone would like is models that are fast and accurate but that is simply not possible. Fast models are fast because they don’t model everything at the signal level. And accurate models get to be accurate by handling a lot of detail… Read More
Tela Innovations, DAC Update
Lawsuits in EDA are common, and Tela Innovationsfiled a huge complaint back in February with the U.S. International Trade Commission (USITC) against HTC Corporation; HTC America, Inc.; LG Electronics, Inc.; LG Electronics U.S.A., Inc.; LG Electronics MobileComm U.S.A., Inc.; Motorola Mobility LLC; Nokia Corporation; Nokia,… Read More
A Call to ARMs!
It sure has been an interesting experience watching Intel enter the semiconductor foundry business! While I credit Intel for increasing the exposure of the fabless semiconductor ecosystem to the financial markets, the attention from the Intel biased press is a bit overwhelming. The TSMC and ARM bashing is reaching new levels… Read More
ARM Update at DAC
John Heinleinfrom ARM briefed me at DAC exactly one week ago. I love to use my mobile devices (MacBook Pro, iPad and Samsung Galaxy Note II) every day, and many mobile devices are ARM-powered because of the low power consumption, and pervasive eco-system around the architecture. Apple with the MacBook Pro is still Intel-powered,… Read More
Meeting with Sidense at TSMC Technology Symposium
If you have attended DAC in Austin (June 2-5), you probably have missed the first TSMC Technology Symposium. It was held on June 6 in Shanghai. Considering my own experience of a 29 hours trip to come back home (in France), I doubt that it was any possible to leave Austin on June 5 to attend TSMC Technology Symposium in Shanghai on June… Read More
ARM: AMBA 5, Cortex-A12, Mali, video, POP…
ARM announced several new products at DAC in a number of different spaces. In addition I got invited to a briefing with Simon Segars, 30 days from when he takes over as CEO of ARM. I asked Simon if he expected to make any major changes and he basically said ‘no’. ARM’s basic strategy in both mobile and now enterprise… Read More
The Return of the "Moore Noyce" Company
It has been a little over a fortnight since Paul Otellini officially stepped down from the CEO post and yet it seems to be more than a long time gone. Unlike his predecessors, he was not asked to remain on the board and perhaps it is a sign that his complete disengagement from the company was necessary to complete a future strategic engagement.… Read More
Relaxation-Aware Programming in ReRAM: Evaluating and Optimizing Write Termination