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Semiconductor Intellectual Property
That’s too bad, as you have missed latest news about the Hybrid Memory Cube (presentation by Micron), Wide I/O 2 standard, as well as other standards like LPDDR4, eMMC 5.0, and LRDIMM,the good news is that you may find all these presentations on MemCon proceedings web site.
I first had a look at Richard Goering excellent blog: wideI/O… Read More
IP is the center of the semiconductor universe and nobody knows this better than Design and Reuse. The D&R website was launched in 1997 targeting the emerging commercial semiconductor IP market. Today, with more than 15,000 IP/SOC product descriptions updated daily, D&R is the #1 IP site matching customer requirements… Read More
All chips have critical power management requirements, often with multiple supply voltages. Digital power management ICs (PMICs) are commonplace to convert unregulated voltages from batteries and noisy power supplies to fully regulated accurate power to keep even the most sensitive chips performing.
Powervation is a company… Read More
Imagination seems to be well known for a couple of things. Firstly, everyone knows that it is the graphics processor used in the iPhone and the iPad and lots of other phones. And they know that Imagination acquired MIPS at the start of this year.
But what people don’t seem to really appreciate is just what a huge portfolio of IP… Read More
We have already discussed the recently released M-PCIe ECN from PCI-SIG in Semiwiki at the end of 2012, but the new “standard” (in fact an Engineering Change from PCI-SIG and MIPI Alliance) was only real on paper, at that time. The upcoming webinar from Synopsys, M-PCIe: Utilizing Low-Power PCI Express in Mobile Designs, shows … Read More
I remember during my first ten years as a software developer, I used many different computers such as IBM mainframes, Apollo and Sun workstations, and VAX computers. During that time I also bought my first home computer, a Macintosh. I didn’t of course think of this at the time, but the one thing they all had in common was that they did… Read More
The TSMC Open Innovation Platform® (OIP) Ecosystem Forum brings TSMC’s design ecosystem member companies together to share with our customers real-case solutions for customers’ design challenges and success stories of best practice in TSMC’s design ecosystem.
More than 90% of the attendees last year said “this… Read More
I think by now all of us know, or have heard about 20nm process node, its PPA (Power, Performance, Area) advantages and challenges (complexity of high design size and density, heterogeneity, variability, stress, lithography complexities, LDEs and so on). I’m not going to get into the details of these challenges, but will ponder… Read More
The news from Arteris, Inc., announcing that “its interconnect fabric IP has been licensed and deployed in a majority of chips developed by China’s leading semiconductor companies for applications including consumer electronics, smartphones, and tablets,” is holding attention for several reasons. At first, because it’s… Read More
Smartphone shipment explosion and continuous growth is attracting always more OEM and chip makers, this is not really surprising, as the wireless market can be identified as the faster growing, and larger electronic segment ever seen. On such a mass market, the real question is “how to differentiate?” Apple is unique; just trying… Read More
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