Banner Electrical Verification The invisible bottleneck in IC design updated 1
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Why USB 3.1 Certification is a “Must Have”?

Why USB 3.1 Certification is a “Must Have”?
by Eric Esteve on 05-31-2016 at 7:00 am

USB 3 protocol is now height years old, but USB 3.1 is much more recent (2014). The adoption behavior for USB protocol is unique, as USB 2.0 bandwidth (480 Mbps) is largely enough for certain applications. Nevertheless we have seen the sales for USB 3 IP passing the USB 2 in value during 2014, and the total USB IP segment becoming the … Read More


Arteris Unveils Solution for Heterogeneous Cache Coherent SOC’s

Arteris Unveils Solution for Heterogeneous Cache Coherent SOC’s
by Tom Simon on 05-30-2016 at 12:00 pm

Designing SOC’s for markets like automotive and mobile electronics requires taking advantage of every opportunity for optimization. One way to do this is through building a cache coherent system to boost speed and reduce power. Recently, NXP decided to go about this on their automotive MCU based SOC’s by using Arteris’ just-announced… Read More


Moving chips from industrial to industrial IoT

Moving chips from industrial to industrial IoT
by Don Dingee on 05-27-2016 at 4:00 pm

IHS has put out its 1Q2016 Application Market Forecast predicting the highest growth rate segments for semiconductors over the next five years – and what was once old is new yet again. There it is, in the top right corner: industrial, projected to outpace even the automotive sector.… Read More


ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


Autotalks’ New V2X Processor Integrates CEVA-XC DSP to Support IEEE802.11p and WiFi

Autotalks’ New V2X Processor Integrates CEVA-XC DSP to Support IEEE802.11p and WiFi
by Eric Esteve on 05-24-2016 at 12:00 pm

V2X stands for Vehicle to Everything and to be specific, V2X technology connects vehicles to other vehicles (V2V), infrastructure (V2I), motorcycles (V2M) and pedestrians (V2P) within wireless range for safety and mobility applications. If you consider that the US Department of transportation (USDOT) is expected to publish… Read More


Where are the Entrepreneurs?

Where are the Entrepreneurs?
by Randy Smith on 05-22-2016 at 10:00 am

This week I attended the UpWest Labs event in San Francisco. UpWest Labs provides seed funding and incubation for a wide range of domains including Enterprise Software, Internet of Things, Infrastructure Technologies, Artificial Intelligence, Consumer Applications, Drones, Cyber Security, Augmented Reality / Virtual … Read More


Cache Coherent Systems Get a Boost from New Technology

Cache Coherent Systems Get a Boost from New Technology
by Tom Simon on 05-20-2016 at 12:00 pm

The speed and power penalties for accessing system RAM affect everything from artificial intelligence platforms to IoT sensor nodes. There is a huge power and performance overhead when the various IP blocks in an SOC need to go to DRAM. Memory caches have become essential to SOC design to reduce these adverse effects. However, … Read More


ARM Server Update (NFV)

ARM Server Update (NFV)
by Patrick Moorhead on 05-14-2016 at 7:00 am

There has been a lot of buzz in the industry over the last several years about ARM Holdings’ and its partners’ plans to go after the datacenter market with a particular focus on servers. Companies like Advanced Micro Devices, Applied Micro Circuits Corp. (AppliedMicro), Cavium, and Qualcomm, are now in various stages of product… Read More


Why NXP is Moving to FD-SOI (Part II)

Why NXP is Moving to FD-SOI (Part II)
by Ron Martino on 05-10-2016 at 2:00 pm

At NXP, we’re very excited about the prospects for our new i.MX 7 and 8 series of applications processors, which we’re manufacturing on 28nm FD-SOI. As noted in part I of this article series, the new i.MX 7 series, which leverages the 32-bit ARM v7-A core, is targeting the general embedded, e-reader, medical, wearable… Read More


Sonics opens new strategy for SoC energy processing

Sonics opens new strategy for SoC energy processing
by Don Dingee on 05-09-2016 at 4:00 pm

Back in February when we shared the Sonics philosophy on the ICE-Grain Power Architecture for hardware-based SoC power management, I speculated we’d know more by DAC 2016. Sonics is hitting the road with a new live seminar coming to Silicon Valley this month and Austin during DAC – and the news is big.… Read More