Banner Electrical Verification The invisible bottleneck in IC design updated 1
WP_Term Object
(
    [term_id] => 50
    [name] => Events
    [slug] => events
    [term_group] => 0
    [term_taxonomy_id] => 50
    [taxonomy] => category
    [description] => 
    [parent] => 0
    [count] => 1459
    [filter] => raw
    [cat_ID] => 50
    [category_count] => 1459
    [category_description] => 
    [cat_name] => Events
    [category_nicename] => events
    [category_parent] => 0
    [is_post] => 
)

Webinar: Rapid Exploration of Advanced Materials (for Ferroelectric Memory)

Webinar: Rapid Exploration of Advanced Materials (for Ferroelectric Memory)
by Tom Dillinger on 03-30-2021 at 6:00 am

polarization

There are many unsung heroes in our industry – companies that provide unique services and expertise that enable the rapid advances in fabrication process development that we’ve come to rely upon.  Some of these companies offer “back-end” services, assisting semiconductor fabs with yield diagnostic engineering and failure… Read More


Upcoming Webinar on Resistive RAM (ReRAM) Technology

Upcoming Webinar on Resistive RAM (ReRAM) Technology
by Kalar Rajendiran on 03-21-2021 at 10:00 am

eMemory RRAM Webinar Semiwiki

On-chip memory (embedded memory) makes computing applications run faster. In the early days of the semiconductor industry, the desire to utilize large amount of on-chip memory was limited by cost, manufacturing difficulties and technology mismatches between logic and memory circuit implementations. Since then, advancements… Read More


Resistive RAM (ReRAM) Computing-in-Memory IP Macro for Machine Learning

Resistive RAM (ReRAM) Computing-in-Memory IP Macro for Machine Learning
by Tom Dillinger on 03-18-2021 at 6:00 am

testsite

The term von Neumann bottleneck is used to denote the issue with the efficiency of the architecture that separates computational resources from data memory.   The transfer of data from memory to the CPU contributes substantially to the latency, and dissipates a significant percentage of the overall energy associated with … Read More


SPIE 2021 – ASML DUV and EUV Updates

SPIE 2021 – ASML DUV and EUV Updates
by Scotten Jones on 03-17-2021 at 10:00 am

SPIE DUV 2021 ASML NXT4 DryWet Presentation final noWPD2 Page 42

At the SPIE Advanced Lithography Conference held in February, ASML presented the latest information on their Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) exposure systems. I recently got to interview Mike Lercel of ASML to discuss the presentations.

DUV

Despite all the attention EUV is getting, most layers are still… Read More


All-Digital In-Memory Computing

All-Digital In-Memory Computing
by Tom Dillinger on 03-15-2021 at 6:00 am

NOR gate

Research pursuing in-memory computing architectures is extremely active.  At the recent International Solid State Circuits conference (ISSCC 2021), multiple technical sessions were dedicated to novel memory array technologies to support the computational demand of machine learning algorithms.

The inefficiencies associated… Read More


Webinar: How to Protect Sensitive Data with Silicon Fingerprints

Webinar: How to Protect Sensitive Data with Silicon Fingerprints
by Daniel Nenni on 03-11-2021 at 8:00 am

Webinar How to Protect Sensitive Data with Silicon Fingerprints

Data protection is on everyone’s mind these days. The news cycle seems to contain a story about hacking, intrusion or cyber-terrorism on a regular basis. The cloud, our hyperconnected devices and the growing reliance on AI-assisted hardware to manage more and more mission critical functions all around us make data protection… Read More


Register File Design at the 5nm Node

Register File Design at the 5nm Node
by Tom Dillinger on 03-10-2021 at 2:00 pm

lowVt bitcell

“What are the tradeoffs when designing a register file?”  Engineering graduates pursuing a career in microelectronics might expect to be asked this question during a job interview.  (I was.)

On the surface, one might reply, “Well, a register file is just like any other memory array – address inputs, data inputs and outputs, read/writeRead More


Cadence Underlines Verification Throughput at DVCon

Cadence Underlines Verification Throughput at DVCon
by Bernard Murphy on 03-10-2021 at 6:00 am

Verification Throughput min

Paul Cunningham, CVP and GM of the System Verification Group at Cadence gave the afternoon Keynote on Tuesday at DVCon and doubled down on his verification-throughput message. At the end of the day, what matters most to us in verification is the number of bugs found and fixed per dollar per day. You can’t really argue with that message.… Read More


A Review of Clock Generation and Distribution for Off-Chip Interfacing

A Review of Clock Generation and Distribution for Off-Chip Interfacing
by Tom Dillinger on 03-09-2021 at 6:00 am

clocking

At the recent ISSCC conference, Mozhgan Mansuri from Intel gave an enlightening (extended) short course presentation on all thing related to clocking, for both wireline and wireless interface design. [1]  The presentation was extremely thorough, ranging from a review of basic clocking principles to unique circuit design … Read More


Features of Short-Reach Interface IP Design

Features of Short-Reach Interface IP Design
by Tom Dillinger on 03-08-2021 at 6:00 am

eye diagram

The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces.  There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2]  (Many of the configurations of interest … Read More