Several years ago I recall upgrading my aging MacBook Pro laptop from using a Hard Disk Drive (HDD) to a Solid State Drive (SSD) that used Non-Volatile Memory (NVM). Oh what a speed improvement when pushing that On button each morning to start the work day, or clicking an App to see it launch without delay. Another epiphany for me in … Read More
Keynote from Air Force Research Laboratory at CadenceLIVE Americas 2021
Cadence hosted its annual CadenceLIVE Americas conference June 8th-June 9th. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
The C-suite keynotes were delivered by Lip-Bu Tan (CEO) and Dr. Anirudh Devgan (President). The talks… Read More
Cadence Keynotes at CadenceLIVE Americas 2021
Last week, Cadence hosted its annual CadenceLIVE Americas conference. Four keynotes and eighty-three different talks on various topics were presented. The talks were delivered by Cadence, its customers and partners.
This blog is about the two keynotes delivered by CEO Lip-Bu Tan and President Dr. Anirudh Devgan. The guest … Read More
Silicon Photonics Solutions Address Bandwidth, Reach, and Power Challenges
A couple of weeks ago, I blogged on GlobalFoundries’ silicon technologies supporting automotive radar applications. This time it is on GlobalFoundries’ silicon photonics technology which expects to find adoption in a broad spectrum of applications. The blog is based on listening to a technology presentation made by Dr. … Read More
Highlights of the TSMC Technology Symposium 2021 – Automotive
At the recent TSMC Technology Symposium, TSMC provided a detailed discussion of their development roadmaps. Previous articles have reviewed the highlights of silicon process and packaging technologies. The automotive platform received considerable emphasis at the Symposium – this article specifically focuses on the… Read More
Highlights of the TSMC Technology Symposium 2021 – Packaging
The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings.
General
3DFabricTM
Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric.
2.5D package technology – CoWoS
The 2.5D packaging options are divided into the CoWoS… Read More
Highlights of the TSMC Technology Symposium 2021 – Silicon Technology
Recently, TSMC held their annual Technology Symposium, providing an update on the silicon process technology and packaging roadmap. This article will review the highlights of the silicon process developments and future release plans.
Subsequent articles will describe the packaging offerings and delve into technology … Read More
WEBINAR: 5 Reasons Why a High Performance Reconfigurable SmartNIC Demands a 2D NoC
If you are involved in designing systems that process data, you’re going to want to attend this webinar. Practically speaking, this should include a large percentage of the SemiWiki readership. Since data is the new oil there are a lot of applications drawn to data and information processing. Before we explore this webinar, let’s… Read More
Silicon Catalyst is Bringing Its Unique Startup Platform to the UK
Silicon Catalyst is a unique startup incubator / accelerator that focuses exclusively on accelerating solutions in silicon (including chips, IP, MEMS & sensors). The organization has an extensive support infrastructure that includes preferred access to IP, design tools, business infrastructure and fab/assembly. … Read More
Analog Sensing Now Essential for Boosting SOC Performance
In today’s System-on-Chip (SOC), analog blocks are used in many places such as I/O cells for communication, PLLs for generating clocks, LDO’s for converting supply voltage to internal rail voltage, Sensors for qualifying external characteristics such as temperature, light, motion, etc. However new advanced designs now require… Read More


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