The TSMC Open Innovation Platform (OIP) Ecosystem Forum kicked off on September 24 in Santa Clara, CA. This is the event where TSMC recognizes and promotes the vast ecosystem the company has created. After watching this effort grow over the years, I feel that there is nothing the group can’t accomplish thanks to the alignment and… Read More
Synopsys Collaborates with TSMC to Enable Advanced 2D and 3D Design Solutions
Synopsys has deepened its collaboration with TSMC certifying the Ansys portfolio of simulation and analysis tools for TSMC’s cutting-edge manufacturing processes including N3C, N3P, N2P, and A16. This partnership empowers chip designers to perform precise final checks on designs, targeting applications in AI acceleration,… Read More
TSMC’s Push for Energy-Efficient AI: Innovations in Logic and Packaging
In his keynote at the TSMC OIP Ecosystem Forum Dr. LC Lu, TSMC Senior Fellow and Vice President, Research & Development / Design & Technology Platform, highlighted the exponential rise in power demand driven by AI proliferation. AI is embedding itself everywhere, from hyperscale data centers to edge devices, fueling… Read More
Yuning Liang’s Painstaking Push to Make the RISC-V PC a Reality
At Embedded World 2025 in Nuremberg, Germany, on March 11, 2025, Yuning Liang, DeepComputing Founder and CEO walked onto the stage with a mischievous smile and a challenge. “What’s the hardest product to make?” he asked rhetorically. “A laptop. It’s bloody hard… but we did it. You can swap the motherboard, you can upgrade, you can’t… Read More
Soitec’s “Engineering the Future” Event at Semicon West 2025
As part of the broader Semicon West ecosystem in Phoenix, Arizona, Soitec, a global leader in engineered substrates for semiconductors, hosts an exclusive, invitation-style event titled Engineering the Future: Soitec Substrates Powering Technology Megatrends on Wednesday, October 8, 2025, from 2:30 PM to 6:00 PM MST.
Held… Read More
Rise Design Automation Webinar: SystemVerilog at the Core: Scalable Verification and Debug in HLS
Key Takeaways
– High-Level Synthesis (HLS) delivers not only design productivity and quality but also dramatic gains in verification speed and debug – and it delivers them today.
– Rise Design Automation uniquely enables SystemVerilog-based HLS and SystemVerilog verification, reusing proven verification… Read More
Future Horizons Industry Update Webinar IFS 2025
The Future Horizons Industry Update Webinar, presented today by Malcolm Penn, provides a comprehensive analysis of the semiconductor industry’s current state and future trajectory. Founded in 1989, Future Horizons leverages over 300 man-years of experience, emphasizing impartial insights from facts (e.g., IMF … Read More
Webinar Preview – Addressing Functional ECOs for Mixed-Signal ASICs
An engineering change order, or ECO in the context of ASIC design is a way to modify or patch a design after layout without needing to re-implement the design from its starting point. There are many reasons to use an ECO strategy. Some examples include correcting errors that are found in post-synthesis verification, optimizing … Read More
TSMC 2025 Update: Riding the AI Wave Amid Global Expansion
Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.
WEBINAR: Functional ECO Solution for Mixed-Signal ASIC Design
This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs.
The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More


The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival