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Q2FY24TessentAI 800X100
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Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes

Improving Analog/Mixed Signal Circuit Reliability at Advanced Nodes
by glforte on 12-07-2011 at 3:52 pm

Preventing electrical circuit failure is a growing concern for IC designers today. Certain types of failures such as electrostatic discharge (ESD) events, have well established best practices and design rules that circuit designers should be following. Other issues have emerged more recently, such as how to check circuits… Read More


December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)

December 1st – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)
by Daniel Payne on 11-24-2011 at 9:57 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow
DRC Wiki
Graphical DRC vs Text-based DRC
Getting Real time Calibre DRC Results with Custom IC Editing
Transistor-level Electrical Rule Checking
Who Needs a 3D Field Solver for IC Design?
Prevention is BetterRead More


Reducing the Need for Guardbanding Flash ADC Designs

Reducing the Need for Guardbanding Flash ADC Designs
by SStalnaker on 11-22-2011 at 7:59 pm

Flash analog-to-digital converters (ADCs) are commonly used in high-frequency applications such as satellite communications, sampling oscilloscopes, and radar detection. Flash ADC is preferred over other ADC architectures because it is extremely fast and quite simple. However, flash ADC typically requires twice as many… Read More


Physical Verification of 3D-IC Designs using TSVs

Physical Verification of 3D-IC Designs using TSVs
by Daniel Payne on 11-12-2011 at 10:36 am

3D-IC design has become a popular discussion topic in the past few years because of the integration benefits and potential cost savings, so I wanted to learn more about how the DRC and LVS flows were being adapted. My first stop was the Global Semiconductor Alliance web site where I found a presentation about how DRC and LVS flows were… Read More


Managing Test Power for ICs

Managing Test Power for ICs
by Beth Martin on 11-07-2011 at 12:17 pm

The goal for automatic test pattern generation (ATPG) is to achieve maximum coverage with the fewest test patterns. This conflicts with the goals of managing power because during test, the IC is often operated beyond its normal functional modes to get the highest quality test results. When switching activity exceeds a device’s… Read More


What’s New with Semiconductor Test and Failure Analysis at Mentor?

What’s New with Semiconductor Test and Failure Analysis at Mentor?
by Daniel Payne on 10-28-2011 at 6:03 pm

ISTFA
Silicon Valley is a great location for trade shows and technical conferences, so if you have an interest in test and failure analysis then don’t miss out on the 37th annual International Symposium for Testing and Failure Analysis. This year ISTFA will be held from Sunday, November 13th thru Thursday, November 17th … Read More


Think differentiation

Think differentiation
by Paul McLellan on 10-27-2011 at 5:01 pm

Wally Rhines’s keynote at the ARM TechCon was about differentiation and how to use it to create measurable value. We all know what differentiation means in some intuitive sense, but how do you make it measurable? Wally’s answer was that differentiation is a measure of the difficulty of switching suppliers and is best… Read More


Parasitic Extraction—My Head Hurts!

Parasitic Extraction—My Head Hurts!
by glforte on 10-27-2011 at 10:08 am

By Carey Robertson, Director of Product Marketing, Mentor Graphics

IC physical verification requires a number of different types of checking, the most familiar being design rule checking (DRC), layout vs. schematic (LVS) checking, and parasitic extraction combined with circuit simulation. Fundamentally, it does not matter… Read More


Oct 27 – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)

Oct 27 – Hands-on Workshop with Calibre: DRC, LVS, DFM, xRC, ERC (Fremont, California)
by Daniel Payne on 10-20-2011 at 9:56 am

I’ve blogged about the Calibre family of IC design tools before:

Smart Fill replaced Dummy Fill Approach in a DFM Flow

DRC Wiki

Graphical DRC vs Text-based DRC

Getting Real time Calibre DRC Results with Custom IC Editing

Transistor-level Electrical Rule Checking

Who Needs a 3D Field Solver for IC Design?

Prevention is BetterRead More


Mentor at the TSMC Open Innovation Platform Ecosystem Forum

Mentor at the TSMC Open Innovation Platform Ecosystem Forum
by Daniel Payne on 10-17-2011 at 3:14 pm

EDA companies and foundries must closely collaborate in order to deliver IC tool flows that work without surprises at the 40nm and 28nm nodes.

Tomorrow in San Jose
you can attend this 4th annual event hosted by TSMC along with Mentor Graphics and other EDA and IP companies.

Here are some of the topics that will interest IC designers… Read More