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Whitepaper : The True Costs of Process Node Migration

Whitepaper : The True Costs of Process Node Migration
by Mitch Heins on 08-09-2017 at 12:00 pm

Mentor, A Siemens Business, just released a new white paper entitled, “The True Costs of Process Node Migration” written by John Ferguson. This is a good quick read that highlights some of the key areas that are often over looked when contemplating a shift of process nodes for your next design.

When considering a shift to a more advanced… Read More


Emulation makes the What to See List

Emulation makes the What to See List
by Daniel Payne on 07-25-2017 at 12:00 pm

The analysts at Gary Smith EDA produce an annual What To See List for DAC and I quickly noticed that all three major EDA vendors were included on the list for the specific category of emulation. The big problem that emulation addresses is the ability to run in hardware an early version of your SoC so that software developers can get access… Read More


High Density Advanced Packaging Trends

High Density Advanced Packaging Trends
by Mitch Heins on 07-19-2017 at 7:00 am

Thursdays at the Design Automation Conference (DAC) are always a good time to catch up on areas of technology which are adjacent to that which you normally work. The exhibit floor is over and you have more time to spend in seminars. At this year’s DAC, I took advantage of a half day seminar put on by Mentor, a Siemens business, … Read More


HLS update from Mentor about Catapult

HLS update from Mentor about Catapult
by Daniel Payne on 07-17-2017 at 12:00 pm

I recall back in the late 1980’s when logic synthesis tools were first commercialized, at first they could read in a gate-level netlist from one foundry then output an optimized netlist back into the same foundry. Next, they could migrate your gate-level netlist from Vendor A over to Vendor B, giving design companies some… Read More


Rob Bates on Safety and ISO26262

Rob Bates on Safety and ISO26262
by Bernard Murphy on 07-12-2017 at 7:00 am

Most of us would agree that safety is important in transportation and most of us know that in automotive electronics this means ISO26262 compliance. But, except for the experts, the details don’t make for an especially gripping read. I thought it would be interesting to get behind the process to better understand the motivation,… Read More


Mentor & Phoenix Software Shed Light on Integrated Photonics Design Rule Checking

Mentor & Phoenix Software Shed Light on Integrated Photonics Design Rule Checking
by Mitch Heins on 07-10-2017 at 12:00 pm

Just prior to the opening of the 54[SUP]th[/SUP] Design Automation Conference, Mentor, a Siemens company, and PhoeniX Software issued a press release announcing a new integration between their tools to help designers of photonic ICs (PICs) to close the loop for manufacturing sign-off verification. This is a significant piece… Read More


Overcoming the Challenges of Creating Custom SoCs for IoT

Overcoming the Challenges of Creating Custom SoCs for IoT
by Mitch Heins on 06-30-2017 at 7:00 am

As the Internet of Things (IoT) opportunities continues to expand, companies are working hard to bring System-on-Chip (SoC) solutions to market in the hopes of garnering market share and revenue. However, it’s not as easy as it may first seem. Companies are running into a series of issues that stand between them and capturing the… Read More


The Real Reason Siemens Bought Mentor!

The Real Reason Siemens Bought Mentor!
by Daniel Nenni on 06-26-2017 at 7:00 am

The Siemens purchase of Mentor last year for a premium $4.5B was a bit of a shock to me as I have stated before. I had an inkling a Mentor acquisition was coming but Siemens was not on my list of suitors. The reviews have been mixed and the Siemens commitment to the IC EDA market has been questioned so I spent some time on this at #54DAC.

First… Read More


Tools for Advanced Packaging Design Follow Moore’s Law, Too!

Tools for Advanced Packaging Design Follow Moore’s Law, Too!
by Tom Dillinger on 06-05-2017 at 9:00 am

There is an emerging set of advanced packaging technologies that enables unique product designs, with the capability to integrate multiple die, from potentially heterogeneous technologies. These “system-in-package” (SiP) offerings provide architects with the opportunity to optimize product performance, power, cost,… Read More