WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 775
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 775
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)
            
Q2FY24TessentAI 800X100
WP_Term Object
(
    [term_id] => 159
    [name] => Siemens EDA
    [slug] => siemens-eda
    [term_group] => 0
    [term_taxonomy_id] => 159
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 775
    [filter] => raw
    [cat_ID] => 159
    [category_count] => 775
    [category_description] => 
    [cat_name] => Siemens EDA
    [category_nicename] => siemens-eda
    [category_parent] => 157
    [is_post] => 
)

HLS in a Stanford Edge ML Accelerator Design

HLS in a Stanford Edge ML Accelerator Design
by Bernard Murphy on 06-16-2022 at 6:00 am

AI for stanford min

I wrote recently about Siemens EDA’s philosophy on designing quality in from the outset, rather than trying to verify it in. The first step is moving up the level of abstraction for design. They mentioned the advantages of HLS in this respect and I refined that to “for DSP-centric applications”. A Stanford group recently presented… Read More


Standardization of Chiplet Models for Heterogeneous Integration

Standardization of Chiplet Models for Heterogeneous Integration
by Tom Dillinger on 06-09-2022 at 10:00 am

Chiplets

The emergence of 2.5D packaging technology for heterogeneous die integration offers significant benefits to system architects.  Functional units may be implemented using discrete die – aka “chiplets” – which may be fabricated in different process nodes.  The power, performance, and cost for each unit may be optimized separately.… Read More


RISC-V embedded software gets teams coding faster

RISC-V embedded software gets teams coding faster
by Don Dingee on 06-07-2022 at 10:00 am

Nucleus RTOS

RISC-V processor IP is abundant. Open-source code for RISC-V is also widely available, but typically project-based code solves one specific problem. Using only pieces of code, it’s often up to a development team integrate a complete application-ready stack for creating an embedded device. A commercial embedded software development… Read More


Using EM/IR Analysis for Efinix FPGAs

Using EM/IR Analysis for Efinix FPGAs
by Daniel Payne on 05-30-2022 at 10:00 am

XLR min

I’ve been following the EM/IR (Electro-Migration, IR is current and resistance) analysis market for many years now, and recently attended a presentation from Steven Chin, Sr. Director IC Engineering of Efinix, at the User2User event organized by Siemens EDA. The Tuesday presentation was in the morning at the Marriott… Read More


Methods for Current Density and Point-to-point Resistance Calculations

Methods for Current Density and Point-to-point Resistance Calculations
by Daniel Payne on 05-26-2022 at 10:00 am

ESD path min

IC reliability is an issue that circuit design engineers and reliability engineers are concerned about, because physical effects like high Current Density (CD) in interconnect layers, or high point-to-point (P2P) resistance on device interconnect can impact reliability, timing or Electrostatic Discharge (ESD) robustness.… Read More


3D IC Update from User2User

3D IC Update from User2User
by Daniel Payne on 05-24-2022 at 10:00 am

FO WLP min

Our smart phones, tablets, laptops and desktops are the most common consumer products with advanced 2.5D and 3D IC packaging techniques. I love seeing the product tear down articles to learn how advanced packaging techniques are being used, so at the User2User conference in Santa Clara I attended a presentation from Tarek Ramadan,… Read More


Joseph Sawicki of Siemens EDA at User2User

Joseph Sawicki of Siemens EDA at User2User
by Daniel Payne on 05-19-2022 at 10:00 am

Joseph Sawicki

I attended the annual user group meeting called User2User in Santa Clara this year, hosted by Siemens EDA, with 51 presentations by customers in 11 tracks, and keynotes during each lunch hour from semiconductor executives. Joseph Sawicki, Executive VP, IC Segment, at Siemens EDA presented on a Tuesday, along with Prashant Varshney,… Read More


Cybersecurity Threat Detection and Mitigation

Cybersecurity Threat Detection and Mitigation
by Daniel Payne on 05-16-2022 at 10:00 am

Embedded Analytics min

Every week in the technology trade press I am reading about cybersecurity attacks against web sites, apps, IoT devices, vehicles and even ICs. At the recent IP SoC Silicon Valley 2022 event in April I watched a cybersecurity  presentation from Robert Rand, Solution Architect for Tessent Embedded Analytics at Siemens EDA. Common… Read More


Efficient Memory BIST Implementation

Efficient Memory BIST Implementation
by Daniel Payne on 05-05-2022 at 10:00 am

Figure 1 min

Test experts use the acronym BIST for Built In Self Test, it’s the test logic added to an IP block that speeds up the task of testing by creating stimulus and then looking at the output results. Memory IP is a popular category for SoC designers, as modern chips include multiple memory blocks for fast, local data and register storage… Read More


Designing a FinFET Test Chip for Radiation Threats

Designing a FinFET Test Chip for Radiation Threats
by Tom Simon on 04-04-2022 at 10:00 am

Charged Particles

Much of the technology that goes into aerospace applications is some of the most advanced technology that exists. However, these same systems must also offer the highest level of reliability in what is arguably an extremely difficult environment. For semiconductors a major environmental risk in aerospace applications are … Read More