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Electronic Design Automation
Lunch time Monday at DAC and I learned about what’s new at the IPL Alliance in 2011.
IPL Sponsors: Magma, Mentor Graphics, Springsoft, Accelicon, Ciranova, Synopsys, TSMC, TowerJazz, Jedat, Tanner EDA
Two major projects:
1) iPDKS
2) Analog Constraints… Read More
I met with Bala Vishwanath, CMO at Nimbic on Monday morning. They had just announced a $6.9M round of venture capital which is something that you rarely hear about in EDA these days, especially during a slow economic recovery.
Intro
Physware – served the package and board markets, co-design challenges (can add IC noise sources).… Read More
Introduction
Monday morning at DAC I attended the breakfast presentation from Magma, ARM and GLOBALFOUNDRIES. The 28nm node is ready for business using Magma tools and ARM libraries.
During breakfast I met Karim Arabi, Ph.D. from QualComm. He’s a senior director of engineering in San Diego and wanted to learn more about… Read More
GLOBALFOUNDRIES will show off its 28nm design ecosystem at #48DAC next week in San Diego. The company will feature a full design ecosystem for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) in partnership… Read More
Sagantec is the leading EDA provider of process migration solutions for custom IC design. Sagantec’s EDA solutions enable IC designers to leverage their investment in existing physical design IP and accomplish dramatic time and effort savings in the implementation of custom, analog, mixed-signal and memory circuits… Read More
TSMC rolled out the new reference flows for 28nm design as part of the Open Innovation Platform. The biggest surprise (to me) is that Cadence is STILL in the TSMC reference flows!
The updated TSMC OIP wiki is here, the Reference Flow 12.0 wiki can be found here, the AMS 2.0 reference flow wiki is here, and the official TSMC PR is here. … Read More
A three-dimensional integrated circuit (3D IC ) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is hotly pursuing this emerging technology in many different forms, as a result the full definition is still somewhat… Read More
The 48[SUP]th[/SUP] Design Automation Conference (DAC) is now upon us. DAC is billed as “the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions” for which I would have to agree with 100%.
The first DAC I attended was in 1984, Albuquerque New Mexico, which was one of the first to allow … Read More
ESD has historically been a big problem analyzed with ad-hoc approaches. As explained earlier, this is no longer an adequate way to plan nor signoff ESD protection.
Pathfinder is the first full-chip comprehensive ESD planning and verification solution. It is targeted to address limitations in today’s methodologies.… Read More
Introduction
Cadence and ClioSoft made a webinar recently and I’ll summarize what I learned from it.
What’s New from Cadence in Virtuoso 6.1.5
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CHIPS Act dies because employees are fired – NIST CHIPS people are probationary