Following a similar topic we covered early last year, here we look at updated research to accelerating RTL simulation through domain-specific hardware. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our … Read More
Electronic Design Automation
Ultra Ethernet and UALink IP solutions scale AI clusters
AI infrastructure requirements are booming. Larger AI models carry hefty training loads and inference latency requirements, driving an urgent need to scale AI acceleration clusters in data centers. Advanced GPUs and NPUs offer solutions for the computational load. However, insufficient bandwidth or latency between servers… Read More
Reset Domain Crossing (RDC) Challenges
In the early days an IC had a single clock and a single reset signal, making it a simple matter to reset the chip into a known, stable state, so there was little need for detailed analysis. For modern designs there can be dozens to hundreds of clocks, creating separate domains and some use of asynchronous resets, so the challenge of ensuring… Read More
Electrical Rule Checking in PCB Tools
I’ve known about DRC (Design Rule Checking) for IC design, and the same approach can also be applied to PCB design. The continuous evolution of electronics has led to increasingly intricate PCB designs that require Electrical Rule Checking (ERC) to ensure that performance goals are met. This complexity poses several challenges… Read More
Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC Tools
There is ample evidence that technologies such as high-performance computing, next-generation servers, and AI accelerators are fueling unprecedented demands in data processing speed with massive data storage, lower latency, and lower power. Heterogeneous system integration, more commonly called 2.5 and 3D IC design, … Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)
As industries become more reliant on advanced technologies, the importance of ensuring the reliability and longevity of critical systems grows. Failures in components, whether in autonomous vehicles, high performance computing (HPC), healthcare devices, or industrial automation, can have far-reaching consequences.… Read More
SystemReady Certified: Ensuring Effortless Out-of-the-Box Arm Processor Deployments
When contemplating the Lego-like hardware and software structure of a leading system-on-chip (SoC) design, a mathematically inclined mind might marvel at the tantalizing array of combinatorial possibilities among its hardware and software components. In contrast, the engineering team tasked with its validation may have… Read More
Accelerating Electric Vehicle Development – Through Integrated Design Flow for Power Modules
The development of electric vehicles (EVs) is key to transitioning to sustainable transportation. However, designing high-performance EVs presents significant challenges, particularly in power module design. Power modules, including inverters, bulky DC capacitors, power management ICs (PMICs), and battery packs, … Read More
A Master Class with Ansys and Synopsys, The Latest Advances in Multi-Die Design
2.5D and 3D multi-die design is rapidly moving into the mainstream for many applications. HPC, GPU, mobile, and AI/ML are application areas that have seen real benefits. The concept of “mix/match” for chips and chiplets to form a complex system sounds deceptively simple. In fact, the implementation and analysis techniques required… Read More
Innexis Product Suite: Driving Shift Left in IC Design and Systems Development
At the heart of the shift-left strategy is the goal of moving traditionally late-stage tasks—such as software development, validation, and optimization—earlier in the design process. This proactive approach allows teams to identify and resolve issues before they escalate, reducing costly rework and shortening the overall… Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?