Events EDA2025 esig 2024 800X100
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Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps

Synopsys Powers World’s Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
by Kalar Rajendiran on 09-23-2024 at 10:00 am

Synopsys 40G UCIe IP Solution

As the demand for higher performance computing solutions grows, so does the need for faster, more efficient data communication between components in complex multi-die system-on-chip (SoC) designs. In response to these needs, Synopsys has introduced the world’s fastest UCIe-based IP solution, capable of operating at a groundbreaking… Read More


Linear pluggable optics target data center energy savings

Linear pluggable optics target data center energy savings
by Don Dingee on 09-19-2024 at 6:00 am

Conceptual diagram of a retimed OSFP versus a linear direct drive solution using an advanced SerDes IP solution and linear pluggable optics

Data center density continues growing, driving interconnect technology to meet new challenges. Two of the largest are signal integrity and power consumption. Optical interconnects can solve many signal integrity issues posed by copper cabling and offer support for higher frequencies and bandwidths. Still, through sheer… Read More


Smarter, Faster LVS using Calibre nmLVS Recon

Smarter, Faster LVS using Calibre nmLVS Recon
by Daniel Payne on 09-18-2024 at 10:00 am

Calibre nmLVS Recon flow min

Back in the 1970s we did Layout Versus Schematic (LVS) checks manually, so when internal EDA tools arrived in the 1980s it was a huge time saver to use LVS in finding the differences between layout and schematics. One premise before running LVS is that both layout and schematics are complete and ready for comparisons. Fast forward… Read More


Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the Curtain

Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the Curtain
by Bernard Murphy on 09-18-2024 at 6:00 am

car 5 copy small

Even for experienced technologists some technologies can seem almost indistinguishable from magic. One example is the bird’s eye camera view available on your car’s infotainment screen. This view appears to be taken from a camera hovering tens of feet above your car. As an aid to parallel parking, it’s a brilliant invention; … Read More


Siemens EDA Offers a Comprehensive Guide to PCIe® Transport Security

Siemens EDA Offers a Comprehensive Guide to PCIe® Transport Security
by Mike Gianfagna on 09-17-2024 at 6:00 am

Siemens EDA Offers a Comprehensive Guide to PCIe Transport Security

It is well-known that there is more data being generated all the time. The need to store and process that data with less power and higher throughput dominates design considerations for virtually all systems. There is another dimension to the problem – ensuring the data is secure as all this movement and processing occurs. Within… Read More


Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products

Ansys and eShard Sign Agreement to Deliver Comprehensive Hardware Security Solution for Semiconductor Products
by Marc Swinnen on 09-12-2024 at 10:00 am

Probing

Integrated circuits, or chips, lie at the heart of today’s electronic systems that are mission critical for almost every sector of the economy – from healthcare, to banking, military equipment, cars, planes, telecommunications, and the internet itself. The data flowing through these systems is the lifeblood of modern… Read More


Calibre DesignEnhancer Improves Power Management Faster and Earlier

Calibre DesignEnhancer Improves Power Management Faster and Earlier
by Mike Gianfagna on 09-05-2024 at 6:00 am

Calibre DesignEnhancer Improves Power Management Faster and Earlier

Anyone who has attempted to implement a custom design in an advanced process node knows that effective power management can be quite challenging. Effects such as voltage (IR) drop and electromigration (EM) can present significant headaches for both design teams and foundries. Optimizing layouts for these kinds of issues is … Read More


Intel and Cadence Collaborate to Advance the All-Important UCIe Standard

Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
by Mike Gianfagna on 09-02-2024 at 10:00 am

Intel and Cadence Collaborate to Advance the All Important UCIe Standard

The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More


Keysight EDA and Engineering Lifecycle Management at #61DAC

Keysight EDA and Engineering Lifecycle Management at #61DAC
by Daniel Payne on 08-29-2024 at 10:00 am

Keysight EDA at 61DAC min

Entering the exhibit area of DAC on the first floor I was immediately faced with the Keysight EDA booth, and it was even larger than either the Synopsys or Cadence booths. They had a complete schedule of partners presenting in their theatre that included: Microsoft Azure, Riscure, Fermi Labs, BAE Systems, Alphawave, Intel Foundry,… Read More


Bug Hunting in NoCs. Innovation in Verification

Bug Hunting in NoCs. Innovation in Verification
by Bernard Murphy on 08-28-2024 at 6:00 am

Innovation New

Despite NoCs being finely tuned in legacy subsystems, when subsystems are connected in larger designs or even across multi-die structures, differing traffic policies and system-level delays between NoCs can introduce new opportunities for deadlocks, livelocks and other hazards. Paul Cunningham (GM, Verification at Cadence),… Read More