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Podcast EP302: How MathWorks Tools Are Used in Semiconductor and IP Design with Cristian Macario

Podcast EP302: How MathWorks Tools Are Used in Semiconductor and IP Design with Cristian Macario
by Daniel Nenni on 08-08-2025 at 10:00 am

Dan is joined by Cristian Macario, senior technical professional at MathWorks, where he leads global strategy for the semiconductor segment. With a background in electronics engineering and over 15 years of experience spanning semiconductor design, verification, and strategic marketing, Cristian bridges engineering … Read More


Software-defined Systems at #62DAC

Software-defined Systems at #62DAC
by Daniel Payne on 08-06-2025 at 10:00 am

siemens panel on software-defined systems min

Modern EVs are prime examples of software-defined systems, so I attended a #62DAC panel session hosted by Siemens to learn more from experts at Collins Aerospace, Arm, AMD and Siemens. Here’s the list of panelists that span several domains, and what follows is my paraphrase of the discussion topics.

Panel Discussion

Q: How does… Read More


DAC TechTalk – A Siemens and NVIDIA Perspective on Unlocking the Power of AI in EDA

DAC TechTalk – A Siemens and NVIDIA Perspective on Unlocking the Power of AI in EDA
by Mike Gianfagna on 08-05-2025 at 6:00 am

Screenshot

AI was everywhere at DAC. Presentations, panel discussions, research papers and poster sessions all had a strong dose of AI. At the DAC Pavillion on Monday two heavy weights in the industry, Siemens and NVIDIA took the stage to discuss AI for design, both present and future.  What made this event stand out for me was the substantial… Read More


Digital Implementation and AI at #62DAC

Digital Implementation and AI at #62DAC
by Daniel Payne on 08-04-2025 at 10:00 am

aprisa at #62dac

My first panel discussion at DAC 2025 was all about using AI for digital implementation, as Siemens has a digital implementation tool called Aprisa  which has been augmented with AI to produce better results, faster. Panelists were from Samsung, Broadcom, MaxLinear, AWS and Siemens. In the past it could take an SoC design team… Read More


Synopsys Webinar – Enabling Multi-Die Design with Intel

Synopsys Webinar – Enabling Multi-Die Design with Intel
by Mike Gianfagna on 08-04-2025 at 6:00 am

Synopsys Webinar – Enabling Multi Die Design with Intel

As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More


Google Cloud: Optimizing EDA for the Semiconductor Future

Google Cloud: Optimizing EDA for the Semiconductor Future
by Admin on 08-02-2025 at 5:00 pm

On July 9, 2025, a DACtv session featured a Google product manager discussing the strategic importance of electronic design automation (EDA) and how Google Cloud is optimizing it for the semiconductor industry, as presented in the YouTube video. The talk highlighted Google Cloud’s role in addressing the escalating complexity… Read More


Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use

Synopsys FlexEDA: Revolutionizing Chip Design with Cloud and Pay-Per-Use
by Admin on 08-02-2025 at 4:00 pm

On July 9, 2025, Vikram Bhatia, head of product management for Synopsys’ cloud platform, and Sashi Obilisetty, his R&D engineering counterpart, presented a DACtv session on Synopsys FlexEDA, as seen in the YouTube video. Drawing from three and a half years of data, the session showcased how this cloud-based, pay-per-use… Read More


Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA

Perforce and Siemens: A Strategic Partnership for Digital Threads in EDA
by Admin on 08-02-2025 at 3:00 pm

On July 9, 2025, Michael Munsey, VP of Semiconductor Industry at Siemens, and Vishal Moondhra, VP of Solutions at Perforce, presented a DACtv session announcing their strategic partnership, as seen in the YouTube video. This collaboration integrates Siemens’ digital twin and digital thread technologies with Perforce’s version… Read More


AI-Enhanced Chip Design: Pioneering the Future at DAC 2025

AI-Enhanced Chip Design: Pioneering the Future at DAC 2025
by Admin on 08-02-2025 at 2:00 pm

DAC 62 Systems on Chips

On July 9, 2025, a DACtv session illuminated the transformative role of artificial intelligence (AI) in chip design, as presented by Ankur Gupta of Siemens EDA in the YouTube video. The speaker explored how AI is revolutionizing electronic design automation (EDA), addressing the semiconductor industry’s challenges in managing… Read More


IBM Cloud: Enabling World-Class EDA Workflows

IBM Cloud: Enabling World-Class EDA Workflows
by Admin on 08-02-2025 at 1:00 pm

DAC 62 Systems on Chips

On July 9, 2025, Derren Dunn from IBM Research’s TJ Watson Research Center delivered a DACtv presentation, as seen in the YouTube video detailing IBM’s EDA-as-a-Solution platform. This innovative offering leverages IBM’s high-performance computing (HPC) cloud to deliver hybrid and cloud-only infrastructure for electronic… Read More