Okay, this is more of a, “What I would do if I was TSMC” than a critique, but I needed a one word descriptor for the title. This was the third TSMC OIP Conference and I would guess about 250 people attended. This was the first time I have seen TSMC in “reactive” mode versus “proactive” leadership mode, so I was a bit disappointed. TSMC is … Read More
Electronic Design Automation
Critical Area Analysis and Memory Redundancy
Simon Favre, one of our Calibre Technical Marketing Engineers, presented a paper on Critical Area Analysis and Memory Redundancy at the 2010 IEEE North Atlantic Test Workshop in Hopewell Junction, NY, just up the road from Fishkill. As Simon says…
Fishkill, New York. IBM is in Fishkill. IBM invented Critical Area Analysis in what,… Read More
Semiconductor Realization!
Insanity is doing the same thing over and over again and expecting different results (Albert Einstein). Given that statement, according to John Bruggeman (Cadence CMO and EDA360 Chief Anarchist) the semiconductor industry is INSANE!
This year the EDA Tech Forum and the Global Semiconductor Alliance Expo were not only on the … Read More
Atrenta Semiconductor Design in 3D!
My vote for most compelling technology at #47DAC is 3D technology. No, I don’t mean Hollywood-style 3D, I’m talking about vertical stacked-die system on chip design. This design approach basically means putting different parts of the system on different silicon substrates, so you can use the right technology for each part, and… Read More
Personal Message to Carl Icahn RE: MENT
According to an amended 13S filing, you now own 7.9% of Mentor Graphics, up from 6.86% disclosed on May 27th. Just what are you thinking!?!?!? Clearly you are a smart guy and you pretty much invented the game of corporate raidership, but EDA? Mentor Graphics? EDA does not need you, Mentor Graphics does not need you, I do not need you … Read More
TSMC Unveils First Ever AMS Reference Flow!
As a quick follow-up to my blog TSMC Extends Open Innovation Platform, TSMC today announced the Analog/Mixed Signal Reference Flow 1.0., another key collaborative component of TSMC’s Open Innovation Platform™.
The TSMC AMS Design Flow 1.0’s design package is integrated seamlessly on top of the 28nm interoperable process design… Read More
TSMC Extends Open Innovation Platform
TSMC today extended one of the most effective semiconductor design enablement initiatives the semiconductor world has ever seen, the Open Innovation Platform (OIP). Morris Chang coined the term “OIP” himself in 2008, but the effort itself is 10+ years old with a collective cost > .5B$. My other blogs on topic include: TSMC … Read More
TSMC versus GlobalFoundries: Semiconductor Design Enablement!
As mentioned in previous blogs, design enablement is a key enabler to fabless semiconductor design and manufacture, without question. The purpose of this blog (in 500 words) is to compare and contrast two very different design enablement strategies and engage the semiconductor community in a meaningful discussion.
The GlobalFoundry… Read More
TSMC OIP vs CDNS OIP Analysis
Launched in April 2008, the TSMC OIP initiative is a collaborative strategy aimed at breaking down the barriers of semiconductor design enablement in order to reduce waste and increase the profitability of the industry as a whole.
The TSMC Open Innovation Platform promotes timeliness-driven innovation amongst the semiconductor… Read More
Cadence EDA360 Redux!
“Cadence Design Systems, Inc. (NASDAQ: CDNS), the global leader in EDA360………”
Of course, why wouldn’t Cadence be the global leader in something they just made up? As a follow-up to my yawningly successful blog Cadence EDA360 Manifesto:
One of the problems I have with EDA360 is the fear, uncertainty, and doubt (FUD) it attempts … Read More
TSMC N3 Process Technology Wiki