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Samsung 14nm FinFET Design with Cadence Tools

Samsung 14nm FinFET Design with Cadence Tools
by Daniel Payne on 09-22-2014 at 5:30 pm

The first consumer products with 20nm processing are arriving in 2014 like the 2 billion transistor A8 chip in the iPhone 6, however at the 14nm node there are new designs underway to continue the trend of Moore’s Law. To get a better feel for the challenges of designing with 14nm FinFET technology I watched a 23 minute video … Read More


Expansion at Calypto through Real Value Addition in SoC Design

Expansion at Calypto through Real Value Addition in SoC Design
by Pawan Fangaria on 09-22-2014 at 1:00 pm

When we get the notion of expansion of a company, it always provides a positive picture about something good happening to boost that expansion. There can be several reasons for expansion such as merger & acquisition, formation of joint venture or partnership, large customer orders and so on. However, organic expansion which… Read More


Is Number of Signoff Corners an Issue?

Is Number of Signoff Corners an Issue?
by Daniel Nenni on 09-22-2014 at 12:00 am

Semiconductor companies continue to use the traditional corner-based signoff approach that has been developed more than 40+ years ago and has since remained mainly unchanged as an industry paradigm. Initially it had 2 corners, namely Worst Case (WC) and Best Case (BC) with the maximum and minimum cell delay respectively. Note… Read More


TCAD to SPICE

TCAD to SPICE
by admin on 09-21-2014 at 7:00 am

Power devices have historically been made from silicon (Si), which has reached the limit of electric power loss reduction. With the superior physical and electrical properties of silicon carbide (SiC), we can expect to see a significant expansion in the amount of electric power conversion of electrical equipment as well as reduced… Read More


MEMS+, Bringing MEMS into the Electronic World

MEMS+, Bringing MEMS into the Electronic World
by Paul McLellan on 09-19-2014 at 1:59 pm

One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics necessary to process the signal from the sensor and end up with something… Read More


Designing the Right Architecture Using HLS

Designing the Right Architecture Using HLS
by Pawan Fangaria on 09-17-2014 at 9:05 am

With the advent of HLS tools, general notion which comes to mind is that okay, there’s an automated tool which can optimize your design description written in C++/SystemC and provide you a perfect RTL. In real life, it’s not so, any design description needs hardware designer’s expertise to adopt right algorithm and architecture… Read More


Optimize Your Interconnect & Design at System Level for Best Results

Optimize Your Interconnect & Design at System Level for Best Results
by Pawan Fangaria on 09-16-2014 at 7:00 am

As the SoC design size, complexity and functionality keeps on increasing with multiple IPs packed together and design time and time-to-market keeps on decreasing amid critical constraints on PPA, there is no other alternative than to do the design first-time-right not to miss the window of opportunity. And that could be possible… Read More


Taiwan Trip Report: The Coming Simulation Crisis!

Taiwan Trip Report: The Coming Simulation Crisis!
by Daniel Nenni on 09-15-2014 at 7:00 am

Even though the flight to Taiwan is somewhat difficult, I really do enjoy my trips to Hsinchu. In addition to the top two pure-play foundries being there, one of the top SoC companies (MediaTek) and many of the leading semiconductor design companies are there as well. All are a quick taxi ride from my home away from home, the Hotel Royal.… Read More


Expert Tool to View and Debug Design Issues at Spice Level

Expert Tool to View and Debug Design Issues at Spice Level
by Pawan Fangaria on 09-12-2014 at 7:00 am

Spice view of a design, block or fragment of the design is probably the lowest level of functional description of a circuit in terms of transistors, resistors, capacitors, interconnect and so on, which in several ways acts as an ultimate proof of pudding for any semiconductor design before manufacturing. However, it’s generally… Read More


Transceiver Verification of a 20nm Altera FPGA Device

Transceiver Verification of a 20nm Altera FPGA Device
by Daniel Payne on 09-11-2014 at 6:00 pm

FPGA devices are a great way to drive silicon technology development because they contain both digital and analog IP, along with sophisticated IO cells. The highest performance IOs are transceivers, and Altera has recently designed the Arria 10 device family to include up to 96 transceivers, using a 20nm technology that can achieve… Read More