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Variation at IEDM

Variation at IEDM
by Paul McLellan on 12-05-2014 at 7:01 am

IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).

For the last few years on the Tuesday… Read More


HLS – Major Improvement through Generations

HLS – Major Improvement through Generations
by Pawan Fangaria on 12-02-2014 at 6:30 pm

I am a believer of continuous improvement in anything we do; it’s pleasant to see rapid innovation in technology these days, especially in semiconductor space – technology, design, tools, methodologies… Imagine a 100K gates up to 1M gates design running at a few hundred MHz frequency and at technology node in the range of .18 to … Read More


Design Rule Checking (DRC) Meets New Challenges

Design Rule Checking (DRC) Meets New Challenges
by Daniel Payne on 12-02-2014 at 7:00 am

The traditional batch-oriented DRC process run as a final check to ensure compliance with foundry yield goals is quickly moving toward a concurrent DRC process performed early and often throughout design, especially at the 28 nm and smaller process nodes. What are the technology factors causing this change?

  • Increasing number
Read More

Don’t Mess with SerDes!

Don’t Mess with SerDes!
by Eric Esteve on 12-01-2014 at 2:23 am

SerDes stands for Serializer/Deserializer, and SerDes is a serious piece of design, requiring an extremely experienced team of analog engineers (below 10 years’ experience, you’re still a quasi-beginner). Better to rely on an analog guru to draw the SerDes architecture and manage the team! Why does SerDes is becoming more and… Read More


Solution for PI, TI & SI Issues in 3D-ICs

Solution for PI, TI & SI Issues in 3D-ICs
by Pawan Fangaria on 11-30-2014 at 7:00 pm

As we move towards packing more and more functionalities and increasing densities of SoCs, the power, thermal and signal integrity issues keep on rising. 3D-IC is a great concept to stack multiple dies on top of each other vertically. While it brings lot of avenues to package dies with multiple functions together, it has challenges… Read More


How to Optimize for Power at RTL

How to Optimize for Power at RTL
by Daniel Payne on 11-30-2014 at 7:00 pm

Last week I was traveling in Munich attending the MunEDA User Group meetingso I missed a live webinar on the topic of optimizing for power at RTL. I finally got caught up in my email this week and had time to view this 47 minute webinar, presented by Guillaume Boilletof Atrenta. He recommended using a combination of automatic, semi-automatic… Read More


IC Place and Route for AMS Designs

IC Place and Route for AMS Designs
by Daniel Payne on 11-30-2014 at 7:00 am

High-capacity IC place and route (P&R) tools can cost $200K and more to own from the big three vendors (Cadence, Synopsys, Mentor), but what about IC designs that are primarily Big Analog and Little Digital? In the EDA world we often have multiple choices for tools, and there are affordable alternatives to place and route out… Read More


Filling the Gap between Design Planning & Implementation

Filling the Gap between Design Planning & Implementation
by Pawan Fangaria on 11-29-2014 at 7:00 pm

As every other person is talking about IoT today, Michael Munsey of Dassault Systemes looks at this trend in the context of critical success factors and Dassault’s strategy towards providing semiconductor solution that integrates the design chain and continues to keep the semiconductor eco-system healthy and profitable. … Read More


Verification plans overcome hope-based coverage

Verification plans overcome hope-based coverage
by Don Dingee on 11-29-2014 at 7:00 am

Coverage is an important yet elusive metric for design verification. It often seems 90% of coverage comes with 10% of the effort, and getting the final 10% covered takes the remaining 90% of a project. Usually, it takes another tool or methodology to get at the 10% the first tool missed. With 100% closure difficult, most teams inspect… Read More


IC Design at ZMDI

IC Design at ZMDI
by Daniel Payne on 11-28-2014 at 7:00 pm

As a blogger I have the privilege of meeting many IC designers from around the world, mostly through contact on LinkedIn or from connecting at trade shows. Through a contact at DACI met up with Achim Graupner, a manager of methodology and design automation from ZMDI, then asked him for an interview to understand how his group does … Read More