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Electronic Design Automation
At the Design Automation Conference, no one is busier than an EDA company executive — conference panels, product launch briefings, customer meetings, and corporate dinners all place considerable demands on their time. I was fortunate enough to be able to meet with Anirudh Devgan, President of Cadence, at the recent DAC55 in San… Read More
Supporting NB-IoT requires low cost (optimized silicon footprint) and ultra-low power solution to cope with IoT device requirement. Cadence Fusion F1 DSP IP has been integrated in modem IC by two new customers, Xinyi and Rafael, gaining traction in NB-IoT market. These design-win builds on previous momentum: software GPS solution… Read More
When DARPA plans programs, they’re known for going big – really big. Which is what they are doing again with their Electronics Resurgence Initiative (ERI). Abstracting from their intro, this is a program “to ensure far-reaching improvements in electronics performance well beyond the limits of traditional scaling”. This isn’t… Read More
The timelines proposed by automobile manufacturers for enabling fully autonomous driving are extremely aggressive. At the recent DAC55 conference in San Francisco, I attended a panel discussion on Functional Safety issues for assisted and autonomous driving, sponsored by Mentor Graphics. I also had the opportunity to chat… Read More
Automotive applications are having a tremendous influence on semiconductor design. This influence is coming from innovations in cloud computing, artificial intelligence, communications, sensors that all serve the requirements of the automotive market. It should come as no surprise that ADAS and autonomous driving are … Read More
Earlier physical optimization impacts a design QoR gain and can disclose potential hurdles in dealing with unknown design variants such as new IP inclusion or new process node issues. Along the RTL-to-GDS2 implementation continuum, a left-shift move requires a robust modeling and proper context captures in order to produce… Read More
At DAC 2018, Synopsys held a lunch panel discussing verification challenges faced by the industry leaders, their adopted approaches and the overall verification technology trends. This panel of industry experts from Intel, AMD, Samsung, STM and Qualcomm also shared their viewpoints on what drives the SoC complexity and how… Read More
I attended on Monday, June 25, DAC’s Opening Day, a Cadence-sponsored Lunch panel. Ann Steffora Mutschler (Semiconductor Engineering) was the Moderator and the Panelists were Jim Hogan (Vista Ventures), David Lacey (HP Enterprise), Shigeo Oshima (Toshiba Memory Corp), Paul Cunningham (Cadence).… Read More
My IC design career started out with circuit design of DRAMS, so I got to quickly learn all about transistor-level design at the number one IDM in the world, Intel at the time. In the early days, circa 1978 we circuit designers actually had few EDA tools, mostly a SPICE circuit simulator followed by manual extraction, manual netlisting,… Read More
Getting your tape-out done on time is hard, but can it be made easier? That was the main topic of Mentor’s Calibre Panel held at DAC 2018, attended by a few key players in IC design ecosystem: Bob Stear, VP of Marketing at Samsung represented the foundry side; from the IP side, Prasad Subramaniam, VP of eSilicon for R&D and Technology;… Read More
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Musk’s new job as Samsung Fab Manager – Can he disrupt chip making? Intel outside