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DAC 2021 – Siemens EDA talks about using the Cloud

DAC 2021 – Siemens EDA talks about using the Cloud
by Daniel Payne on 12-21-2021 at 10:00 am

Craig Johnson

My third event at DAC on Monday was all about using EDA tools in the Cloud, and so I listened to Craig Johnson, VP EDA Cloud Solutions, Siemens EDA. Early in the day I heard from Joe Sawicki, Siemens EDA, on the topic of Digitalization.

Why even use the Cloud for EDA? That’s a fair question to ask, and Craig had several high-level… Read More


Topics for Innovation in Verification

Topics for Innovation in Verification
by Bernard Murphy on 12-21-2021 at 6:00 am

signpost min

Paul, Raúl and I are having fun with our Innovation in Verification series, and you seem to be also, judging by the hit rates we’re getting. We track these carefully to judge what you find most interesting and what seems to fall more under the category of “Meh”. Paul and others also get informal feedback in client meetings but it would… Read More


DAC 2021 Wrap-up – S2C turns more than a few heads

DAC 2021 Wrap-up – S2C turns more than a few heads
by Ron Green on 12-20-2021 at 10:00 am

IMG 7547

Now that the 58th Design Automation Conference held this year in San Francisco has concluded, we take a minute to look back at the results and ascertain what it meant for our company.

Unfortunately, many popular tradeshows held in the time of Covid have suffered a drop in attendance, and DAC was no exception. Despite this however,… Read More


Podcast EP53: Breker’s New CEO Weighs in on the Company, DAC and the Future of Verification

Podcast EP53: Breker’s New CEO Weighs in on the Company, DAC and the Future of Verification
by Daniel Nenni on 12-17-2021 at 10:00 am

Dan is joined by Dave Kelf, who was recently appointed CEO of Breker Verification Systems. Dave discusses Breker’s unique approach to verification of complex systems, what its future impact will be and what Breker will be doing at DAC.

The views, thoughts, and opinions expressed in these podcasts belong solely to the

Read More

Is Ansys Reviving the Collaborative Business Model in EDA?

Is Ansys Reviving the Collaborative Business Model in EDA?
by Daniel Nenni on 12-16-2021 at 10:00 am

Evolution of Multiphysics Complexity

The Electronic Design Automation (EDA) industry used to be a bustling bazaar of scrappy startups, along with medium sized companies that dominated a technology space, and big main-line vendors. The annual Design Automation Conference was noisy, hectic, and sprawled over multiple large convention halls. This diversity meant… Read More


Top 10 Takeaways from DAC 2021

Top 10 Takeaways from DAC 2021
by Tom Dillinger on 12-15-2021 at 2:00 pm

stopped clock license model

The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco.  (As several presenters were unable to attend, a “virtual” program is also available.)  The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms;  new features in commercial EDA tools; … Read More


DAC 2021 – Joe Sawicki explains Digitalization

DAC 2021 – Joe Sawicki explains Digitalization
by Daniel Payne on 12-13-2021 at 10:00 am

semiconductor content min

Monday at DAC this year started off on a very optimistic note as Joe Sawicki from Siemens EDA presented in the Pavilion on the topic of Digitalization, a frequent theme in the popular press because of the whole Work From Home transition that we’ve gone through during the pandemic. Several industries are benefiting from the… Read More


A Practical Approach to Better Thermal Analysis for Chip and Package

A Practical Approach to Better Thermal Analysis for Chip and Package
by Daniel Nenni on 12-13-2021 at 6:00 am

ANSYS Thermal Chip Model

Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory ControllerRead More


Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum

Ansys CEO Ajei Gopal’s Keynote on 3D-IC at Samsung SAFE Forum
by Tom Simon on 12-09-2021 at 10:00 am

Ajei Gopal talks about 3D IC

System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development.  Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More