SILVACO 073125 Webinar 800x100
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Why IP Designers Don’t Like Surprises!

Why IP Designers Don’t Like Surprises!
by Daniel Nenni on 03-13-2020 at 6:00 am

IPDelta SemiWiki

If it’s your job to get a SoC design through synthesis, timing/power closure and final verification, the last thing you need are surprises in new versions of the IP blocks that are integrated into the design. If your IP supplier sends a new version, the best possible scenario is that this is only a small incremental change from… Read More


Viewing the Largest IC Layout Files Quickly

Viewing the Largest IC Layout Files Quickly
by Daniel Payne on 03-10-2020 at 6:00 am

Skipper, Empyrean

The old adage, “Time is money”, certainly rings true today for IC designers, so the entire EDA industry has focused on this challenging goal of making tools that help speed up design and physical verification tasks like DRC (Design Rule Checks) and LVS (Layout Versus Schematic). Sure, the big three EDA vendors have… Read More


Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards

Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards
by Daniel Nenni on 03-09-2020 at 6:00 am

Aldec Webinar SemiWiki

Before starting your next FPGA Prototyping Project you should catch the next SemiWiki webinar – “Six Automated Steps to Design Partitioning for Multi-FPGA Prototyping Boards”, in partnership with Aldec.

A significant portion of my  30+ years in the EDA industry has revolved around design verification with some form of FPGA … Read More


Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips

Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips
by Mike Gianfagna on 03-04-2020 at 10:00 am

IBIS AMI vs. Transient

At DesignCon 2020, there was a presentation by Micron, Socionext and Cadence that discussed design challenges and strategies for using the new low-power DDR specification (LPDDR5). As is the case with many presentations at DesignCon, ecosystem collaboration was emphasized. Justin Butterfield (senior engineer at Micron)… Read More


Reliability Challenges in Advanced Packages and Boards

Reliability Challenges in Advanced Packages and Boards
by Herb Reiter on 03-02-2020 at 10:00 am

CTE Stress ANSYS SemiWiki

Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More


An Important Step in Tackling the Debug Monster

An Important Step in Tackling the Debug Monster
by Daniel Nenni on 02-28-2020 at 6:00 am

AMIQ EDA Compare Report SemiWiki

If you’ve spent any time at all in the semiconductor industry, you’ve heard the statement that verification consumes two-thirds or more of the total resources on a chip project. The estimates range up to 80%, in which case verification is taking four times the effort of the design process. The exact ratio is subject to debate, but… Read More


Mentor Helps Mythic Implement Analog Approach to AI

Mentor Helps Mythic Implement Analog Approach to AI
by Tom Simon on 02-27-2020 at 6:00 am

Mythic AMS Verification Challenges

The entire field of Artificial Intelligence (AI) has resulted from what is called “first principles thinking”, where problems are re-examined using a complete reassessment of the underlying issues and potential solutions. It is a testament to how effective this can be that AI is being used for a rapidly expanding number of applications… Read More


Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect

Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect
by Mike Gianfagna on 02-26-2020 at 10:00 am

2D vs. 3D heat maps

At DesignCon 2020, ANSYS held a series of sponsored presentations. I was able to attend a couple of them.  These were excellent events with the material delivered by talented and high-energy speakers. The DesignCon technical program has many dimensions beyond the conference tracks. One of the presentations dealt with 3D ICs.… Read More


Build Custom SoC Assembly Platforms

Build Custom SoC Assembly Platforms
by Bernard Murphy on 02-25-2020 at 6:00 am

STAR RTL design builder

I’ve talked with Defacto on and off for several years – Chouki Aktouf (CEO) and Bastien Gratreaux (Marketing). I was in a similar line of business back in Atrenta. Now I’m just enjoying myself, I’ve written a few blogs for them. I’ll confess I wondered why they wouldn’t struggle with the same problems we’d had. Script-driven RTL editing,… Read More


Webinar on Concurrent Electro-Thermal Analysis for PowerMOS Devices to Improve Performance and Reliability

Webinar on Concurrent Electro-Thermal Analysis for PowerMOS Devices to Improve Performance and Reliability
by Tom Simon on 02-20-2020 at 10:00 am

PTM-ET Sidecut view

PowerMOS devices play a major role in a variety of power converter and control circuits. Some examples of their applications include PMICs, or boost and buck converters. Often these are used in mobile and IoT devices to convert battery voltages to circuit operating voltages.

Due to their size and internal complexity PowerMOS … Read More