This informative webinar discusses a significant issue that is cropping up for sub-5nm designs. As the graphic above shows, modeling uncertainty at advanced nodes results in excessive guard banding. These guard bands result in reduced performance and profit. A loss of 25 – 35% in PPA is discussed, along with the lost profit associated… Read More
Electronic Design Automation
Podcast EP337: The Importance of Network Communications to Enable AI Workloads with Abhinav Kothiala
Daniel is joined by Abhinav Kothiala, a principal product manager for the Synopsys Ethernet IP portfolio. He has over 12 years of experience across engineering and product management, spanning SoC design, functional verification, and building wireless connectivity platforms and IoT products. He also holds two patents in… Read More
Synopsys Advances Hardware Assisted Verification for the AI Era
At the 2026 Synopsys Converge Event, Synopsys announced a broad set of new products and platform upgrades, with its hardware-assisted verification (HAV) announcement emerging as a key highlight within that lineup. A key aspect of this announcement was moving beyond a hardware centric model to a more scalable, programmable … Read More
Post-Silicon Validating an MMU. Innovation in Verification
Some post-silicon bugs are unavoidable, but we’re getting better at catching them before we ship. Here we look at a method based on a bare-metal exerciser to stress-test the MMU. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More
Securing UALink in AI clusters with UALinkSec-compliant IP
A classic networking problem is securing connections with encrypted data, but implementing strong encryption algorithms at wire speeds can limit performance. However, introducing blazing-fast connectivity without an encryption strategy leaves systems vulnerable. The architects in the UALink Consortium, including … Read More
Scaling Multi-Die Connectivity: Automated Routing for High-Speed Interfaces
This article concludes the three-part series examining key methodologies required for successful multi-die design. The first article Reducing Risk Early: Multi-Die Design Feasibility Exploration focused on feasibility exploration and early architectural validation, while the second article Building the Interconnect… Read More
WEBINAR: Reclaiming Clock Margin at 3nm and Below
At 3nm and below, clock networks have quietly become the dominant limiter of SoC power, performance, and yield. Yet most advanced-node designs still rely on abstraction-based signoff methodologies developed when voltage headroom was generous and interconnect effects were secondary.
That assumption no longer holds
As supply… Read More
Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design Enablement
The recent Chiplet Summit in Santa Clara was buzzing with new designs and new design methods. It felt like the industry had turned a corner at this year’s event with lots of new technology and design success on display. Siemens EDA had a large presence at the show and took home the Best in Show Award for Packaging Design. There were a … Read More
Siemens Fuse EDA AI Agent Releases to Orchestrate Agentic Semiconductor and PCB Design
Though terminology sometimes get fuzzy, consensus holds that an agent manages a bounded task with control through a natural language interface. An agentic orchestrator, itself an agent, manages a more complex objective requiring reasoning through multi-step actions and is responsible for orchestrating those actions. By… Read More
Accelerating Computational Lithography Using Massively Parallel GPU Rasterizer
As semiconductor manufacturing pushes deeper into the nanometer regime, computational lithography has evolved from a supporting step into a central pillar of advanced chip design. Mask synthesis, lithography simulation, and optical proximity correction (OPC) now demand unprecedented levels of accuracy and computational… Read More


Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era