Synopsys Multi Die Webinar 800x100
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4104
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4104
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys

Achieving Seamless 1.6 Tbps Interoperability for High BW HPC AI/ML SoCs: A Technical Webinar with Samtec and Synopsys
by Daniel Nenni on 04-17-2025 at 10:00 am

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HPC Bandwidth Explosion and 1.6T Ecosystem Interop Need

The exponential growth in data bandwidth requirements driven by HPC systems, AI, and ML applications has set the stage for an ever-increasing need for 1.6Tbps Ethernet. As data centers strive to manage vast data transfers with maximum efficiency, the urgency for interoperability… Read More


SNUG 2025: A Watershed Moment for EDA – Part 1

SNUG 2025: A Watershed Moment for EDA – Part 1
by Lauro Rizzatti on 04-15-2025 at 6:00 am

SNUG 2025 A Watershed Moment for EDA Figure 1

Hot on the heels of DVConUS 2025, the 35th annual Synopsys User Group (SNUG) Conference made its mark as a defining moment in the evolution of Synopsys—and the broader electronic design automation (EDA) industry. This year’s milestone event not only underscored Synopsys’ continued innovation but also affirmed the vision… Read More


Balancing the Demands of OTP for Advanced Nodes with Synopsys IP

Balancing the Demands of OTP for Advanced Nodes with Synopsys IP
by Mike Gianfagna on 04-14-2025 at 6:00 am

Balancing the Demands of OTP for Advanced Nodes with Synopsys IP

One-time programmable (OTP) non-volatile memory has been around for a long time. Compared to other non-volatile memory technologies OTP has a smaller footprint and does not require additional manufacturing steps, making it a popular choice to store items such as boot code and encryption keys. While this sounds simple, the growth… Read More


Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape

Synopsys Webinar: The Importance of Security in Multi-Die Designs – Navigating the Complex Landscape
by Daniel Nenni on 04-11-2025 at 6:00 am

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In today’s rapidly evolving digital landscape, the security of electronic systems is of the highest priority. This importance is underscored by technological advancements and increasing regulatory demands. Multi-die designs which integrate multiple dies (also called chiplets) into a single package, introduce … Read More


Generative AI Comes to High-Level Design

Generative AI Comes to High-Level Design
by Daniel Payne on 04-10-2025 at 10:00 am

high level agents min

I’ve watched the EDA industry change the level of design abstraction starting from transistor-level to gate-level, then RTL, and finally using High Level Synthesis (HLS). Another emerging software trend is the use of generative AI to make coding RTL more automated. There’s a new EDA company called Rise Design Automation that… Read More


Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation

Synopsys Executive Forum: Driving Silicon and Systems Engineering Innovation
by Kalar Rajendiran on 04-09-2025 at 10:00 am

Sassine Keynote (with Satya)

The annual SNUG (Synopsys Users Group) conference, now in its 35th year, once again brought together key stakeholders to showcase accomplishments, discuss challenges, and explore opportunities within the semiconductor and electronics industry. With approximately 2,500 attendees, SNUG 2025 served as a dynamic hub for collaboration… Read More


A Synopsys Webinar Detailing IP Requirements for Advanced AI Chips

A Synopsys Webinar Detailing IP Requirements for Advanced AI Chips
by Mike Gianfagna on 04-03-2025 at 10:00 am

A Synopsys Webinar Detailing IP Requirements for Advanced AI Chips

Generative AI is dramatically changing the compute power that must be delivered by advanced designs. This demand has risen by more than 10,000 times in the past five to six years.  This increased demand has impacted the entire SoC design flow. We are now faced with going beyond 1 trillion transistors per chip, and systems now consist… Read More


Big Picture PSS and Perspec Deployment

Big Picture PSS and Perspec Deployment
by Bernard Murphy on 04-02-2025 at 6:00 am

semiconductor design realization

I met Moshik Rubin (Sr. Group Director, Product Marketing and BizDev in the System Verification Group at Cadence) at DVCon to talk about PSS (the Portable Stimulus Standard) and Perspec, Cadence’s platform to support PSS.  This was the big picture view I was hoping for, following more down in the details views from earlier talks.… Read More


Evolution of Memory Test and Repair: From Silicon Design to AI-Driven Architectures

Evolution of Memory Test and Repair: From Silicon Design to AI-Driven Architectures
by Kalar Rajendiran on 04-01-2025 at 6:00 am

STAR Memory System (SMS) Solution

Memory testing in the early days of computing was a relatively straightforward process. Designers relied on simple, deterministic approaches to verify the functionality of memory modules. However, as memory density increased and systems became more complex, the likelihood of faults also rose. With advancements in memory… Read More


An Important Advance in Analog Verification

An Important Advance in Analog Verification
by Bernard Murphy on 03-31-2025 at 6:00 am

Acclerating design exploration min

Innovation in analog design moves slowly, not from lack of desire for better methods from designers or lack of effort and ideas from design tech innovators, but simply because the space is so challenging. Continuous time and signals, and variances in ambient/process characteristics represent a multi-dimensional space across… Read More