Load-pull power amplifier (PA) design techniques determine the optimal impedances at the power transistor’s extrinsic reference plane, which is the physically accessible boundary for measurement or simulation. This reference plane can be the package transistor leads, die bond pads, or IC chip terminals. It includes… Read More
Electronic Design Automation
Podcast EP342: The Evolution and Impact of Physical AI with Hezi Saar
Daniel is joined by Hezi Saar, Executive Director of Product Marketing at Synopsys, Hezi is responsible for the mobile, automotive, and consumer IP product lines. He brings more than 20 years of experience in the semiconductor and embedded systems industries.
Dan explores the growing field of physical AI with Hezi, who explains… Read More
Speculation: Silicon’s Most Expensive Compulsion
How Time-Based Scheduling
Reclaims Silicon Wasted by Speculative Execution
By: Dr. Thang Tran, Founder and CTO, Simplex Micro
I have spent my career designing processor architectures, and I have reached an uncomfortable conclusion: a substantial fraction of the silicon area and power in modern high-performance processors… Read More
WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence
This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there.
The semiconductor industry faces unprecedented challenges as it pushes toward advanced nodes below 3nm, managing exponential… Read More
Exploring the Hidden Complexity of Modern Power Electronics Design – A Siemens White Paper
Review the specifications of any state-of-the-art microcontroller and you will discover the high dynamic current the device can consume. Examining the high clock rates and low tolerable voltage drop will lead you to the all-important power delivery network, or PDN. Components here include power planes, layer stack-up, decoupling… Read More
Podcast EP340: A Review of the Q4 2025 Electronic Design Market Data Report with Wally Rhines
Daniel is joined by Dr. Wally Rhines, CEO of Silvaco, to discuss the Electronic Design Market Data report that was just released. Wally is the industry coordinator for the EDA data collection program called EDMD. SEMI and the Electronic System Design Alliance collect data from almost all electronic design automation companies… Read More
From Wooden Boards to White Gloves: How FPGA Prototyping and Emulation Became Two Worlds of Verification… and How the Convergence Is Unfolding
FPGA prototyping and hardware emulation originated from two independent demands that emerged at roughly the same time, namely, the necessity to implement digital designs in reconfigurable hardware. This was conceivable given the newly introduced field programmable gate array (FPGA) device.
Yet from the very beginning they… Read More
yieldHUB Expands Its Impact with New Technology and a New Website
yieldHUB is a unique company that focuses on yield optimization for the semiconductor industry. The company aims to bring engineering teams together with a platform that allows sharing of data analytics and knowledge about products to improve yield. This goal is certainly fueled by unifying data from multiple steps in the manufacturing… Read More
From SoC to System-in-Package: Transforming Automotive Compute with Multi-Die Integration
Modern automotive electronics are undergoing a rapid transformation driven by increasing compute demands, functional safety requirements, and the shift toward scalable semiconductor architectures. One of the most significant technological developments enabling this transformation is the adoption of multi-die system… Read More
yieldWerx Delivers a Master Class in Co-Packaged Photonics Implementation
We all know the semiconductor industry is seeing a new era of data intensity. The industry’s response includes advanced semiconductor design strategies, the adoption of chiplets, and the integration of optical I/O and photonics to enable higher performance, faster AI computation, and increased modularity. Co-packaged photonics… Read More


Disaggregating LLM Inference: Inside the SambaNova Intel Heterogeneous Compute Blueprint