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Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang

Podcast EP352: The Path to High Impact Parallel AI Agents with ChipAgents CEO and Founder William Wang
by Daniel Nenni on 06-26-2026 at 10:00 am

Daniel is joined by William Wang the CEO and Founder of ChipAgents.ai, the category-leading agentic AI platform for advancing agent-based AI approaches for semiconductor workflows. He is also the Mellichamp Endowed Chair Professor of AI and Designs at UC Santa Barbara, and a global leader in fundamental AI research. He founded… Read More


How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late
by Mike Gianfagna on 06-25-2026 at 10:00 am

How to Free Yourself from Inconsistent Engineering Documentation Before It’s Too Late

Embedded systems programs often fail because critical engineering documentation drifts out of alignment over time and distance. This results in a team that is correctly following the wrong instructions. All forms of engineering documentation suffer from this problem, and it really is the silent killer of many programs.

llmda.aiRead More


All-Embracing Multiphysics Analysis for Chiplet-Based Systems

All-Embracing Multiphysics Analysis for Chiplet-Based Systems
by Bernard Murphy on 06-24-2026 at 6:00 am

Revised multiphysics graphic

What systems can accomplish by combining semiconductors, AI, and software seems at times boundless. Chiplet-based semiconductors deliver this promise, allowing a myriad of complex digital, memory, analog and photonic functions to be condensed into a single semiconductor package for higher performance, lower power consumption… Read More


AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption

AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoption
by raghu shankar on 06-22-2026 at 6:00 am

2026 Jun AI Native Virtual Chiplet ecosystem Shift Left Shift Up Shift Out

Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More


Podcast EP351: A Detailed Overview of the Emerging Standards for 400G with Kent Lusted

Podcast EP351: A Detailed Overview of the Emerging Standards for 400G with Kent Lusted
by Daniel Nenni on 06-19-2026 at 10:00 am

Daniel is joined by Kent Lusted, a Distinguished Architect at Synopsys and an integral part of the company’s Ethernet IP design team. He has been an active contributor and member of the IEEE 802.3 Ethernet PHY standards development leadership team for more than 15 years. Prior to Synopsys, Kent worked at Intel for 30+ years, focused… Read More


The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes

The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
by Daniel Nenni on 06-19-2026 at 6:00 am

Intel and PDF Solutions Tackle Advanced Nodes

One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.

On the outside PDF Solutions is a publicly traded semiconductor… Read More


Webinar: Faster Design Spec to Implementation using IP-XACT

Webinar: Faster Design Spec to Implementation using IP-XACT
by Daniel Payne on 06-18-2026 at 10:00 am

SoC Compiler

As SoC design flows grow increasingly complex, IP-XACT has become a cornerstone standard throughout the entire development lifecycle: from architecture specification to design assembly and verification. Its growing adoption is reflected in the standard’s continuous evolution, from the 2009 release through 2014… Read More


Feed Forward Intelligence: Enabling Testability in the Chiplets Era

Feed Forward Intelligence: Enabling Testability in the Chiplets Era
by Kalar Rajendiran on 06-18-2026 at 6:00 am

Data Feed Forward Architecture

The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More


Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions

Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
by Daniel Nenni on 06-17-2026 at 2:00 pm

Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions

Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More


PowerArtist RTL Power Estimation Folds into Keysight

PowerArtist RTL Power Estimation Folds into Keysight
by Bernard Murphy on 06-17-2026 at 6:00 am

PowerArtist exploring and fixing hotspots in a GPU

Back in the late 1990s, Sente launched a product called WattWatcher to estimate power from design RTL and simulation activity. This was revolutionary for its time since alternatives, while very accurate, only offered power analysis at the gate level. Gate-level analysis is great for fine-tuning power but is unhelpful for achieving… Read More