On Tuesday at #DAC2026 I attended the exhibitor presentation, Synopsys: How Silicon Startups are Addressing the AI Memory Gap. Vikram Bhatia from Synopsys introduced the two presentations from Wenbo Yin, SVP of IC Design at TetraMem and R. Scott Hills, VP of Business Development at ANAFLASH. Datacenters consume large amounts… Read More
Electronic Design Automation
When Design Gets Faster, the Bottleneck Moves Through the Physical Stack
AI can compress the path to tape-out. The next challenge is compressing physical realization.
Something important is beginning to happen in semiconductor development: the design cycle itself is becoming compressible.
AI-assisted engineering can accelerate architecture exploration, RTL development, verification, physical… Read More
Podcast EP364: The Broad Impact of Advanced Mask Solutions, Today and Tomorrow with Dr. Germain Fenger
Daniel is joined by Dr. Germain Fenger, Senior Director of Product Management at Synopsys where he leads advanced mask solutions and computational lithography technologies. With a background spanning semiconductor manufacturing, lithography research, engineering, and product leadership, Germain has held roles at imec,… Read More
The $9.5 Billion Design IP Market: Shifting Boundaries, Arm’s Monopoly, and the RISC-V Response
While semiconductor design intellectual property (IP) is a $9.45 billion market, it acts as the absolute architectural bottleneck for the entire global semiconductor value chain. The choices made at the IP layer today dictate the cost, power, and security of a downstream technology economy rapidly marching toward a trillion… Read More
Technical Case Study: MicroLED Yield Management with Plessey and yieldWerx
Plessey Semiconductors manufactures monolithic MicroLED displays for near-eye augmented-reality systems, where pixel pitch, brightness, uniformity, and defect density directly determine usable yield. Its process integrates device design, epitaxy, wafer fabrication, bonding, and production in one facility. The displays… Read More
Unified Emulation and Prototyping: Pipedream or Reality?
Preamble
Hardware-assisted verification (HAV) platforms, including hardware emulators and FPGA-based prototyping systems, are the two dominant methodologies for validating long workloads on complex System-on-Chip (SoC) designs before tape-out. HAV sits within a broader continuum of verification engines: simulation… Read More
DAC 2026: A Discussion of Who Owns the Intelligence Behind Tomorrow’s Chips and How to Make it Better
The industry is moving from simple documentation chatbots to agentic workflows capable of performing complex, multi-step tasks like design creation, verification, and library characterization. These agents are intended to enhance engineering productivity by roughly 50%. A panel of industry experts met at DAC to discuss… Read More
How Agentic AI Turns IC Engineers into Architects
There is an interesting article by Kexun ZHang of ChipAgents on their blogsite. This is a company to watch, absolutely. Here is my take on it:
Software engineering has already demonstrated the trajectory of agentic AI. Coding tools progressed from autocomplete to systems that interpret requests, inspect repositories, modify… Read More
Keysight ADS Enables First-Pass Silicon at 3 THz for AttoTude
AttoTude has expanded its use of Keysight Technologies’ Advanced Design System (ADS) to support an integrated-circuit design flow spanning signaling frequencies from 100 GHz to 3 THz. The company reports that the resulting workflow has reduced IC development cycles by more than 50%, enabling projects to move from concept to… Read More
Follow the Money – Agentrys Raises $24.5 Million to Build Agentic Design Automation
Agentrys recently launched a new category of design technology, Agentic Design Automation (ADA). The approach promises to revolutionize AI deployment for chip design with technology that facilitates the building of targeted agentic design flows that get better with every run. There is a lot of information available on the … Read More


Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry