The semiconductor world is gathering at DAC 62, and ChipAgents AI is coming ready to show why agentic AI is the missing piece in modern RTL design and verification. Whether you’re drowning in terabytes of waveform data, grinding toward 100% functional coverage, or hunting for ways to accelerate time-to-market, our sessions and… Read More
Electronic Design Automation
Anirudh Fireside Chats with Jensen and Lip-Bu at CadenceLIVE 2025
Anirudh (Cadence President and CEO) had two fireside chats during CadenceLIVE 2025, the first with Jensen Huang (Founder and CEO of NVIDIA) to kick off the show, and later in the day with Lip-Bu Tan (CEO of Intel). Of course Jensen and Lip-Bu also turn up for other big vendor shows but I was reminded that there is something special about… Read More
TCAD for 3D Silicon Simulation
Semiconductor fabs aim to have high yields and provide processes that attract design firms and win new design starts, but how does a fab deliver their process nodes in a timely manner without having to run lots of expensive silicon through the line? This is where simulation and TCAD tools come into play, and to learn more about this… Read More
Breker Verification Systems at the 2025 Design Automation Conference
Breker Verification Systems Plans Demonstrations of its Complete Synthesis and SystemVIP Library and Solutions Portfolio
Attendees who step into the Breker Verification Systems booth during DAC (Booth #2520—second floor) will see demonstrations of its Trek Test Suite Synthesis and SystemVIP libraries and solutions portfolio.… Read More
The SemiWiki 62nd DAC Preview
After being held in San Francisco since the pandemic the beloved Design Automation Conference will be on the move again. In 2026 DAC will be held in Huntington Beach. For you non-California natives, Huntington Beach is a California city Southeast of Los Angeles. It’s known for surf beaches and its long Huntington Beach Pier.… Read More
Synopsys Addresses the Test Barrier for Heterogeneous Integration
The trend is clear, AI and HPC is moving to chiplet-based, or heterogenous design to achieve the highest levels of performance, while traditional monolithic system-on-chip (SoC) designs struggle to scale. What is also clear is the road to this new design style is not a smooth one. There are many challenges to overcome. Some are … Read More
Anirudh Keynote at CadenceLIVE 2025 Reveals Millennium M2000
Another content-rich kickoff covering a lot of bases under three main themes: the new Millennium AI supercomputer release, a moonshot towards full autonomy in chip design exploiting agentic AI, and a growing emphasis on digital twins. Cadence President and CEO Anirudh Devgan touched on what is new today, and also market directions… Read More
Design-Technology Co-Optimization (DTCO) Accelerates Market Readiness of Angstrom-Scale Process Technologies
Design-Technology Co-Optimization (DTCO) has been a foundational concept in semiconductor engineering for years. So, when Synopsys referenced DTCO in their April 2025 press release about enabling Angstrom-scale chip designs on Intel’s 18A and 18A-P process technologies, it may have sounded familiar—almost expected. … Read More
Optimizing an IR for Hardware Design. Innovation in Verification
Intermediate representations (IRs) between high level languages (C++, AI, etc.) and machine language are both commonplace (witness LLVM) and a continuing active area of research. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford,… Read More
WEBINAR: PCIe 7.0? Understanding Why Now Is the Time to Transition
PCIe is familiar to legions of PC users as a high-performance enabler for expansion slots, especially GPU-based graphics cards and M.2 SSDs. It connects higher-bandwidth networking adapters and niche applications like system expansion chassis in server environments. Each PCIe specification generation has provided a leap… Read More
Relaxation-Aware Programming in ReRAM: Evaluating and Optimizing Write Termination