semiwiki webinar 800x100
WP_Term Object
(
    [term_id] => 157
    [name] => EDA
    [slug] => eda
    [term_group] => 0
    [term_taxonomy_id] => 157
    [taxonomy] => category
    [description] => Electronic Design Automation
    [parent] => 0
    [count] => 4420
    [filter] => raw
    [cat_ID] => 157
    [category_count] => 4420
    [category_description] => Electronic Design Automation
    [cat_name] => EDA
    [category_nicename] => eda
    [category_parent] => 0
    [is_post] => 
)

Siemens Reveals Agentic Questa

Siemens Reveals Agentic Questa
by Bernard Murphy on 03-05-2026 at 6:00 am

Questa Agentic

There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More


Functional Safety Analysis of Electronic Systems

Functional Safety Analysis of Electronic Systems
by Daniel Payne on 03-04-2026 at 10:00 am

hyperlynx ams

Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More


Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems

Building the Interconnect Foundation: Bump and TSV Planning for Multi-Die Systems
by Kalar Rajendiran on 03-03-2026 at 10:00 am

UCIe bump planning in 3DIC Compiler Platform

The first article in this series examined how feasibility exploration (hyperlink to SemiWiki first article) enables architects to evaluate multi-die system configurations while minimizing early design risk. Once architectural decisions are validated, designers must translate conceptual connectivity requirements … Read More


WEBINAR: Two-Part Series on RF Power Amplifier Design

WEBINAR: Two-Part Series on RF Power Amplifier Design
by Don Dingee on 03-03-2026 at 6:00 am

VNA inspired simulated load pull setup for RF power amplifier design

At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave and sub-THz frequencies introduce… Read More


How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI

How Customized Foundation IP Is Redefining Power Efficiency and Semiconductor ROI
by Kalar Rajendiran on 02-26-2026 at 10:00 am

chip design for blog

As computing expands from data centers to edge devices, semiconductor designers face increasing pressure to optimize both performance and energy efficiency. Advanced process nodes continue to provide transistor-level improvements, but scaling alone cannot meet the demands of hyperscale AI infrastructure or ultra-low-power… Read More


Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering

Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
by Daniel Nenni on 02-25-2026 at 8:00 am

1 abhijeet chakraborty chiplet summit keynote 2026

At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More


An Agentic Formal Verifier. Innovation in Verification

An Agentic Formal Verifier. Innovation in Verification
by Bernard Murphy on 02-25-2026 at 6:00 am

Innovation New

In a break from our academic-centric picks, here we look at an agentic verification flow developed within a semiconductor company. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A) and I continue our series on research ideas.… Read More


Siemens to Deliver Industry-Leading PCB Test Engineering Solutions

Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
by Daniel Nenni on 02-24-2026 at 8:00 am

Siemens Acquires ASTER Technologies to Deliver Industry Leading PCB Test Engineering Solutions

Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More


Agentic EDA Panel Review Suggests Promise and Near-Term Guidance

Agentic EDA Panel Review Suggests Promise and Near-Term Guidance
by Bernard Murphy on 02-24-2026 at 6:00 am

Massive AI datacenter

NetApp recently hosted a webinar on Agentic AI as the future for EDA and implications for infrastructure. Good list of panelists including Mahesh Turaga (VP Cadence Cloud) with an intro preso on infrastructure and agentic AI at Cadence, then our own Dan Nenni (Mr. SemiWiki) moderating, Khaled Heloue (Fellow AMD, CAD CAD/Methodology/AI),… Read More