Systems-in-package (SIPs) with 2.5D and 3D heterogenous integration, consisting of multiple dies and chiplets deliver 10x more functionality than traditional monolithic chips. This capability enables innovative solutions for diverse needs in scientific computing, automotive, edge computing, and aerospace/defense.… Read More
Electronic Design Automation
Podcast EP351: A Detailed Overview of the Emerging Standards for 400G with Kent Lusted
Daniel is joined by Kent Lusted, a Distinguished Architect at Synopsys and an integral part of the company’s Ethernet IP design team. He has been an active contributor and member of the IEEE 802.3 Ethernet PHY standards development leadership team for more than 15 years. Prior to Synopsys, Kent worked at Intel for 30+ years, focused… Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced Nodes
One of the most difficult things to do in life is ask for help. This is inherently a big problem in the semiconductor industry dating back to the IDM days where silos of secrecy were established. As a result Intel has struggled with yield since the 14nm FinFET process nodes.
On the outside PDF Solutions is a publicly traded semiconductor… Read More
Webinar: Faster Design Spec to Implementation using IP-XACT
As SoC design flows grow increasingly complex, IP-XACT has become a cornerstone standard throughout the entire development lifecycle: from architecture specification to design assembly and verification. Its growing adoption is reflected in the standard’s continuous evolution, from the 2009 release through 2014… Read More
Feed Forward Intelligence: Enabling Testability in the Chiplets Era
The semiconductor industry is entering a new era in which advanced packaging and chiplets-based architectures are becoming the primary drivers of system-level innovation. As traditional process-node scaling becomes increasingly complex and expensive, manufacturers are turning to heterogeneous integration, combining… Read More
Synopsys Unifies Electrical, Thermal, Mechanical, and Optical Analysis with Multiphysics Fusion Solutions
Synopsys has announced the availability of the first wave of its Multiphysics Fusion Solutions, extending its vision of a unified engineering environment that connects EDA, semiconductor physics, system simulation, and artificial intelligence-driven optimization. The announcement addresses one of the most significant… Read More
PowerArtist RTL Power Estimation Folds into Keysight
Back in the late 1990s, Sente launched a product called WattWatcher to estimate power from design RTL and simulation activity. This was revolutionary for its time since alternatives, while very accurate, only offered power analysis at the gate level. Gate-level analysis is great for fine-tuning power but is unhelpful for achieving… Read More
GPU-native mask rule checking eliminates the curvilinear mask rule check bottleneck
As semiconductor manufacturing pushes toward advanced nodes with tighter feature sizes, the optical proximity correction (OPC) workflow is adopting curvilinear masks to achieve the larger process windows that traditional Manhattan geometries cannot deliver.
Traditional Manhattan masks constrain shapes to vertical … Read More
Agentic AI and the Future of Chip Design: From Productivity Tool to Engineering Partner
Highlights from a recent panel session moderated by Ed Sperling (Semiconductor Engineering) featuring Walden Rhines (Silvaco), Vincent Wong (Verific), Dave Kelf (Breker Verification Systems), Shelly Henry (MooresLab AI), Ann Wu (Silimate), and Cindy Cui (ChipAgents). The panel session was hosted by Electronic System … Read More
How llmda.ai Coaxed Me Out of Retirement, an Interview with Kurt Shuler
Arteris is one of the most impressive companies SemiWiki has worked with over the last fifteen years. We have collaborated on one hundred and seventy-three articles/podcasts that have garnered more than two million views/listens. The success of Arteris can be easily tracked to the executive team and Kurt Shuler was the executive… Read More


Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume Fabs