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CEO Interview with Nagesh Gupta of llmda.ai

CEO Interview with Nagesh Gupta of llmda.ai
by Daniel Nenni on 05-15-2026 at 6:00 am

Nagesh Gupta of llmda ai

Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor.

He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory interface generators for Xilinx designs and was later acquired by … Read More


The “New Shift-Left”: Why FPGA Prototyping is the Ultimate RISC-V IP Sandbox

The “New Shift-Left”: Why FPGA Prototyping is the Ultimate RISC-V IP Sandbox
by Daniel Nenni on 05-14-2026 at 10:00 am

Cover pic

In the EDA world, “Shift-Left” has traditionally been a mantra for early software development—booting the OS before the silicon even leaves the fab. But as the RISC-V revolution accelerates, the goalposts have moved. We are seeing the emergence of a “New Shift-Left”, one that focuses on critical architectural… Read More


Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design

Beyond Tool Interoperability: The Emerging Governed Convergence Problem in Semiconductor Design
by Moh Kolb on 05-12-2026 at 10:00 am

Beyond Tool Interoperability The Emerging Governed Convergence Problem in Semiconductor Design

The semiconductor industry has spent decades optimizing tools. Today, however, the central challenge is no longer whether individual tools are powerful enough. The real question is whether increasingly specialized tools, domains, models, and organizations can still converge coherently into a manufacturable, reliable,… Read More


IPLM: Future Forward Webinar May 19th

IPLM: Future Forward Webinar May 19th
by Daniel Nenni on 05-12-2026 at 6:00 am

ads iplm semiwiki future forward 400x400@2x

Step into the future of semiconductor design management with IPLM: Future Forward, a product-led webinar showcasing the latest developments in Perforce IPLMThis focused session is designed to show how modern teams can tackle growing design complexity while still accelerating innovation.

Hosted by IPLM… Read More


From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past

From Point Solutions to Agentic AI Ecosystems: Semiconductor Process Control Depends on Its Past
by Kalar Rajendiran on 05-11-2026 at 10:00 am

Agentic AI Natural Language Interaction with Analytics

Agentic AI is often presented as a revolutionary shift in semiconductor manufacturing, driven by large language models and generative AI. However, this framing overlooks an important reality: today’s advances are built on decades of prior work. As Jonathan Holt of PDF Solutions emphasizes in his recent keynote at the APCM 2026Read More


CEO Interview with Dave Kelf, CEO of Breker Verification Systems

CEO Interview with Dave Kelf, CEO of Breker Verification Systems
by Daniel Nenni on 05-08-2026 at 6:00 am

David Kelf Headshot

In the functional verification space, Breker Verification Systems stands out for its vast and long-standing understanding and ability to solve many of the seemingly intractable complexity challenges, especially in the system space.

I recently talked with Dave Kelf, Breker’s CEO, who has plenty of good news to share about Breker’s… Read More


The Great Divide: A Tale of Three Hardware Emulation Architectures

The Great Divide: A Tale of Three Hardware Emulation Architectures
by Lauro Rizzatti on 05-06-2026 at 10:00 am

A Tale of Three Hardware Emulation Architectures

Hardware emulation arose as a necessity out of the needs of the eighties. By the mid-1980s, semiconductor designs had outgrown the practical limits of gate-level simulation. Gate-level simulation delivered accuracy, but at glacial pace; silicon prototypes performed at real-speed but arrived far too late. The industry needed… Read More


A Different Angle on Co-Simulation for Systems

A Different Angle on Co-Simulation for Systems
by Bernard Murphy on 05-06-2026 at 6:00 am

FMI use cases

Co-simulation, two or more simulations running concurrently in some manner, is not a new idea. I have written before about multiphysics systems able to model thermal, stress, CFD and other factors simultaneously. I just read a white paper from Siemens based on a different method, using an open standard called the Functional Mockup… Read More


Synopsys and TSMC Deepen AI Design Alliance: What It Means

Synopsys and TSMC Deepen AI Design Alliance: What It Means
by Kalar Rajendiran on 05-05-2026 at 10:00 am

Synopsys Powering the next generation of AI

A recent announcement from Synopsys signals a meaningful escalation in the race to build next-generation AI hardware. The expanded collaboration between Synopsys and TSMC brings together silicon-proven IP, AI-driven design tools, and cutting-edge manufacturing processes in a tightly integrated effort to accelerate high-performance… Read More


Siemens U2U 3D IC Design and Verification Panel

Siemens U2U 3D IC Design and Verification Panel
by Daniel Nenni on 05-05-2026 at 6:00 am

IMG 1201

Given the success of the event in Silicon Valley last week, I would expect the Siemens U2U event in Munich to be even bigger. In my experience this has been the best user driven event in 2026 with the deepest customer content. EDA has always been a customer driven industry and it is good to see us recognize that from time to time. Kalar … Read More