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AI-EDA Agents Can Prove Their Value

AI-EDA Agents Can Prove Their Value
by Moh Kolb on 10-04-2026 at 8:00 am

Ai EDA AGENT VALUE SEMIWIKI SEPT30

Before EDA becomes AI-native, focused agents have a window to prove measurable engineering value inside existing design flows.

AI is entering semiconductor engineering from several directions at once.

Some companies are building broad agentic design environments. Others are attacking specific bottlenecks: timing closure,… Read More


Podcast EP370: An Overview of PDF Solution’s New AI Platform and Upcoming CONNECT Event with Kimon W. Michaels

Podcast EP370: An Overview of PDF Solution’s New AI Platform and Upcoming CONNECT Event with Kimon W. Michaels
by Daniel Nenni on 10-02-2026 at 12:00 pm

Daniel is joined by Kimon W. Michaels, a prominent figure in the semiconductor industry, currently serving as the Executive Vice President of Products and Solutions at PDF Solutions, Inc. He co-founded the company and has held various leadership roles, including Vice President of Design for Manufacturability since June 2007.… Read More


TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies

TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies
by Mike Gianfagna on 10-02-2026 at 8:00 am

TSMC OIP 2026 Emerging Technologies Alley

 

The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.

And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.… Read More


OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design Matters

OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design Matters
by Daniel Nenni on 10-01-2026 at 8:00 am

Synopsys OpenAI

Wow, OpenAI and Synopsys just announced a multiyear partnership to develop GPT-Synopsys, a specialized artificial intelligence model for semiconductor design. The agreement combines OpenAI’s frontier models with Synopsys’ electronic design automation software and engineering expertise. Its ambition is to help engineers… Read More


Quantum Equivalence Checking. Innovation in Verification

Quantum Equivalence Checking. Innovation in Verification
by Bernard Murphy on 09-30-2026 at 6:00 am

Innovation New

Can quantum computing have any relevance to EDA? This month’s paper suggests it might have a role someday, in accelerating one of the most fundamental of EDA algorithms: SAT. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More


Why Advanced Chip Packaging Is Becoming a Design Problem

Why Advanced Chip Packaging Is Becoming a Design Problem
by Daniel Nenni on 09-29-2026 at 2:00 pm

Why Advanced Chip Packaging Is Becoming a Design Problem

As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More


Managing Power, Performance and Reliability in the Chiplet Era

Managing Power, Performance and Reliability in the Chiplet Era
by Kalar Rajendiran on 09-29-2026 at 10:00 am

Test Drivers proteanTecs (Chiplet Webinar)

Next-gen AI accelerators, high-performance processors, and complex computing architectures depend heavily on advanced packaging. Bringing multiple dies, chiplets, high-bandwidth memory, and advanced interconnects together into a single 2.5D or 3D package yields massive performance gains. However, this design evolution… Read More


Siemens and TSMC push AI deeper into chip design

Siemens and TSMC push AI deeper into chip design
by Daniel Nenni on 09-29-2026 at 8:00 am

Siemens and TSMC push AI deeper into chip design

Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More


Agentic AI Can Reach GDS. What Must It Prove Before Engineers Trust It for Tapeout?

Agentic AI Can Reach GDS. What Must It Prove Before Engineers Trust It for Tapeout?
by Moh Kolb on 09-29-2026 at 6:00 am

AgentiC AI SemiWIKI sept21

Agentic AI is beginning to move semiconductor engineering beyond copilots and isolated task automation.

From Agentrys’ public material and recent discussion, its architecture points toward a broader engineering flow:

Specification → RTL → verification → synthesis / physical design → PPA optimization → physical verification… Read More


LLM-assisted schematic test-report analysis and root-cause investigation

LLM-assisted schematic test-report analysis and root-cause investigation
by Admin on 09-28-2026 at 10:00 am

schematic report workflow white (1)

By Piyush Bag

Intro: In this AI era, building data centers has become crucial not just for hyperscalers, but for many companies as well, as they build the infrastructure for AI. At a high level, a data center includes compute, storage, networking, and other infrastructure. This article is about the design lifecycle of network hardware.… Read More