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WEBINAR: Functional ECO Solution for Mixed-Signal ASIC Design

WEBINAR: Functional ECO Solution for Mixed-Signal ASIC Design
by Daniel Nenni on 08-22-2025 at 6:00 am

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This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs.

The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More


Taming Concurrency: A New Era of Debugging Multithreaded Code

Taming Concurrency: A New Era of Debugging Multithreaded Code
by Admin on 08-21-2025 at 10:00 am

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As modern computing systems evolve toward greater parallelism, multithreaded and distributed architectures have become the norm. While this shift promises increased performance and scalability, it also introduces a fundamental challenge: debugging concurrent code. The elusive nature of race conditions, deadlocks, Read More


Perforce Webinar: Can You Trust GenAI for Your Next Chip Design?

Perforce Webinar: Can You Trust GenAI for Your Next Chip Design?
by Mike Gianfagna on 08-21-2025 at 6:00 am

Perforce Webinar Can You Trust GenAI for Your Next Chip Design?

GenAI is certainly changing the world. Every day there are new innovations in the use of highly trained models to do things that seemed impossible just a short while ago. As GenAI models take on more tasks that used to be the work of humans, there is always a nagging concern about accuracy and bias. Was the data used to train the model … Read More


A Principled AI Path to Spec-Driven Verification

A Principled AI Path to Spec-Driven Verification
by Bernard Murphy on 08-20-2025 at 6:00 am

NLP versus LLM choice min

I have seen a flood of verification announcements around directly reading product specs through LLM methods, and from there directly generating test plans and test suite content to drive verification. Conceptually automating this step makes a lot of sense. Carefully interpreting such specs even today is a largely manual task,… Read More


448G: Ready or not, here it comes!

448G: Ready or not, here it comes!
by Kalar Rajendiran on 08-19-2025 at 6:00 am

448G Host Channel Topologies Analyzed

The march toward higher-speed networking continues to be guided by the same core objectives as has always been : increase data rates, lower latency, improve reliability, reduce power consumption, and maintain or extend reach while controlling cost. For the next generation of high-speed interconnects, these requirements … Read More


PDF Solutions and the Value of Fearless Creativity

PDF Solutions and the Value of Fearless Creativity
by Mike Gianfagna on 08-18-2025 at 6:00 am

PDF Solutions and the Value of Fearless Creativity

PDF Solutions has been around for over 30 years. The company began with a focus on chip manufacturing and yield. Since the beginning, PDF Solutions anticipated many shifts in the semiconductor industry and has expanded its impact with enhanced data analytics and AI. Today, the company’s impact is felt from design to manufacturing,… Read More


Moving Beyond RTL at #62DAC

Moving Beyond RTL at #62DAC
by Daniel Payne on 08-14-2025 at 10:00 am

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Hardware designers have been using RTL and hardware description languages since the 1980s, yet many attempts at moving beyond RTL have tried to gain a foothold. At the #62DAC event I spent some time with Mike Fingeroff, the Chief High-Level Synthesis Technologist to understand what his company Rise Design Automation is up to. … Read More


Streamlining Functional Verification for Multi-Die and Chiplet Designs

Streamlining Functional Verification for Multi-Die and Chiplet Designs
by Daniel Nenni on 08-14-2025 at 6:00 am

Streamlining Functional Verification for Multi Die and Chiplet Designs

As multi-die and chiplet-based system designs become more prevalent in advanced electronics, much of the focus has been on physical design challenges. However, verification—particularly functional correctness and interoperability of inter-die connections—is just as critical. Interfaces such as UCIe or custom interconnects… Read More


S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China

S2C Advances RISC-V Ecosystem, Accelerating Innovation at 2025 Summit China
by Daniel Nenni on 08-13-2025 at 10:00 am

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Shanghai, July 19, 2025 — S2C, a leader in functional verification, showcased its latest digital EDA solutions and key partnerships with BOSC, Xuantie, and Andes Technology at RISC-V Summit China 2025, highlighting its contributions to the ecosystem. The company also played a leading role in the EDA sub-forum, with VP Ying… Read More


Chiplets and Cadence at #62DAC

Chiplets and Cadence at #62DAC
by Daniel Payne on 08-12-2025 at 10:00 am

SoC Cockpit Concept min

Using chiplets is an emerging trend well-covered at #62DAC and they even had a dedicated Chiplet Pavilion, so I checked out the presentation from Dan Slocombe, Design Engineering Architect in the Compute Solutions Group at Cadence. In a short 20 minutes Dan managed to cover a lot of ground, so this blog will summarize the key  points.… Read More