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CTO Interview with Dr. Zakir Syed of ClockEdge

CTO Interview with Dr. Zakir Syed of ClockEdge
by Daniel Nenni on 10-12-2026 at 12:00 pm

Photo Zakir

Dr. Zakir Syed is Co-founder and Chief Technology Officer of ClockEdge, where he has played a central role in developing specialized simulation technology for advanced semiconductor clock networks. He brings more than 30 years of experience in electronic design automation and semiconductor verification. He joined Simplex… Read More


Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP

Overcoming the Edge AI Power Wall with Low-Voltage Foundation IP
by Kalar Rajendiran on 10-12-2026 at 8:00 am

Voltage Regions and Impact of Voltage Scaling

As artificial intelligence (AI) workloads migrate to endpoint hardware, edge AI devices face immense pressure to deliver real-time inference within highly restrictive power and thermal envelopes. Traditional silicon scaling no longer yields the power-density returns it once did. To compensate, engineering teams are turning… Read More


Keysight Advances its Design Software with Agentic AI

Keysight Advances its Design Software with Agentic AI
by Daniel Nenni on 10-12-2026 at 6:00 am

AI Orchestrates RF Circuit Design

Keysight Technologies is opening a new route for artificial intelligence into radio frequency engineering. Announced on October 6, 2026, its latest software capabilities let engineers connect their own AI agents and large language models to Advanced Design System (ADS) 2027. Agents can help generate and optimize circuits,… Read More


Podcast EP373: The Impact of yieldHUB Live and Details of Upcoming Show Participation with Gillian O’Donnell

Podcast EP373: The Impact of yieldHUB Live and Details of Upcoming Show Participation with Gillian O’Donnell
by Daniel Nenni on 10-09-2026 at 10:00 am

Daniel is joined by Gillian O’Donnell, Director of Growth at yieldHUB, the enterprise yield management platform trusted by semiconductor and photonics manufacturers worldwide. She leads business development, marketing, PR, and partnerships, with a particular focus on yieldHUB Live, the company’s real-time… Read More


The silent killer of analog reliability: Why SPICE misses floating net

The silent killer of analog reliability: Why SPICE misses floating net
by Admin on 10-08-2026 at 6:00 am

87450 fig1 top level odo schematic

By Bhanu Pandey

The semiconductor industry is currently facing a significant challenge in functional verification. According to the most recent Wilson Research Group / Siemens EDA Functional Verification Study, first-silicon success rates have hit a historic low, with nearly 68% of designs requiring two or more spins. While… Read More


Wilson Survey Signals Need for New Understanding of Verification Success

Wilson Survey Signals Need for New Understanding of Verification Success
by Bernard Murphy on 10-07-2026 at 6:00 am

Siemens Wilson first silicon success

Siemens has again sponsored a Wilson-led survey on the state of (functional) verification in the industry, and this time Harry Foster (Chief Scientist, Verification at Siemens) has condensed his major takeaways from the report. These are intriguing – particularly an apparent revolutionary change in first-silicon trends.… Read More


Podcast EP372: An Overview of Some Important New Sessions at Semicon West with Julie Rogers

Podcast EP372: An Overview of Some Important New Sessions at Semicon West with Julie Rogers
by Daniel Nenni on 10-07-2026 at 4:00 am

Daniel is joined by Julie Rogers, Executive Director, ESD Alliance. Julie brings deep expertise in industry collaboration, technical conferences, and executive engagement. She brings more than 30 years of experience driving growth, visibility, and alignment across complex, highly technical markets. She is widely recognized… Read More


Beyond the Die: Verifying the Connected Chip

Beyond the Die: Verifying the Connected Chip
by Daniel Nenni on 10-06-2026 at 10:00 am

Efficient, Scalable Methodology for Reliability and ESD Verification of Complex 3D IC CoWoS Systems

One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published more than 150 blogs… Read More


From Faster Proofs to Trusted Silicon with LUBIS EDA

From Faster Proofs to Trusted Silicon with LUBIS EDA
by Daniel Nenni on 10-06-2026 at 6:00 am

LUBIS FormalOS in the Verification Flow

LUBIS EDA is introducing FormalOS, a platform designed to make formal verification more systematic, scalable and predictable. Built on the company’s five-stage methodology, it combines structured workflows, verification playbooks, automation, reusable verification assets and sign-off evidence within customers’ existing… Read More


Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman

Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman
by Daniel Nenni on 10-06-2026 at 4:00 am

Daniel is joined by John Bruggeman, Chief Marketing Officer at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.

Daniel discusses How Vinci fits into the hardware… Read More