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Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Siemens Provides a Complete 3D IC Solution with Innovator3D IC
by Mike Gianfagna on 06-27-2024 at 6:00 am

Siemens Provides a Complete 3D IC Solution with Innovator3D IC

Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More


Novelty-Based Methods for Random Test Selection. Innovation in Verification

Novelty-Based Methods for Random Test Selection. Innovation in Verification
by Bernard Murphy on 06-26-2024 at 6:00 am

Innovation New

Coverage improvement effectiveness through randomized testing declines as total coverage improves. Attacking stubborn holes in coverage could be augmented through learned novel test guidance to random test selection. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former… Read More


Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure

Synopsys’ Strategic Advancement with PCIe 7.0: Early Access and Complete Solution for AI and Data Center Infrastructure
by Kalar Rajendiran on 06-25-2024 at 6:00 am

(From NewsRelease)Synopsys PCIe 7.0 IP Solution Infographic

In the rapidly evolving world of high-performance computing (HPC) and artificial intelligence (AI), technological advancements must keep pace with increasing demands for speed, efficiency, and security. Synopsys recently announced the industry’s first complete PCIe 7.0 IP solution. This groundbreaking initiative addresses… Read More


Mirabilis Design at the 2024 Design Automation Conference

Mirabilis Design at the 2024 Design Automation Conference
by Deepak Shankar on 06-18-2024 at 10:00 am

DAC 2024 Banner

This is the first time in 28 years of my visits to DAC that I have seen so many different technologies arrive at DAC in the same year.  Earlier we would have one or possibly two innovative breakthroughs in semiconductors and embedded systems that emerged at DAC. This year I expect six or may be seven to arrive, and I am not including the… Read More


PrimisAI at the 2024 Design Automation Conference

PrimisAI at the 2024 Design Automation Conference
by Daniel Nenni on 06-18-2024 at 8:00 am

DAC 2024 Banner

PrimisAI is the premier destination for cutting-edge hardware design automation, offering engineers the ultimate companion with advanced Language-to-Code and Language-to-Verification capabilities. Our interactive AI assistant swiftly addresses complex hardware challenges across the entire design stack, from concept… Read More


Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions

Synopsys-AMD Webinar: Advancing 3DIC Design Through Next-Generation Solutions
by Kalar Rajendiran on 06-13-2024 at 10:00 am

The Synopsys Multi Die Solution

Introduction of 2.5D and 3D multi-die based products are helping extend the boundaries of Moore’s Law, overcoming limitations in speed and capacity for high-end computational tasks. In spite of its critical function within the 3DIC paradigm, the interposer die’s role and related challenges are often neither fully comprehended… Read More


INTERVIEW: Bluespec RISC-V soft cores in Achronix FPGAs

INTERVIEW: Bluespec RISC-V soft cores in Achronix FPGAs
by Don Dingee on 06-13-2024 at 6:00 am

Achronix Bluespec partnership highlights

Recently, a partnership between Achronix and Bluespec has been in the news. Bluespec RISC-V processors are available as soft cores in a Speedster®7t FPGA on Achronix’s VectorPath® PCIe development card or in a standalone Speedster7t FPGA. We spoke with executives from Achronix and Bluespec about the impetus for this effort … Read More


Automotive Autonomy’s Quiet Advance Through Radar

Automotive Autonomy’s Quiet Advance Through Radar
by Bernard Murphy on 06-12-2024 at 6:00 am

Car radar wireframe min

Given false starts and OEM strategic retreats you could be forgiven for thinking that the autonomous personal car dream is now a lost cause. But that’s not quite true. While moonshot goals have been scaled back or are running under wraps, applications continue to advance, for adaptive cruise control, collision avoidance, automatic… Read More


Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures

Driving Data Frontiers: High-Performance PCIe® and CXL® in Modern Infrastructures
by Kalar Rajendiran on 06-10-2024 at 10:00 am

Alphawave Ecosystem Collaborative Partners

The increasing demands of data-intensive applications necessitate more efficient storage and memory utilization. The rapid evolution of AI workloads, particularly with Generative AI (GenAI), demands infrastructure that can adapt to diverse computational needs. AI models vary widely in resource requirements, necessitating… Read More


Blank Wafer Suppliers are not Totally Blank

Blank Wafer Suppliers are not Totally Blank
by Claus Aasholm on 06-09-2024 at 8:00 am

Sand to Semiconductors

AI requires more Silicon capacity
Deep in the supply chain, some wizards turn sand into perfect diamond-structured crystal disks of silicon, which are necessary for the entire semiconductor supply chain.

They are part of the semiconductor supply chain, making Silicon Sand almost a thousand times more valuable.

The glimmer … Read More