The automotive industry is undergoing a major transformation. The convergence of electrification, connectivity, driver-assistance technologies, and software-defined vehicles has led to the rise of use of advanced System-on-Chips (SoCs) that drive unprecedented levels of functionality and performance. However, this… Read More
How Intel, Samsung and TSMC are Changing the World
Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore. Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More
Semico Research Quantifies the Business Impact of Deep Data Analytics, Concludes It Accelerates SoC TTM by Six Months
The semiconductor industry has been responding to increasing device complexity and performance requirements in multiple ways. To create smaller and more densely packed components, the industry is continually advancing manufacturing technology. This includes the use of new materials and processes, such as extreme ultraviolet… Read More
Maintaining Vehicles of the Future Using Deep Data Analytics
So much has changed over the recent couple of decades in what constitutes an automobile. Gone are the days when it was essentially an electro-mechanical product, used for just personal transportation. Over the years, it has evolved to adding in-cabin infotainment, tele and data communications, driving assistance, all the way… Read More
Webinar: The Data Revolution of Semiconductor Production
How Advancements in Technology Unlock New Insights
The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production.
Join us on Tuesday, March … Read More
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
From the multi-chip-modules (MCM) of yester years to today’s System-in-Package (SiP) implementations, things have progressed a lot in terms of package technology. The chiplet movement is not only a big beneficiary of today’s advanced package technologies but drives further advances in this technology area. While a chiplets-based… Read More
proteanTecs Technology Helps GUC Characterize Its GLink™ High-Speed Interface
An earlier post on SemiWiki discussed how deep data analytics helps accelerate SoC product development. The post presented insights into proteanTecs’ technology and quantified the benefits that can be derived by leveraging the software platform for SoC product development. You can review that earlier blog here. The power … Read More
Elevating Production Testing with proteanTecs and Advantest’s ACS Edge™ Platforms
SemiWiki recently posted a blog on “Deep Data Analytics for Accelerating SoC Product Development.” That blog focused on proteanTecs’ AI-enabled chip analytics platform that helps accelerate SoC product development. The blog provided insight into proteanTecs’ approach and shared quantifiable business-impact metrics … Read More
How Deep Data Analytics Accelerates SoC Product Development
Ever since the birth of the semiconductor industry, advances have always been at a fast pace. The complexity of SoCs have grown along the way, driven by the demanding computational and communication needs of various market applications. Over the last decade, the growth in complexity has accelerated at unforeseen rates, fueled… Read More
CEO Interview: Shai Cohen of proteanTecs
Shai Cohen is an entrepreneur and industry veteran, with vast experience in building technology companies from the ground up. He is a co-founder and CEO of proteanTecs, which develops revolutionary Universal Chip Telemetry™ for electronic systems throughout their entire lifecycle. Prior to founding proteanTecs, Shai co-founded… Read More
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