PDF Solutions has been around for over 30 years. The company began with a focus on chip manufacturing and yield. Since the beginning, PDF Solutions anticipated many shifts in the semiconductor industry and has expanded its impact with enhanced data analytics and AI. Today, the company’s impact is felt from design to manufacturing,… Read More
Streamlining Functional Verification for Multi-Die and Chiplet Designs
As multi-die and chiplet-based system designs become more prevalent in advanced electronics, much of the focus has been on physical design challenges. However, verification—particularly functional correctness and interoperability of inter-die connections—is just as critical. Interfaces such as UCIe or custom interconnects… Read More
XTCO: From Node Scaling to System Scaling
imec XTCO (Cross-Technology Co-Optimization) is the natural successor to DTCO and STCO in an era where no single layer of the stack can deliver scaling alone. Instead of optimizing devices, interconnect, packaging, architecture, and software in isolation, XTCO treats them as one tightly coupled system with a shared budget … Read More
From Two Dimensional Growth to Three Dimensional DRAM
Epitaxial stacks of silicon and silicon germanium are emerging as a key materials platform for three dimensional dynamic random access memory. Future DRAM will likely migrate from vertical channels to horizontally stacked channels that resemble the gate all around concept in logic. That shift demands a starter material made… Read More
Synopsys Webinar – Enabling Multi-Die Design with Intel
As we all know, the age of multi-die design has arrived. And along with it many new design challenges. There is a lot of material discussing the obstacles to achieve more mainstream access to this design architecture, and some good strategies to conquer those obstacles. Synopsys recently published a webinar that took this discussion… Read More
CoPoS is a Bigger Canvas for Chiplets and HBM
AI-Driven Verification: Transforming Semiconductor Design
In a DACtv session on July 9, 2025, Abhi Kolpekwar, Vice-President & General Manager at Siemens EDA, illuminated the transformative role of artificial intelligence (AI) in addressing the escalating challenges of semiconductor design verification. The presentation underscored the limitations of traditional methods… Read More
cHBM for AI: Capabilities, Challenges, and Opportunities
AI’s exponential growth is transforming semiconductor design—and memory is now as critical as compute. Multi-die architecture has emerged as the new frontier, and custom High Bandwidth Memory (cHBM) is fast becoming a cornerstone in this evolution. In a panel session at the Synopsys Executive Forum, leaders from AWS, Marvell,… Read More
Enabling the Ecosystem for True Heterogeneous 3D IC Designs
The demand for higher performance, greater configurability, and more cost-effective solutions is pushing the industry toward heterogeneous integration and 3D integrated circuits (3D ICs). These solutions are no longer reserved for niche applications—they are rapidly becoming essential to mainstream semiconductor design.… Read More
Scaling 3D IC Technologies – Siemens Hosts a Meeting of the Minds at DAC
3D IC was a very popular topic at DAC. The era of heterogeneous, multi-chip design is here. There were a lot of research results and practical examples presented. What stood out for me was a panel at the end of day two of DAC that was hosted by Siemens. This panel brought together an impressive group of experts to weigh in on what was really… Read More


Quantum Advantage is About the Algorithm, not the Computer