The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in … Read More
Author: Pawan Fangaria
Debugging Complex Embedded System – How Easy?
In today’s world of semiconductor design with SoCs having complex IPs, hardware and software working together on a single chip, it’s hard to imagine a system without embedded software into it. But it is easy to guess how difficult it would be to test that hardware and software embedded system. And often there is limited window of … Read More
Start With The End In Mind – For Complete & Fast Success!
There is always a rush to converge a semiconductor design toward faster closure, amid increasing divergent trends of multiple IPs and high complexities of various functionalities on a single chip. Every design house struggles hard to evolve its customized design flows with several short paths patched up to fix issues, global… Read More
MEMS in The World of ICs – How to Quickly Verify?
In the modern electronic world, it’s difficult to imagine any system working as a whole without MEMS (Micro-electromechanical Systems) such as pressure sensors, accelerometers, gyroscopes, microphones etc. working in sync with other ICs. Specifically in AMS (Analog Mixed-Signal) semiconductor designs, there can be significant… Read More
How to Simplify Complexities in Power Verification?
With multiple functionalities added into a single chip, be it a SoC or an ASIC, maintaining low power consumption has become critical for any design. Various techniques at the technology as well as design level are employed to accomplish the low power target. These include thinner oxides in transistors, different sections of … Read More
What Can Accelerate 3D Semiconductor Manufacturing?
In the beginning of this decade there was a lot of buzz around 3D chip manufacturing. Many EDA tools were developed to facilitate semiconductor designs in 3D space. Naturally, we are moving to the edge on 2D without much room to further squeeze transistors and interconnect. However, lately I haven’t heard much about 3D products.… Read More
Cadence Grows VIP Business – What’s New?
VIPs (Verification IPs) are really important in this complex world of SoCs which involve various IPs, interfaces and continuously evolving protocols and standards, thus making the task of verifying an overall system extremely challenging. And the verification must be done in minimum possible run-time and memory consumption.… Read More
ST Endorses PowerArtist with ARM Cores & FDSOI libs
It was an interesting webinar I attended, presented by STMicroelectronicson how they are benefited in power saving and thermal dissipation by using FDSOI technology and also by using PowerArtist in their design. So, it’s an advantage from both sides – semiconductor technology and semiconductor design tool. It’s worth attending… Read More
How to Quickly Optimize BEOL Process at Your Desk?
Engineers are always looking to improve the efficiency of how they work, but don’t want to sacrifice accuracy in the process. This is true in the world of semiconductor process development, where traditional build-and-test cycles are both time and resource intensive. But what if there was a way to do certain steps in a ‘virtual’… Read More
Another Major Consolidation in Semiconductor Space!
This time it is between the suppliers of semiconductor manufacturing equipments. And they are among the top ranked global peers. Applied Materials Inc., holding the numero uno position in sales of chip manufacturing equipments in 2012, agreed to acquire Tokyo Electron Ltd, the third in that ranking. Gary Dickerson of Applied… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay