Dr. Walden Rhines has appeared many times on SemiWiki. His discussions touch on a variety of topics, most recently on the health of EDA and IP. His knowledge of our industry is substantial, and he always seems to have a new take on the trends and technologies that are unfolding around us. So, when Wally took the stage for a keynote address… Read More
Author: Mike Gianfagna
Wally Rhines Predicts the Future of AI at #60DAC
Altair’s Jim Cantele Predicts the Future of Chip Design
We all know chip design is changing in substantial ways and at a fast pace. The demands being placed on semiconductor systems are growing dramatically, and the innovation being delivered to address those demands is just as dramatic. Everyone seems to have an opinion on these trends, and a set of predications to make sense out of it… Read More
Intel Enables the Multi-Die Revolution with Packaging Innovation
The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
The Siemens Digital Industries Software View of AI and its Impact on System Design
The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen and how those technologies… Read More
TSMC Redefines Foundry to Enable Next-Generation Products
For many years, monolithic chips defined semiconductor innovation. New microprocessors defined new markets, as did new graphics processors, and cell-phone chips. Getting to the next node was the goal, and when the foundry shipped a working part victory was declared. As we know, this is changing. Semiconductor innovation is… Read More
PCI-SIG DevCon and Where Samtec Fits
PCIe (peripheral component interconnect express) is an interface standard for connecting high-speed components contained in PCs, MACs and other types of processors. Think graphics, storage arrays, Wi-Fi and the like. This communication standard has become incredibly popular. The first version of the standard was released… Read More
Samtec Lights Up MemCon
Every conference and trade show that Samtec attends is better for the experience. Samtec has a way of bringing exciting and innovative demos and technical presentations to any event they attend. I personally have fond memories of exhibiting next to Samtec at an early AI Hardware Summit at the Computer History Museum in Mountain… Read More
Samtec Dominates DesignCon (Again)
Many technical shows have anchor tenants. Those are the companies that can be counted on to have a substantial booth presence, be active in the technical program and just pump life into the event at every turn. Samtec is that company for many shows around the world. And soon it will be time for them to work their magic at DesignCon in … Read More
Webinar: Flexible, Scalable Interconnect for AI HW System Architectures
Building next generation systems is a real balancing act. The high-performance computing demands presented by increasing AI an ML content in systems means there are increasing challenges for power consumption, thermal load, and the never-ending appetite for faster data communications. Power, performance, and cooling … Read More
Semifore is Supplying Pain Relief for Some World-Changing Applications
In a recent post, I discussed how Samtec is fueling the AI revolution. In that post, I talked about how smart everything seems to be everywhere, changing the way we work, the way we think about our health and ultimately improving life on the planet. These are lofty statements, but the evidence is growing that the newest wave of applications… Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing