Cyber attacks are top of mind for just about everyone these days. As massive AI data sets become more prevalent (and more valuable), data security is no longer “nice to have”. Rather, it becomes critical for continued online operation and success. The AI discussion is a double-edged sword as well. While AI enables many new and life-changing… Read More
Author: Mike Gianfagna
Webinar – CHERI: Fine-Grained Memory Protection to Prevent Cyber Attacks
Sarcina Teams with Keysight to Deliver Advanced Packages
All aspects of semiconductor design and manufacturing require collaboration across a global ecosystem. As complexity increases, so does the importance of good collaboration. This is especially true for advanced package design. Thanks to the movement to multi-die design, package development has become an incredibly difficult… Read More
How to Find and Fix Soft Reset Metastability
Most of us are familiar with the metastability problems that can be caused by clock domain crossings (CDC). Early static analysis techniques can flag these kinds of issues to ensure there are no surprises later. I spent quite a bit of time at Atrenta, the SpyGlass company, so I am very familiar with these challenges. Due to the demands… Read More
A Webinar with Silicon Catalyst, ST Microelectronics and an Exciting MEMS Development Contest
Most MEMS and sensor companies struggle to find an industrialization partner that can support early-stage research and help develop and transition unique concepts to high-volume production. The wrong partner means delays and increased development costs as the design moves between various facilities. Recently, Silicon … Read More
Synopsys Accelerates Innovation on TSMC Advanced Processes
We all know that making advanced semiconductors is a team sport. TSMC can innovate the best processes, but without the right design flows, communication schemes and verified IP it becomes difficult to access those processes. Synopsys recently announced some details on this topic. It covers a lot of ground. The graphic at the top… Read More
How Samtec Helps Achieve 224G PAM4 in the Real World
224 Gbps PAM4 gets attention for applications such as data center, AI/ML, accelerated computing, instrumentation and test and measurement. The question is how real is it and what are the challenges that need to be overcome to implement reliable channels at that data rate? If you wonder about these kinds of topics for your next design,… Read More
Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification
2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More
Webinar: Samtec and Achronix Expand AI in the Data Center
The performance demands of data centers continue to grow, driven to large degree by the ubiquitous use of complex AI algorithms. On April 25, Embedded Computing Design held an informative webinar on this topic. Two experts looked at the problem from the standpoint of processor architecture and communication strategies, which… Read More
Synopsys is Paving the Way for Success with 112G SerDes and Beyond
Data communication speeds continue to grow. New encoding schemes, such as PAM-4 are helping achieve faster throughput. Compared to the traditional NRZ scheme, PAM4 can send twice the signal by using four levels vs. the two used in NRZ. The diagram at the top of this post shows the how data density is increased. With progress comes… Read More
Analog Bits Continues to Dominate Mixed Signal IP at the TSMC Technology Symposium
The recent TSMC Technology Symposium in the Bay Area showcased the company’s leadership in areas such as solution platforms, advanced and specialty technologies, 3D enablement and manufacturing excellence. As always, the TSMC ecosystem was an important part of the story as well and that topic is the subject of this post. Analog… Read More
AI Bubble?