The automotive industry is on the brink of a revolutionary transformation, where predictive maintenance and monitoring are taking center stage. In a recent webinar panel session, industry experts delved into the challenges, current approaches, and future innovations surrounding the guarantee and extension of mission profiles.… Read More
Author: Kalar Rajendiran
Fail-Safe Electronics For Automotive
ReRAM Integration in BCD Process Revolutionizes Power Management Semiconductor Design
Weebit Nano, a leading developer of advanced memory technologies, recently announced a significant collaboration with DB HiTek, one of the top ten foundries of the world. The collaboration is designed to enable integration of Weebit’s Resistive Random-Access Memory (ReRAM) into DB HiTek’s 130nm Bipolar-CMOS-DMOS… Read More
Unleashing the 1.6T Ecosystem: Alphawave Semi’s 200G Interconnect Technologies for Powering AI Data Infrastructure
In the rapidly evolving landscape of artificial intelligence (AI) and data-intensive applications, the demand for high-performance interconnect technologies has never been more critical. Even the 100G Interconnect is already not fast enough for infrastructure applications. AI applications, with their massive datasets… Read More
Automated Constraints Promotion Methodology for IP to Complex SoC Designs
In the world of semiconductor design, constraints are essentially specifications and requirements that guide the implementation of a specific hardware or software component within a larger system. They dictate timing, area, power, performance, and of course functionality of a design, playing a crucial role in ensuring that… Read More
UCIe InterOp Testchip Unleashes Growth of Open Chiplet Ecosystem
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
Improving Wafer Quality and Yield with UPW Resistivity and TOC Measurements
An earlier SemiWiki post discussed water sustainability in semiconductor manufacturing, related challenges and solutions. Whether first time use or recycled use, water purity needs to meet certain stringent criteria for the processing task on hand. This article will look at it from a wafer quality and yield perspective and… Read More
Rugged Security Solutions For Evolving Cybersecurity Threats
Secure-IC is a global leader in end-to-end cybersecurity solutions, specializing in the domain of embedded systems and connected devices. With an unwavering commitment to pushing the boundaries of security innovation, Secure-IC has established a remarkable track record. Its credentials include active involvement in new… Read More
A Complete Guidebook for PCB Design Automation
Printed Circuit Boards (PCBs) are the foundation of modern electronics, and designing them efficiently is complex. Design automation and advanced PCB routing have transformed the process, making it faster and more reliable. Design automation streamlines tasks, reduces errors, and ensures consistency. Advanced PCB routing… Read More
Synopsys 224G SerDes IP’s Extensive Ecosystem Interoperability
Hyperscale data centers are evolving rapidly to meet the demands of high-bandwidth, low-latency applications, ranging from AI and high-performance computing (HPC) to telecommunications and 4K video streaming. The increasing need for faster data transfer rates has prompted a scaling of Ethernet from 51Tb/s to 100Tb/s. Numerous… Read More
Navigating Edge AI Architectures: Power Efficiency, Performance, and Future-Proofing
The surge in Edge AI applications has propelled the need for architectures that balance performance, power efficiency, and flexibility. Architectural choices play a pivotal role in determining the success of AI processing at the edge, with trade-offs often necessary to meet the unique demands of diverse workloads. There are… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay