Achronix Next-Gen FPGAs Now Shipping

Achronix Next-Gen FPGAs Now Shipping
by Kalar Rajendiran on 05-04-2021 at 6:00 am

1980s to Now Market Changes

Earlier in April, Achronix made a product announcement with the headline “Achronix Now Shipping Industry’s Highest Performance Speedster7t FPGA Devices.” The press release drew attention to the fact that the 7nm Speedster®7t AC7t1500 FPGAs have started shipping to customers ahead of schedule. In the complex product world… Read More


Using eFPGA to Dynamically Adapt to Changing Workloads

Using eFPGA to Dynamically Adapt to Changing Workloads
by Kalar Rajendiran on 04-22-2021 at 10:00 am

Dynamic Reconfig Not New Why Now FlexLogix

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets

Die-to-Die Interface PHY and Controller Subsystem for Next Generation Chiplets
by Kalar Rajendiran on 04-19-2021 at 10:00 am

Comparison of D2D PHY and XSR SerDes OpenFive

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


Enabling Next Generation Silicon In Package Products

Enabling Next Generation Silicon In Package Products
by Kalar Rajendiran on 04-15-2021 at 10:00 am

System on Package Motivation AlphaWave IP

In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More


VersionVault EDA Integration: A Differentiated Value Solution

VersionVault EDA Integration: A Differentiated Value Solution
by Kalar Rajendiran on 03-31-2021 at 10:00 am

Capabilities and Benefits from Integration

HCL Technologies is a large, well-established multi-national company with an annual revenue of around $10B and worldwide employee count of well over 150K. They provide valuable solutions to about 20 different industries and related market segments. Over the years, I have had first hand insights to their semiconductor design… Read More


Library Characterization: A Siemens Cloud Solution using AWS

Library Characterization: A Siemens Cloud Solution using AWS
by Kalar Rajendiran on 03-29-2021 at 10:00 am

Characterization Runtime Chart

Pressing demands on compute speeds, storage capacity and rapid access to data are not new to the semiconductor industry. A desire for access to on-demand computing resources have always been there. During pre-cloud-computing era, companies provisioned on-demand compute capacity by procuring high performance computing … Read More


Upcoming Webinar on Resistive RAM (ReRAM) Technology

Upcoming Webinar on Resistive RAM (ReRAM) Technology
by Kalar Rajendiran on 03-21-2021 at 10:00 am

eMemory RRAM Webinar Semiwiki

On-chip memory (embedded memory) makes computing applications run faster. In the early days of the semiconductor industry, the desire to utilize large amount of on-chip memory was limited by cost, manufacturing difficulties and technology mismatches between logic and memory circuit implementations. Since then, advancements… Read More


Delivering True Wireless Stereo (TWS) Experience

Delivering True Wireless Stereo (TWS) Experience
by Kalar Rajendiran on 03-16-2021 at 10:00 am

Cropped Picture Purchase Criteria when choosing wireless headphones or earbuds

A recent blog about the Hearables market covered how expansive and far reaching the product opportunities promise to be. Of course, consumer purchase criteria will drive the product realizations, adoptions and consequently the market success of each of these envisioned products.­ Whether it is the earbud product or one of those… Read More


Hearables: From Earbuds to Life Augmentation and Beyond

Hearables: From Earbuds to Life Augmentation and Beyond
by Kalar Rajendiran on 03-09-2021 at 10:00 am

Hearables Market Players Source IDTechEx Research

As the months of 2020 passed by, I started noticing more and more people sporting what looked like fashionable ear accessories. I’m of course referring to True Wireless Stereo (TWS) earbuds. With the rapid increase in online meetings due to social distancing requirements, it appeared that adoption of TWS earbuds was even faster… Read More


Maximizing ASIC Performance through Post-GDSII Backend Services

Maximizing ASIC Performance through Post-GDSII Backend Services
by Kalar Rajendiran on 03-04-2021 at 6:00 am

Panel 1 Alchip – HPC ASIC Manufacturing Done Your Way 1030x579 1

ASICs by definition are designed to meet the respective applications’ requirements. ASIC engineers deploy various design techniques to maximize performance, minimize power and reduce chip size. But is there more that can be done after the GDSII is taped out? A recent press release from Alchip Technology dated Feb 4, 2021 claims… Read More