Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression. Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More
Author: Kalar Rajendiran
How System Companies are Re-shaping the Requirements for EDA
As the oldest and largest EDA conference, the Design Automation Conference (DAC) brings the best minds together to present, discuss, showcase and debate the latest and greatest advances in EDA. It accomplishes this in the form of technical papers, talks, company booths, product pavilions and panel discussions.
A key aspect … Read More
Embedded Logic-NVM Solutions for Al Chips
Last month, eMemory Technology hosted a webinar titled “eMemory’s Embedded Logic-NVM Solution for AI Chips.” While the purpose was to present their embedded Logic-NVM solution, the webinar nicely sets the stage by highlighting Analog NVM’s value as it relates to neural networks. Of course, the algorithms of neural networks… Read More
Cliosoft and Microsoft to Collaborate on the RAMP Program
We have all heard of many advanced technological inventions and products from the defense sector that subsequently got commercialized. While most of the Defense Advanced Research Projects Agency (DARPA) projects are classified secrets, many military innovations have had great influence in the commercial sector in the fields… Read More
A User View of Efabless Platform: Interview with Matt Venn
A few months ago, SemiWiki published an interview of Mike Wishart, CEO of Efabless. That interview provided insights into Efabless vision and its platform strategy. If you haven’t already read that post, please refer to it for background details. In essence, Efabless is about democratization of chip design and manufacturing.… Read More
Delivering Systemic Innovation to Power the Era of SysMoore
With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More
More Than Moore and Charting the Path Beyond 3nm
The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More
PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions
We live in the age of big data. No matter how fast and complex modern SoCs are, it all comes down to how quickly data can get in and out that determines the system performance. And, there is a lot of data that today’s systems need to process. Naturally, system interfaces such as PCIe, DDR, HBM, etc., have been evolving rapidly too, to support… Read More
Performance, Power and Area (PPA) Benefits Through Intelligent Clock Networks
One of the sessions at the Linley Fall Processor Conference 2021 was the SoC Design session. With a horizontal focus, it included presentations of interest to a variety of different market applications. The talk by Mo Faisal, CEO of Movellus, caught my attention as it promises to solve a chronic issue relating to synchronizing … Read More
Effectively Managing Large IP Portfolios For Complex SoC Projects
In today’s world, no IC design is completed without instantiating a few or many pre-verified or already proven intellectual property (IP) blocks. With break-neck pace at which chip designs are advancing, many IP blocks may even be entire chip designs from earlier product releases. Third-party IP market has been growing at a healthy… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay