Upcoming Webinar: 3DIC Design from Concept to Silicon

Upcoming Webinar: 3DIC Design from Concept to Silicon
by Kalar Rajendiran on 01-26-2022 at 10:00 am

Lessons from Existing Multi Die Solutions

Multi-die design is not a new concept. It has been around for a long time and has evolved from 2D level integration on to 2.5D and then to full 3D level implementations. Multiple driving forces have led to this progression.  Whether the forces are driven by market needs, product needs, manufacturing technology availability or EDA… Read More


How System Companies are Re-shaping the Requirements for EDA

How System Companies are Re-shaping the Requirements for EDA
by Kalar Rajendiran on 01-24-2022 at 10:00 am

Panelists and Cadence Moderator

As the oldest and largest EDA conference, the Design Automation Conference (DAC) brings the best minds together to present, discuss, showcase and debate the latest and greatest advances in EDA. It accomplishes this in the form of technical papers, talks, company booths, product pavilions and panel discussions.

A key aspect … Read More


Embedded Logic-NVM Solutions for Al Chips

Embedded Logic-NVM Solutions for Al Chips
by Kalar Rajendiran on 01-19-2022 at 8:00 pm

What is Analog NVM

Last month, eMemory Technology hosted a webinar titled “eMemory’s Embedded Logic-NVM Solution for AI Chips.” While the purpose was to present their embedded Logic-NVM solution, the webinar nicely sets the stage by highlighting Analog NVM’s value as it relates to neural networks. Of course, the algorithms of neural networks… Read More


Cliosoft and Microsoft to Collaborate on the RAMP Program

Cliosoft and Microsoft to Collaborate on the RAMP Program
by Kalar Rajendiran on 01-06-2022 at 6:00 am

Cliosoft RAMP SemiWiki

We have all heard of many advanced technological inventions and products from the defense sector that subsequently got commercialized. While most of the Defense Advanced Research Projects Agency (DARPA) projects are classified secrets, many military innovations have had great influence in the commercial sector in the fields… Read More


A User View of Efabless Platform: Interview with Matt Venn

A User View of Efabless Platform: Interview with Matt Venn
by Kalar Rajendiran on 01-04-2022 at 10:00 am

Matt Venn Photo from LinkedIn

A few months ago, SemiWiki published an interview of Mike Wishart, CEO of Efabless. That interview provided insights into Efabless vision and its platform strategy. If you haven’t already read that post, please refer to it for background details. In essence, Efabless is about democratization of chip design and manufacturing.… Read More


Delivering Systemic Innovation to Power the Era of SysMoore

Delivering Systemic Innovation to Power the Era of SysMoore
by Kalar Rajendiran on 12-28-2021 at 6:00 am

Evolving Landscape

With the slowing down of Moore’s law , the industry as a whole has been working on various ways to maintain the rate of growth and advancements. A lot has been written up about various solutions being pursued to address specific aspects. The current era is being referred to by different names, SysMoore being one that Synopsys uses.… Read More


More Than Moore and Charting the Path Beyond 3nm

More Than Moore and Charting the Path Beyond 3nm
by Kalar Rajendiran on 12-22-2021 at 10:00 am

Cadence AIML Technologies

The incredible growth that the semiconductor industry has enjoyed over the last several decades is attributed to Moore’s Law. While no one argues that point, there is also industry wide acknowledgment that Moore’s Law started slowing down around the 7nm process node. While die-size reductions still scale, performance jumps… Read More


PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions

PCIe 6.0, LPDDR5, HBM2E and HBM3 Speed Adapters to FPGA Prototyping Solutions
by Kalar Rajendiran on 12-15-2021 at 6:00 am

Avery PCIe Speed Adapter IP at Work

We live in the age of big data. No matter how fast and complex modern SoCs are, it all comes down to how quickly data can get in and out that determines the system performance. And, there is a lot of data that today’s systems need to process. Naturally, system interfaces such as PCIe, DDR, HBM, etc., have been evolving rapidly too, to support… Read More


Performance, Power and Area (PPA) Benefits Through Intelligent Clock Networks

Performance, Power and Area (PPA) Benefits Through Intelligent Clock Networks
by Kalar Rajendiran on 12-10-2021 at 10:00 am

4 What is Maestro ICN

One of the sessions at the Linley Fall Processor Conference 2021 was the SoC Design session. With a horizontal focus, it included presentations of interest to a variety of different market applications. The talk by Mo Faisal, CEO of Movellus, caught my attention as it promises to solve a chronic issue relating to synchronizing … Read More