The GSA IP Working Group will meet today in San Jose, and the Group has asked IPnest building a presentation dedicated to Interface IP. The timing was perfect, as I have just completed the “Interface IP Survey” version 5, and I was able to use fresh market data. The IP working group will discover the IP vendor ranking, protocol by protocol,… Read More
Author: Eric Esteve
History of SoC Interconnect Fabric
I just read this very interesting article posted by Kurt Shuler from Arteris, describing the “History of SoC Interconnect Fabric” and explaining why the SC industry needs an advanced approach, named the “fourth phase of the Interconnect Fabric history” in the article. Kurt’s point of view is that in the past the SoC interconnect… Read More
Interface PHY IP supporting Mobile Application on TSMC 20nm? Available!
If we check the many articles daily published in Semiwiki, I am sure that Moore’s Law has been mentioned every single day. There is a good reason why we constantly write about new technologies and advanced features like FinFet, FD-SOI, 450 mm wafers or double patterning: all of these are new challenges that the SC industry will have… Read More
Breaking news: Microsoft acquires Apple!
Despite the relative success of their latest smartphone, iPhone15s, the Cupertino firm had never been able to renew with the success of legendary iPhone5s, launched ten years ago, in 2011. As of today, we don’t know if Microsoft will keep iPhone and iPad product lines, or decide to provide these with a lethal injection…
Some history:… Read More
Searching an ADC (or DAC) at 28 nm may be such a burden…
If you have ever send a Request For Quotation (RFQ) for an ASIC including processor IP core, memories, Interfaces IP like PCIe, SATA or USB and Analog function like Analog to Digital Converter (ADC) or Digital to Analog Converter (DAC), you have discovered, like I did a couple of years ago, that these Analog functions may be the key… Read More
Did you miss Cadence’s MemCon?
That’s too bad, as you have missed latest news about the Hybrid Memory Cube (presentation by Micron), Wide I/O 2 standard, as well as other standards like LPDDR4, eMMC 5.0, and LRDIMM,the good news is that you may find all these presentations on MemCon proceedings web site.
I first had a look at Richard Goering excellent blog: wideI/O… Read More
Mobile SoC will benefit now from M-PCIe
We have already discussed the recently released M-PCIe ECN from PCI-SIG in Semiwiki at the end of 2012, but the new “standard” (in fact an Engineering Change from PCI-SIG and MIPI Alliance) was only real on paper, at that time. The upcoming webinar from Synopsys, M-PCIe: Utilizing Low-Power PCI Express in Mobile Designs, shows … Read More
NoC adoption surge at Chinese chip maker
The news from Arteris, Inc., announcing that “its interconnect fabric IP has been licensed and deployed in a majority of chips developed by China’s leading semiconductor companies for applications including consumer electronics, smartphones, and tablets,” is holding attention for several reasons. At first, because it’s… Read More
Why Every Smartphone OEM Want to Use Homemade GPU?
Smartphone shipment explosion and continuous growth is attracting always more OEM and chip makers, this is not really surprising, as the wireless market can be identified as the faster growing, and larger electronic segment ever seen. On such a mass market, the real question is “how to differentiate?” Apple is unique; just trying… Read More
Pre-verified, Integrated Sensor IP Subsystem?
Last year, I said that the launch of ARC based complete sound system IP by Synopsys ring the bell for the opening of a new IP market segment, the “Subsystem IP”. This week, Synopsys has announced the availability of the DesignWare® Sensor IP Subsystem, a complete and integrated hardware and software solution for sensor control applications.… Read More
More Headwinds – CHIPS Act Chop? – Chip Equip Re-Shore? Orders Canceled & Fab Delay