Barun Kar is CEO of Upscale AI. He is also the co-founder of Auradine and previously served as COO. Barun has over 25 years of experience leading R&D organizations to deliver disruptive products and solutions, resulting in multi-billion-dollar revenue. Barun was on the founding team at Palo Alto Networks and served as the … Read More
Author: Daniel Nenni
CEO Interview with Barun Kar of Upscale AI
Eric Xu’s Keynote at Huawei Connect 2025: Redefining AI Infrastructure
At Huawei Connect 2025, held in Shanghai, Eric Xu, the Rotating Chairman of Huawei, delivered a keynote speech that laid out the company’s ambitious roadmap for AI infrastructure, computing power, and ecosystem development. His speech reflected Huawei’s growing focus on building high-performance systems that can support… Read More
AI Revives Chipmaking as Tech’s Core Engine
A century ago, 391 San Antonio Road in Mountain View, California, housed an apricot-packing shed. Today, it’s marked by sculptures of diodes and a transistor, commemorating the 1956 founding of Shockley Semiconductor Laboratory—the birthplace of Silicon Valley. William Shockley, co-inventor of the transistor, aimed… Read More
Future Horizons Industry Update Webinar IFS 2025
The Future Horizons Industry Update Webinar, presented today by Malcolm Penn, provides a comprehensive analysis of the semiconductor industry’s current state and future trajectory. Founded in 1989, Future Horizons leverages over 300 man-years of experience, emphasizing impartial insights from facts (e.g., IMF … Read More
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
MediaTek’s first chipset using 2nm technology expected in late 2026
MediaTek, a global leader in fabless semiconductor design, has announced a groundbreaking achievement in its partnership with TSMC. The company has successfully developed a flagship system-on-chip (SoC) utilizing TSMC’s cutting-edge 2nm process technology,… Read More
Synopsys Announces Expanding AI Capabilities and EDA AI Leadership
In the fast-paced semiconductor industry Synopsys has redefined EDA with its Synopsys.ai Copilot, a generative AI tool. Since its launch in November 2023, and yes I was at the launch and very skeptical, Copilot has evolved to address the industry’s growing design complexity and projected 15-30% workforce gap by 2030. Let’s… Read More
Exploring Cycuity’s Radix-ST: Revolutionizing Semiconductor Security
Cycuity’s Radix-ST represents a groundbreaking advancement in semiconductor security, addressing the growing complexity and vulnerability of modern chip designs. Introduced on August 27, 2025, by Cycuity, Inc., Radix-ST leverages static analysis techniques to identify and resolve security weaknesses early in the chip… Read More
RANiX Employs CAST’s TSN IP Core in Revolutionary Automotive Antenna System
This press release from CAST announces a significant collaboration with RANiX Inc., highlighting the integration of CAST’s TSN Switch IP core into RANiX’s new Integrated Micro Flat Antenna System (IMFAS) SoC. This development underscores the growing adoption of Time-Sensitive Networking (TSN) in the automotive… Read More
TSMC 2025 Update: Riding the AI Wave Amid Global Expansion
Welcome to the second half of a very exciting year in semiconductors. While Intel and Samsung Foundry have made quite a few headlines, TSMC continues to execute flawlessly at 3nm and 2nm. With the TSMC OIP Ecosystem Forums starting later this month let’s take a look at how we got to where we are today.
Alchip’s 3DIC Test Chip: A Leap Forward for AI and HPC Innovation
Today Alchip Technologies, a Taipei-based leader in high-performance and AI computing ASICs, announced a significant milestone with the successful tape-out of its 3D IC test chip. This achievement not only validates Alchip’s advanced 3D IC ecosystem but also positions the company as a frontrunner in the rapidly evolving field… Read More








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