As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
Author: Daniel Nenni
The Chronicle of TSMC CoWoS
2026 Outlook with Shelly Henry of MooresLabAI
Tell us a little bit about yourself and your company.
I’m Shelly Henry, CEO and co-founder of MooresLabAI. After two decades of building chips for Xbox, HoloLens, and Azure, I reached a point where I knew the industry needed a reset. So I teamed up with fellow engineers, Shashank Chaurasia and Sirish Munipalli to create MooresLabAI—a… Read More
Weebit Nano Reports on 2025 Targets
In early January 2026, Weebit Nano Ltd. (ASX: WBT) released a comprehensive report detailing its performance against the 2025 commercial and technical targets the company had set at its 2024 Annual General Meeting. The announcement highlighted significant progress in both business development and technology qualification,… Read More
2026 Outlook with Steve Roddy of Quadric
Tell us a little bit about yourself and your company.
I am the Chief Marketing Officer at Quadric, where I have spent the past four years helping scale the company’s market presence and customer engagement. Quadric is a pure-play IP licensing company that has been operating for more than seven years. We specialize in a truly unique,… Read More
SiFive to Power Next-Gen RISC-V AI Data Centers with NVIDIA NVLink Fusion
In a strategic move that could reshape the future of AI data center design, SiFive, a leading developer of RISC-V processor IP and compute subsystems, has announced plans to integrate NVIDIA’s NVLink Fusion interconnect technology into its high-performance data center platforms. This collaboration bridges the open-architecture… Read More
2026 Outlook with Dave Hwang of Alchip
Dr. Dave Hwang joined Alchip in 2021 as General Manager of Alchip’s North America Business Unit. He also serves as Senior Vice President, Business Development. Prior to join Alchip, Dave served as Vice President, Worldwide Sales and Marketing for Global Unichip and in a variety of management and technical roles at TSMC.
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… Read MoreTSMC’s CoWoS® Sustainability Drive: Turning Waste into Wealth
In a significant example of how high-tech manufacturing can embrace environmental stewardship without compromising operational excellence, Taiwan Semiconductor Manufacturing Company has launched a sustainability initiative within its advanced packaging operations that both reduces waste and generates meaningful… Read More
2026 Outlook with Krishna Anne of Agile Analog
Tell us a little bit about yourself and your company.
I have worked in the global semiconductor industry for over 30 years, with major semiconductor companies such as Rambus, AMD and Broadcom, as well as with start-ups such as SCI Semiconductor and DataTrails. I started my career as a digital circuit designer, then moved into marketing,… Read More
CEO Interview with Dr. Heinz Kaiser of Schott
With over 25 years of experience in the specialty materials industry, Dr. Heinz Kaiser is a member of the Management Board of SCHOTT AG, responsible for High-Performance Materials and Flat Glass, while also heading Sales and Market Development, Sales Excellence, and Intellectual Property. With a strong engineering background… Read More
2026 Outlook with Ying J Chen of S2C
I’m Ying J Chen, VP of S2C. S2C is a leading global supplier of FPGA prototyping solutions for advanced SoC and ASIC designs, holding the second largest share of the global prototyping market. Founded in 2003, the company has supported more than 600 customers, including 11 of the top 25 semiconductor companies worldwide, with teams… Read More
Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era