Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in high-frequency… Read More
Author: Daniel Nenni
Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates
Advancing Automotive Memory: Development of an 8nm 128Mb Embedded STT-MRAM with Sub-ppm Reliability
The rapid evolution of automotive technology has intensified the demand for highly reliable, high-performance semiconductor memory solutions. Modern vehicles increasingly rely ADAS driving features, and complex infotainment platforms, all of which require memory that can operate flawlessly under extreme environmental… Read More
Memory Matters: Signals from the 2025 NVM Survey
Non-volatile memory choices are becoming more complex as SoC designs push into advanced nodes, and new requirements driven by AI, new sensor technologies and stringent quality standards.
The second annual 2025 NVM Survey, completed in December, captures a market that still hangs on established technologies but is increasingly… Read More
Akeana Partners with Axiomise for Formal Verification of Its Super-Scalar RISC-V Cores
Caspia Technologies Unveils A Breakthrough in RTL Security Verification Paving the Way for Agentic Silicon Security
In a significant advancement for the semiconductor industry, Caspia Technologies announced the broad availability of CODAx V2026.1, its flagship RTL security analyzer. The new release strengthens early-stage hardware security verification and positions the company to deliver fully agentic workflows that automate vulnerability… Read More
Designing the Future: AI-Driven Multi-Die Innovation in the Era of Agentic Engineering
At the 2026 Chiplet Summit, Synopsys presented a bold vision for the future of semiconductor innovation: AI-driven multi-die design powered by agentic intelligence. As the semiconductor industry shifts rapidly toward chiplet-based architectures and 3D stacking, the complexity of design, verification, and system integration… Read More
Siemens to Deliver Industry-Leading PCB Test Engineering Solutions
Siemens has strengthened its position in EDA and manufacturing by acquiring ASTER Technologies, a specialist in test and reliability solutions for printed circuit boards. The acquisition represents a strategic step in Siemens’ broader vision to deliver a fully integrated, end-to-end digital thread for electronics design,… Read More
Smarter ECOs: Inside Easy-Logic’s ASIC Optimization Engine
TSMC Process Simplification for Advanced Nodes
In the modern world, the semiconductor industry stands at the heart of technological innovation. From smartphones and laptops to advanced medical devices and artificial intelligence systems, nearly every piece of contemporary electronics depends on increasingly sophisticated microchips. Among the leading companies … Read More
CEO Interview with Juniyali Nauriyal of Photonect
Juniyali Nauriyal is the CEO and Co-Founder of Photonect, a photonics startup focused on commercializing advanced fiber-to-chip attachment technologies. Juniyali is the co-inventor of Photonect’s core technology, which forms the foundation of the company. As CEO, she leads Photonect in translating cutting-edge photonic… Read More









Things From Intel 10K That Make You Go …. Hmmmm