CEO Interview with Dr. Bernie Malouin Founder of JetCool and VP of Flex Liquid Cooling

CEO Interview with Dr. Bernie Malouin Founder of JetCool and VP of Flex Liquid Cooling
by Daniel Nenni on 10-17-2025 at 8:00 am

Bernie Malouin Headshot JetCool

Bernie Malouin is a technical professional with demonstrated experience from concept studies through system deployment. He has a strong track record working in dynamic environments, from highly complex, multi-million dollar development programs to deeply technical research projects. He founded JetCool Technologies … Read More


WEBINAR: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools

WEBINAR: Design and Stability Analysis of GaN Power Amplifiers using Advanced Simulation Tools
by Daniel Nenni on 10-16-2025 at 6:00 am

figure1

Why should high frequency circuit designers consider stability early in the design process? Isn’t there enough to worry about just making the circuit function at the fundamental frequency?

In the past, Microwave Engineers used to solve stability problems in the lab, perhaps adding bypassing or loss in a strategic location to… Read More


The 2025 Semi Industry Forum: On the Road to a $1 Trillion Industry

The 2025 Semi Industry Forum: On the Road to a $1 Trillion Industry
by Daniel Nenni on 10-13-2025 at 6:00 am

image (1)

The global semiconductor industry stands at a defining moment in its history. Having surpassed $600 billion in annual revenue, the path to a $1 trillion market is no longer a distant dream but an achievable milestone within the next decade. The annual 2025 Semi Industry Forum, organized by Silicon Catalyst, brings together the… Read More


Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools

Selling the Forges of the Future: U.S. Report Exposes China’s Reliance on Western Chip Tools
by Daniel Nenni on 10-12-2025 at 10:00 am

Employees are seen working on the final assembly of ASML's TWINSCAN NXE:3400B semiconductor lithography tool with its panels removed, in Veldhoven

The U.S. House Select Committee on the Strategic Competition Between the United States and the Chinese Communist Party released a bombshell report titled “Selling the Forges of the Future” on October 7, 2025, detailing how the People’s Republic of China is stockpiling semiconductor manufacturing equipment… Read More


Exploring TSMC’s OIP Ecosystem Benefits

Exploring TSMC’s OIP Ecosystem Benefits
by Daniel Nenni on 10-10-2025 at 6:00 am

TSMC Booth

Now that the dust has settled let’s talk more about TSMC’s Open Innovation Platform. Launched in 2008, OIP represents a groundbreaking collaborative model in the semiconductor industry. Unlike IDMs that controlled the entire supply chain, OIP fosters an “open horizontal” ecosystem uniting TSMC… Read More


The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role

The RISC-V Revolution: Insights from the 2025 Summits and Andes Technology’s Pivotal Role
by Daniel Nenni on 10-09-2025 at 8:00 am

block ad (2)

RISC-V  has emerged as a cornerstone of modern computing, offering an open-source alternative to proprietary designs like ARM and x86. Free from licensing fees and highly extensible, RISC-V powers everything from IoT devices to AI accelerators, with over 13 billion cores shipped globally. Annual RISC-V Summits, organized… Read More


Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®

Breaking the Thermal Wall: TSMC Demonstrates Direct-to-Silicon Liquid Cooling on CoWoS®
by Daniel Nenni on 10-08-2025 at 8:00 am

ETC 2025 TSMC

In a landmark presentation at the 2025 IEEE Electronic Components and Technology Conference (ECTC), TSMC unveiled a groundbreaking advancement in thermal management: Direct-to-Silicon Liquid Cooling integrated directly onto its CoWoS® platform. This innovation, detailed in the paper “Direct-to-Silicon LiquidRead More


How the Father of FinFETs Helped Save Moore’s Law

How the Father of FinFETs Helped Save Moore’s Law
by Daniel Nenni on 10-07-2025 at 8:00 am

Chenming Hu and Obama

In the early 2000s, Moore’s Law—the observation that the number of transistors on a chip doubles roughly every two years—was facing an existential crisis. As semiconductor nodes shrank below 90nm, planar transistors suffered from debilitating issues: leakage currents soared, power efficiency plummeted, and scaling became… Read More


Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award

Teradyne and TSMC: Pioneering the Future of Semiconductor Testing Through the 2025 OIP Partner of the Year Award
by Daniel Nenni on 10-06-2025 at 10:00 am

TSMC 3D Fabric Packaging TSMC OIP 2025

In a significant milestone for the semiconductor industry, Teradyne was honored as the 2025 TSMC Open Innovation Platform® Partner of the Year for TSMC 3DFabric® Testing. This award, announced on September 25, 2025, underscores the deep collaboration between Teradyne, a leader in automated test equipment and robotics, and… Read More


Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms

Sofics’ ESD Innovations Power AI and Radiation-Hardened Breakthroughs on TSMC Platforms
by Daniel Nenni on 10-06-2025 at 6:00 am

Sofics TSMC OIP 2025 SemiWiki

In the fast-evolving semiconductor landscape, electrostatic discharge (ESD) protection is pivotal for ensuring chip reliability amid shrinking nodes and extreme applications. Sofics, a Belgian IP provider specializing in ESD solutions for ICs, has cemented its leadership through strategic collaborations showcased … Read More